New laptop DDR3 lamp test instructions

Product synopsis:

This product for a generation notebook DDR3 test lamp upgrade the product, product comprehensive support laptop forward and reverse interface, it is to use leds light and destroy data to indicate the signals of opening address lines with short circuit, instead of traditional using a multimeter measurement method for them one by one, to repair it didn't turn on, don't show, don't read the fault of memory and so on the mainboard, maintenance is an essential tool notebook computer motherboard.

Instructions:

1, with the 3.3 V in tester (CR2032) battery, insert the corresponding notebook motherboard respectively of DDR3 memory each slot, mainboard don't have electricity, the bright and brightness lamp test consistent, signal lines that normal, if has the bright lights or very bright, indicating that this signal have open short-circuit fault, using a multimeter to further define the fault point. (note: all kinds of signals, because tester in each of the contractor the mainboard design and the different chipset, a part of the signal may show that the different, please maintenance personnel using the same motherboard control judge fault.)

2, memory pin the corresponding signal in the list below:

204-PIN SO-UDIMM PINOUT

204-Pin SO-UDIMM Front

204-Pin SO-UDIMM Back

Pin

Symbol

Pin

Symbol

Pin

Symbol

Pin

Symbol

Pin

Symbol

Pin

Symbol

Pin

Symbol

Pin

Symbol

1

VREFDQ

53

DQ19

105

VDD

157

DQ42

2

VSS

54

VSS

106

VDD

158

DQ46

3

VSS

55

VSS

107

A10/AP

159

DQ43

4

DQ4

56

DQ28

108

BA1

160

DQ47

5

DQ0

57

DQ24

109

BA0

161

VSS

6

DQ5

58

DQ29

110

/RAS

162

VSS

7

DQ1

59

DQ25

111

VDD

163

DQ48

8

VSS

60

VSS

112

VDD

164

DQ52

9

VSS

61

VSS

113

/WC

165

DQ49

10

/DQS0

62

/DQS3

114

/S0

166

DQ53

11

DMD

63

DM3

115

/CAS

167

VSS

12

DQS0

64

DQS3

116

ODT0

168

VSS

13

VSS

65

VSS

117

VDD

169

/DQS6

14

VSS

66

VSS

118

VDD

170

DM6

15

DQ2

67

DQ26

119

A13

171

DQS6

16

DQ6

68

DQ30

120

ODT1

172

VSS

17

DQ3

69

DQ27

121

/S1

173

VSS

18

DQ7

70

DQ31

122

NC

174

DQ54

19

VSS

71

VSS

123

VDD

175

DQ50

20

VSS

72

VSS

124

VDD

176

DQ55

21

DQ8

73

CKE0

125

TEST

177

DQ51

22

DQ12

74

CKE1

126

VREFCA

178

VSS

23

DQ9

75

VDD

127

VSS

179

VSS

24

DQ13

76

VDD

128

VSS

180

DQ60

25

VSS

77

NC

129

DQ32

181

DQ56

26

VSS

78

A15

130

DQ36

182

DQ61

27

/DQS1

79

BA2

131

DQ33

183

DQ57

28

DM1

80

A14

132

DQ37

184

VSS

29

DQS1

81

VDD

133

333

VSS

185

VSS

30

/RESET

82

VDD

134

VSS

186

/DQS7

31

VSS

83

A12VBC

135

/DQS4

187

DM7

32

VSS

84

A11

136

DM4

188

DQS7

33

DQ10

85

A6

137

DQS4

189

VSS

34

DQ14

86

A7

138

VSS

190

VSS

35

DQ11

87

VDD

139

VSS

191

DQ58

36

DQ15

88

VDD

140

DQ38

192

DQ52

37

VSS

89

A8

141

DQ34

193

DQ59

38

VSS

90

A4

142

DQ39

194

DQ53

39

DQ16

91

A5

143

DQ35

195

VSS

40

DQ20

92

A6

144

VSS

196

VSS

41

DQ17

93

VDD

145

VSS

197

SA0

42

DQ21

94

VDD

146

DQ44

198

/EVENT

43

VSS

95

A3

147

DQ40

199

VDDSPD

44

VSS

96

A2

148

DQ45

200

SDA

45

/DQS2

97

A1

149

DQ41

201

SA1

46

DM2

98

A0

150

VSS

202

SCL

47

DQS2

99

VDD

151

VSS

203

VTT

48

VSS

100

VDD

152

/DQS5

204

VTT

49

VSS

101

CK0

153

DM5

50

DQ22

102

CK1

154

DQS5

51

DQ18

103

/CK0

155

VSS

52

DQ23

104

/CK1

156/DQ

VSS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N16E-GT-A1 GTX970M

Part Number N16E-GT-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 105 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

In package included:

1pcs Hirose 12 Cable
1pcs Hirose 30 Cable 
1pcs Molex 30 Cable  
1pcs RT809 Programmer
1pcs User manual

