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  • Categories: Other BGA Chips & ICs
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RICHTEK RT8058GQW CB WQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000217
€3.45

RICHTEK RT8058GQW CB= (WQFN

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eDP Signal Universal Tester 22 Models Procedures Through All the eDP signal LCD screen

Use Tutorials Video: * Check

1. eDP signal LCD screen are suitable for computer maintenance personnel and staff often need to test random models, 22 kinds of built-in procedures, can test the market almost all the LCD EDP signal interface, compatibility is very strong, if you're not sure you need to use the screen which program can check the Internet, resolution

2. eDP signal LCD screen are super short circuit protection function, whether you are wrong with the wrong line line screen, screen, screen short circuit, do not regulate the operation of any reason, will not cause burning or burning, it will alarm, buzzer sound, you should tip off, to find the reasons and correct mistakes.

3. can not use computer testing, directly to the 12V power supply, you can test 14 different color screen, including red, green, blue, white, black, gray, purple, etc., enough to test the bad LCD screen of all phenomena.

Note: Apple MacBook LCD screen tester (Not suited.)

CH000456
€170.32

eDP Signal Universal Tester, 22 Models Procedures Through All the eDP signal LCD screen

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Multifunction Network Cable Tester Telephone Line Tracker Detector

Multifunction Network Cable Tester Telephone Line Tracker Detector

Description:

Rapidly identify the target wire among plenty of wires

Telephone wire, network cable and other electric wires scanning & finding

Locating target wire in wall without drilling

Network wire collation function:

According to 16 wire sequences, you can judge the characteristics of short

circuit, breaking circuit, open circuit and crossing

Auto scan mode rapidly test corresponding double

wisted cables (1,2,3,4,5,6,7,8 and G) to judge wrong connection, short/open circuit

Network wire sequence collation supports direct wire collation of operating switch

Continuity testing

This instrument set is an ideal tool for technicians in installation and maintenance of weak current systems such as communication line and comprehensive wiring circuit.

It is widely applicable to telephone systems, computer networks and other metal wire circuit and fields.

Specification:

The max working current: emitter: <=10mA; Receiver: <=30mA .

Signal output electric status: 8Vp-p .

Signal transmission format: multi-frequency impulse .

Distance of signal transmission: >=3km.

Power: 1604S 6F22 DC 9V battery (Not included)

Battery life: 50 hours continuously

Material: ABS plastic

Color: Red and Yellow (Random send)

Package Includes:

1 x Cable Transmitter

1 x Cable Receiver/Tracker

1 x RJ45 Cable

1 x RJ11 Cable

1 x Instruction manual

1 x Earphone

1 x Bag

CH000554
€21.76

Multifunction Network Cable Tester Telephone Line Tracker Detector

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AO4304L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000221
€3.45

AO4304L

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J2850 SR1LM Stencil Template

J2850 SR1LM Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000186
€6.22

J2850 SR1LM Stencil Template

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Hantek DSO5102P USB Storage Oscilloscope Oszilloskope 2 Channels 100MHz 1GSas

Buy Probe Accessories: * PP-80 PP-150 PP-200 PP-150 T3100 Probe Accessories

Product description

Feature:

100MHz bandwidths

1GSa/s Real Time sample rate

Large (7.0-inch) color display,WVGA(800x480)

Record length up to 40K

Trigger mode: edge/pulse width/line selectable video/slop/overtime etc.

USB host and device connectivity, standard

Multiple automatic measurements

Four math functions, including FFTs standard

Provides software for PC real-time analysis

VGA Optional

Specification:

Bandwidth: 100MHz

Channel: 2

Real-Time Sample: 1GSa/s

Equivalent Sample: 25GSa/s

Memory Depth: 40K

Rise Time: 5ns

Time Base Accuracy: 50ppm

Time Base Range: 8ns/div-40s/div

Input Impendance: 1MO

VOLTS/DIV Range: 2mV/div????5V/div

A/D Converter: 8 bit

Bandwidth Limit: 20MHz

Trigger Types: Edge, Video, Pulse, Slope, Over time, Alternative

Trigger Source: CH1, CH2, EXT, EXT/5, AC Line

Math: +,-,x,,FFT

Size: 313mm x 108mm x 142mm

Weight: 2.08KG

Standard Probe: PP90

Package including:

1 x DSO5102P Digital Oscilloscope

2 x Probes

1 x Power Line

1 x USB Cord

1 x CD

CH000561
€279.72

Hantek DSO5102P USB Storage Oscilloscope Oszilloskope 2 Channels 100MHz 1GSa/s

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Maxim MAX8730E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000222
€3.97

Maxim MAX8730E

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Winbond WPCE776SA0DG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000223
€6.35

Winbond WPCE776SA0DG

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LE82GM965 SLA5T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000188
€5.40

LE82GM965 SLA5T Stencil Template

RICHTEK RT8058GQW CB WQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000217
€3.45

RICHTEK RT8058GQW CB= (WQFN

wishlist
Compare

eDP Signal Universal Tester 22 Models Procedures Through All the eDP signal LCD screen

Use Tutorials Video: * Check

1. eDP signal LCD screen are suitable for computer maintenance personnel and staff often need to test random models, 22 kinds of built-in procedures, can test the market almost all the LCD EDP signal interface, compatibility is very strong, if you're not sure you need to use the screen which program can check the Internet, resolution

2. eDP signal LCD screen are super short circuit protection function, whether you are wrong with the wrong line line screen, screen, screen short circuit, do not regulate the operation of any reason, will not cause burning or burning, it will alarm, buzzer sound, you should tip off, to find the reasons and correct mistakes.

