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  • Categories: Other BGA Chips & ICs
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RICHTEK RT8058GQW CB WQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000217
€3.45

RICHTEK RT8058GQW CB= (WQFN

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Power supply ASUS 19V 21A 40W 25x07

Power supply ASUS 19V 2.1A [40W] 2,5x0,7

Input Voltage Range AC 100V - 240V Output DC 19V 2.1A

Connector Size 2.5mm*0.7mm Power 40W

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000798
€7.61

Power supply ASUS 19V 2.1A [40W] 2,5x0,7

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AO4304L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000221
€3.45

AO4304L

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Maxim MAX8730E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000222
€3.97

Maxim MAX8730E

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Lenovo Yoga 3 Pro Yoga 3 Pro1370 Only for Core i7 65W AC Adapter Charger

Tech Spec:

Product Description: AC Adapter - power adapter - 65 Watt

Device Type: Power adapter

Input voltage:100V-240V 50-60Hz

Output voltage: 20V

Output current: 3.25A

Power Capacity: 65W

Package Included:1 X AC Adapter, 1 X Power Cord

Compatibility:

- Model Number: ADL65WDA 5A10G68690; ADL65WDJ 5A10G68691; ADL65WDB 5A10G68680; ADL65WDD 5A10G68683; ADL65WDG 5A10G68685; ADL65WDE 5A10G68687; ADL65WDC 5A10G68671; ADL65WDH 5A10G68673; ADL65WLA 5A10G68677; ADL65WLB 5A10G68672; ADL65WLC 5A10G68675; ADL65WLD 5A10G68679; ADL65WLE 5A10G68684; ADL65WLF 5A10G68670; ADL65WLG 5A10G68674; ADL65WLH 5A10G68678.

- Yoga 3 Pro, Yoga 3 Pro-1370 (Only for Core i7)

- Yoga 3 14, Yoga 3-1470 (Only for Core i5, i7)

- Yoga 900

- Yoga 700 11, Yoga 700 14(Only for Core i3 i5)

Note: Not fit for Yoga 700 14 i7 Model

CH000870
€27.10

Lenovo Yoga 3 Pro Yoga 3 Pro-1370 (Only for Core i7) 65W AC Adapter Charger

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Winbond WPCE776SA0DG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000223
€6.35

Winbond WPCE776SA0DG

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Intersil ISL6261

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000232
€3.45

Intersil ISL6261

RICHTEK RT8058GQW CB WQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000217
€3.45

RICHTEK RT8058GQW CB= (WQFN

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Power supply ASUS 19V 21A 40W 25x07

Power supply ASUS 19V 2.1A [40W] 2,5x0,7

Input Voltage Range AC 100V - 240V Output DC 19V 2.1A

Connector Size 2.5mm*0.7mm Power 40W

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000798
€7.61

Power supply ASUS 19V 2.1A [40W] 2,5x0,7

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Compare

AO4304L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000221
€3.45

AO4304L

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Maxim MAX8730E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000222
€3.97

Maxim MAX8730E

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Lenovo Yoga 3 Pro Yoga 3 Pro1370 Only for Core i7 65W AC Adapter Charger

Tech Spec:

Product Description: AC Adapter - power adapter - 65 Watt

Device Type: Power adapter

Input voltage:100V-240V 50-60Hz

Output voltage: 20V

Output current: 3.25A

Power Capacity: 65W

Package Included:1 X AC Adapter, 1 X Power Cord

Compatibility:

- Model Number: ADL65WDA 5A10G68690; ADL65WDJ 5A10G68691; ADL65WDB 5A10G68680; ADL65WDD 5A10G68683; ADL65WDG 5A10G68685; ADL65WDE 5A10G68687; ADL65WDC 5A10G68671; ADL65WDH 5A10G68673; ADL65WLA 5A10G68677; ADL65WLB 5A10G68672; ADL65WLC 5A10G68675; ADL65WLD 5A10G68679; ADL65WLE 5A10G68684; ADL65WLF 5A10G68670; ADL65WLG 5A10G68674; ADL65WLH 5A10G68678.

- Yoga 3 Pro, Yoga 3 Pro-1370 (Only for Core i7)

- Yoga 3 14, Yoga 3-1470 (Only for Core i5, i7)

- Yoga 900

- Yoga 700 11, Yoga 700 14(Only for Core i3 i5)

Note: Not fit for Yoga 700 14 i7 Model

CH000870
€27.10

Lenovo Yoga 3 Pro Yoga 3 Pro-1370 (Only for Core i7) 65W AC Adapter Charger

wishlist
Compare

Winbond WPCE776SA0DG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000223
€6.35

Winbond WPCE776SA0DG

wishlist
Compare

Intersil ISL6261

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000232
€3.45

Intersil ISL6261

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Compare
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