4 Bit PCI motherboard test card diagnosis card desktop fault test card

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

PCI PCIE LPC MiniPCI-E Analyzer Type B Diagnostic Card KQCPET6-V8 for PC Laptop Tester Android phone

KQCPET6-V8

Login to Download: Download software Use Tutorials Video

Highlights

? Fit for desktop computer and laptop.

? An advanced computer motherboard CPU ram hardware diagnostic test card with motherboards stability test feature

? Latest 4-in-1 version with LCD panel extension connector

? An extra nice feature of quick test of the computer system stability

? Can work with/without CPU/RAM on board

? Come with extra method (QG diagnosis) of testing the computers besides the traditional Bios POST code method

? Great for onsite technicians, computer admin and home/office personal uses

? Allows the users to test the hardware errors + testing the computer working stability in a matter of minute

Specifications

? This is an advanced PC device that is capable of testing the PC computers with different types of CPUs, including ALL series of previous and latest Intel / AMD / Cyrix CPUs

? It can test the components of computer main board working or not and test the initialization of the system hardware, such as: System Chipset, CPU Initialization and Registration, HDD Controllers, System Cache, Extended Memory RAM, Keyboard/Mouse Controller, Sound and LAN Controller, Video Memory and Controller etc

What is in the box

? 1 x Main Diagnostic Card

? 1 x USB Power Cable

? 1 x MiniPCI-E PCB. for Laptop

? 1 x Campal EC Cable

? 1 x LPC Fly Line

? 1 x English Manual

Note

? Please kindly note that it is suitable for PCI slot, PCIE, LPC and MiniPCIE

? Do not plug PCI-E interface to PCI or AGP or any other NON-PCI-E slot, it will damage the diagnostic card or computer when power supply is on

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description

Condition: new and original

Note : Due to post air mail can not send button battery (CR2032 ,3.2V) , so we will not send button battery , please you buy from your hometown. thank you so much !

Package includes:

1 * Tester (No English Manual)

Login to Download: * Complete code of diagnosis card User Manual

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

New laptop DDR2 lamp test instructions

Product synopsis:

This product for a generation notebook DDR2 test lamp upgrade the product, product comprehensive support laptop forward and reverse interface, it is to use leds light and destroy data to indicate the signals of opening address lines with short circuit, instead of traditional using a multimeter measurement method for them one by one, to repair it didn't turn on, don't show, don't read the fault of memory and so on the mainboard, maintenance is an essential tool notebook computer motherboard.

Instructions:

1, with the 3.3 V in tester (CR2032) battery, insert the corresponding notebook motherboard respectively the DDR2 memory each slot, mainboard don't have electricity, the bright and brightness lamp test consistent, signal lines that normal, if has the bright lights or very bright, indicating that this signal have open short-circuit fault, using a multimeter to further define the fault point. (note: all kinds of signals, because tester in each of the contractor the mainboard design and the different chipset, a part of the signal may show that the different, please maintenance personnel using the same motherboard control judge fault.)

2, memory pin the corresponding signal in the list below:

Pin

#

Front

Side

Pin

#

Back

Side

Pin

#

Back

Side

Pin

#

Back

Side

Pin

#

Back

Side

Pin

#

Back

Side

Pin

#

Back

Side

Pin

#

Back

Side

1

VREF

2

VSS

51

DQS2

52

DM2

101

A1

102

A0

151

DQ42

152

DQ46

3

VSS

4

DQ4

53

VSS

54

VSS

103

VDD

104

VDD

153

DQ43

154

DQ47

5

DQ0

6

DQ5

55

DQ18

56

DQ22

105

A10/AP

106

BA1

155

VSS

156

VSS

7

DQ1

8

VSS

57

DQ18

58

DQ23

107

BA0

108

/RAS

157

DQ48

158

DQ52

9

VSS

10

DM0

59

VSS

60

VSS

109

/WE

110

/S0

159

DQ49

160

DQ53

11

/DQS0

12

VSS

61

DQ24

62

DQ28

111

VDD

112

VDD

161

VSS

162

VSS

13

DQS0

14

DQ6

63

DQ25

64

DQ29

113

/CAS

114

ODT0

163

NC,TEST

164

CK1

15

VSS

16

DQ7

65

VSS

66

VSS

115

NC/S1

116

NC/A13

165

VSS

166

/CK1

17

DQ2

18

VSS

67

DM3

68

/DQS3

117

VDD

118

VDD

167

/DQS6

168

VSS

19

DQ3

20

DQ12

69

NC

70

DQS3

119

NC/ODT1

120

NC

169

DQS6

170

DM6

21

VSS

22

DQ13

71

VSS

72

VSS

121

VSS

122

VSS

171

VSS

172

VSS

23

DQ8

24

VSS

73

DQ26

74

DQ30

123

DQ32

124

DQ36

172

DQ50

174

DQ54

25

DQ9

26

DM1

75

DQ27

76

DQ31

125

DQ33

126

DQ37

175

DQ51

176

DQ55

27

VSS

28

VSS

77

VSS

78

VSS

127

VSS

128

VSS

177

VSS

178

VSS

29

/DQS1

30

CK0

79

33

CKE0

80

NC/CKE1

129

/DQS4

130

DM4

179

DQ56

180

DQ60

31

DQS1

32

/CK0

81

VDD

82

VDD

131

DQS4

132

VSS

181

DQ57

182

DQ61

33

VSS

34

VSS

83

NC

84

NC/A15

133

VSS

134

DQ38

183

VSS

184

VSS

35

DQ10

36

DQ14

85

NC/BA2

86

NC/14

135

DQ34

136

DQ39

185

DM7

186

/DQS7

37

DQ11

38

DQ15

87

VDD

88

VDD

137

DQ35

138

VSS

187

VSS

188

DQS7

39

ASS

40

VSS

89

A12

90

A11

139

VSS

140

DQ44

189

DQ58

190

VSS

41

VSS

42

VSS

91

A9

92

A7

141

DQ40

142

DQ45

191

DQ59

192

DQ62

43

DQ16

44

DQ20

93

A8

94

A6

143

DQ41

144

VSS

193

VSS

194

DQ63

45

DQ17

46

DQ21

95

VDD

96

VDD

145

VSS

146

/DQS5

195

SDA

196

VSS

47

VSS

48

VSS

97

A5

98

A4

147

DM5

148

DQS5

197

SCL

198

SA0

49

/DQS2

50

NC

99

A3

100

A2

149

VSS

150

VSS

199

VDDSPD

200

SA1

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: * Complete code of diagnosis card User Manual