3. can not use computer testing, directly to the 12V power supply, you can test 14 different color screen, including red, green, blue, white, black, gray, purple, etc., enough to test the bad LCD screen of all phenomena.

Note: Apple MacBook LCD screen tester (Not suited.)

CH000456
€170.32

eDP Signal Universal Tester, 22 Models Procedures Through All the eDP signal LCD screen

wishlist
Compare

Multifunction Network Cable Tester Telephone Line Tracker Detector

Multifunction Network Cable Tester Telephone Line Tracker Detector

Description:

Rapidly identify the target wire among plenty of wires

Telephone wire, network cable and other electric wires scanning & finding

Locating target wire in wall without drilling

Network wire collation function:

According to 16 wire sequences, you can judge the characteristics of short

circuit, breaking circuit, open circuit and crossing

Auto scan mode rapidly test corresponding double

wisted cables (1,2,3,4,5,6,7,8 and G) to judge wrong connection, short/open circuit

Network wire sequence collation supports direct wire collation of operating switch

Continuity testing

This instrument set is an ideal tool for technicians in installation and maintenance of weak current systems such as communication line and comprehensive wiring circuit.

It is widely applicable to telephone systems, computer networks and other metal wire circuit and fields.

Specification:

The max working current: emitter: <=10mA; Receiver: <=30mA .

Signal output electric status: 8Vp-p .

Signal transmission format: multi-frequency impulse .

Distance of signal transmission: >=3km.

Power: 1604S 6F22 DC 9V battery (Not included)

Battery life: 50 hours continuously

Material: ABS plastic

Color: Red and Yellow (Random send)

Package Includes:

1 x Cable Transmitter

1 x Cable Receiver/Tracker

1 x RJ45 Cable

1 x RJ11 Cable

1 x Instruction manual

1 x Earphone

1 x Bag

CH000554
€21.76

Multifunction Network Cable Tester Telephone Line Tracker Detector

wishlist
Compare

AO4304L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000221
€3.45

AO4304L

wishlist
Compare

J2850 SR1LM Stencil Template

J2850 SR1LM Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000186
€6.22

J2850 SR1LM Stencil Template

wishlist
Compare

Hantek DSO5102P USB Storage Oscilloscope Oszilloskope 2 Channels 100MHz 1GSas

Buy Probe Accessories: * PP-80 PP-150 PP-200 PP-150 T3100 Probe Accessories

Product description

Feature:

100MHz bandwidths

1GSa/s Real Time sample rate

Large (7.0-inch) color display,WVGA(800x480)

Record length up to 40K

Trigger mode: edge/pulse width/line selectable video/slop/overtime etc.

USB host and device connectivity, standard

Multiple automatic measurements

Four math functions, including FFTs standard

Provides software for PC real-time analysis

VGA Optional

Specification:

Bandwidth: 100MHz

Channel: 2

Real-Time Sample: 1GSa/s

Equivalent Sample: 25GSa/s

Memory Depth: 40K

Rise Time: 5ns

Time Base Accuracy: 50ppm

Time Base Range: 8ns/div-40s/div

Input Impendance: 1MO

VOLTS/DIV Range: 2mV/div????5V/div

A/D Converter: 8 bit

Bandwidth Limit: 20MHz

Trigger Types: Edge, Video, Pulse, Slope, Over time, Alternative

Trigger Source: CH1, CH2, EXT, EXT/5, AC Line

Math: +,-,x,,FFT

Size: 313mm x 108mm x 142mm

Weight: 2.08KG

Standard Probe: PP90

Package including:

1 x DSO5102P Digital Oscilloscope

2 x Probes

1 x Power Line

1 x USB Cord

1 x CD

CH000561
€279.72

Hantek DSO5102P USB Storage Oscilloscope Oszilloskope 2 Channels 100MHz 1GSa/s

wishlist
Compare

Maxim MAX8730E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000222
€3.97

Maxim MAX8730E

wishlist
Compare

Winbond WPCE776SA0DG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000223
€6.35

Winbond WPCE776SA0DG

wishlist
Compare

LE82GM965 SLA5T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000188
€5.40

LE82GM965 SLA5T Stencil Template

wishlist
Compare
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