You can select shipping option in checkout:  Economy or Expedited 

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Compatible:

A1398 820-00138 emc 2909
A1398 820-00163 emc 2910
A1398 820-00426 emc 2910
A1534 820-00045 emc 2746
A1534 820-00244 emc 2991
A1534 820-00687 emc 3099
A1502 820-4924   emc 2835
A1465 820-00164 emc 2924
A1466 820-00165 emc 2925
A1466 820-00165 emc 3178
A1706 820-00239 emc 3071
A1706 820-00923 emc 3163
A1707 820-00281 emc 3072
A1707 820-00928 emc 3162
A1708 820-00840 emc 3164
A1708 820-00875 emc 2978
A1708 820-00361

A1283 EMC 2264 820-2366  A1283 EMC 2336 820-XXXX
A1304 EMC XXXX 820-2375
A1347 EMC 2364 820-2577 A1347 EMC 2442 820-2993  A1347 EMC 2442 820-3059 A1347 EMC 2442 820-3017
A1347 EMC 2570 820-3227 A1347 EMC XXXX 820-3228 A1347 EMC 2840 820-5509
A1369 EMC 2392 820-2838 A1369 EMC 2469 820-3023
A1370 EMC 2393 820-2796 A1370 EMC XXXX 820-2955 A1370 EMC 2471 820-3024
A1398 EMC 2512 820-3332 A1398 EMC 2673 820-3332
A1398 EMC 2746 820-3662 A1398 EMC 2876 820-3662
A1398 EMC 2745 820-3787 A1398 EMC 2881 820-3787
A1425 EMC 2512 820-3462
A1465 EMC 2558 820-3208  A1465 EMC 2631 820-3435
A1466 EMC 2559 820-3209  A1466 EMC 2632 820-3437
A1502 EMC 2678 820-3536  A1502 EMC 2678 820-3476 A1502 EMC 2875 820-3476

Information for customer / Información para el cliente:
if you are not from Europe, please inquire about customs tax, VAT of your country.
We send products in Russia only via registered POST (12-20 days).
Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

IN STOCK

In package include: 

1) Professional Programmer RT809H

2) USB + VGA cables included

3)  Frames: 11.5*13mm,  11*10mm,  12*16mm,  14*18mm

4) BGA Socket 153/169 :  seat EMMC153 / EMMC169 x 1pcs

You can select shipping option in checkout:  Economy or Expedited 

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Information for customer / Información para el cliente:
if you are not from Europe, please inquire about customs tax, VAT of your country.
We send products in Russia only via registered POST (12-20 days).
Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

PCI Motherboard diagnosis card 4-bit computer fault diagnosis card

216-0856040

Part Number 216-0856040 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 2009

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

IN STOCK 

In package include: 

1) Professional Programmer RT809H

2)  Frames: 11*13mm,  10*13mm,  10*15mm

3)  Adapter :  EMMC BGA64

You can select shipping option in checkout:  Economy or Expedited 

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Information for customer / Información para el cliente:
if you are not from Europe, please inquire about customs tax, VAT of your country.
We do not ship any products to Russia.
Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

PCI PCIE LPC MiniPCI-E Analyzer Type A Diagnostic Card KQCPET6-V8 for PC Laptop Tester

KQCPET6-V8

Login to Download: Download software Use Tutorials Video

Highlights

? Fit for desktop computer and laptop.

? An advanced computer motherboard CPU ram hardware diagnostic test card with motherboards stability test feature

? Latest 4-in-1 version with LCD panel extension connector

? An extra nice feature of quick test of the computer system stability

? Can work with/without CPU/RAM on board

? Come with extra method (QG diagnosis) of testing the computers besides the traditional Bios POST code method

? Great for onsite technicians, computer admin and home/office personal uses

? Allows the users to test the hardware errors + testing the computer working stability in a matter of minute

Specifications

? This is an advanced PC device that is capable of testing the PC computers with different types of CPUs, including ALL series of previous and latest Intel / AMD / Cyrix CPUs

? It can test the components of computer main board working or not and test the initialization of the system hardware, such as: System Chipset, CPU Initialization and Registration, HDD Controllers, System Cache, Extended Memory RAM, Keyboard/Mouse Controller, Sound and LAN Controller, Video Memory and Controller etc

What is in the box

? 1 x Main Diagnostic Card

? 1 x USB Power Cable

? 1 x MiniPCI-E PCB. for Laptop

? 1 x Campal EC Cable

? 1 x LPC Fly Line

? 1 x English Manual

Note

? Please kindly note that it is suitable for PCI slot, PCIE, LPC and MiniPCIE

? Do not plug PCI-E interface to PCI or AGP or any other NON-PCI-E slot, it will damage the diagnostic card or computer when power supply is on

SR2EU i3-6100U

Part Number Core i3-6100U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock