Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Micro USB 3.0 D Type SMT Female Socket Connector for Hard Disk Drives Data Interface

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Item includes:

Asus BU400 PU401LPU500 UX501V BX21A BX31A Power DC Jack*1

Condition:New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Advent, Arm, Ashton Digital, Fujitsu, Hyperdata, Systemax, Uniwill

Available in center pin sizes 2.0mm and 2.5mm

Advent, Arm, Ashton Digital, Hyperdata, Systemax, Uniwill DC Power Jack Connector: N34AS1 & N351S1

Fujitsu DC Power Jack Connector: L6825, D1840, D1845, D7830

Note: Any of the models listed above may use either center pin sizes, please verify the size you need.

Lenovo E480 E485 E580 R480 E590 Type-C USB Charging Port Connector

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Asus G51 Series DC Power Jack Connector: G51, G51JX-3D, G51JX-A1, G51JX-A2, G51JX-X2, G51JX-X4, G51VX, G51VX-A1, G51VX-RX05, G51VX-X1A

Asus G60 Series DC Power Jack Connector: G60J, G60J-JX029V, G60J-JX031V, G60J-JX031X, G60JX, G60JX-JX032V, G60JX-JX066X, G60JX-JX140V, G60JX-JX154V, G60JX-RBBX05, G60VX, G60VX-RBBX05

Asus G72 Series DC Power Jack Connector: G72, G72GX

Asus G73 series DC Power Jack Connector: G73JH, G73JW

Asus X83 series DC Power Jack Connector: X83, X83V X83V-xxxx, X83VB, X83VB-xxxx

Asus Z84 series DC Power Jack Connector: Z84FM, Z84JP

HP ZD Series DC Power Jack Connector: ZD7000, ZD7001EA, ZD7001US, ZD7005EA, ZD7005QV, ZD7005US, ZD7009EA, ZD7010ca, ZD7010EA, ZD7010QV, ZD7010US, ZD7012EA, ZD7015EA, ZD7015US, ZD7020EA, ZD7020US, ZD7030EA, ZD7030US, ZD7035EA, ZD7038EA, ZD7040EA, ZD7040US, ZD7045EA, ZD7048CL, ZD7048EA, ZD7049EA, ZD7050, ZD7050EA, ZD7050US, ZD7055EA, ZD7058CL, ZD7060EA, ZD7063EA, ZD7065EA, ZD7066EA, ZD7070EA, ZD7080EA, ZD7101, ZD7101US, ZD7102US, ZD7112EA, ZD7120EA, ZD7128EA, ZD7129EA, ZD7131EA, ZD7139EA, ZD7140US, ZD7141, ZD7141EA, ZD7143EA, ZD7144EA, ZD7145EA, ZD7150EA, ZD7160ca, ZD7160US, ZD7167EA, ZD7168CL, ZD7168EA, ZD7169EA, ZD7170EA, ZD7180US, ZD7188CL, ZD7198CL, ZD7201US, ZD7202US, ZD7228EA, ZD7229EA, ZD7230EA, ZD7230US, ZD7235EA, ZD7236EA, ZD7245EA, ZD7248EA, ZD7249CL, ZD7250EA, ZD7255EA, ZD7256EA, ZD7257EA, ZD7258EA, ZD7259EA, ZD7260EA, ZD7260US, ZD7265EA, ZD7267EA, ZD7269CL, ZD7270EA, ZD7280US, ZD7283EA, ZD7300EA, ZD7310ca, ZD7310US, ZD7320EA, ZD7340EA, ZD7341EA, ZD7342EA, ZD7348EA, ZD7349EA, ZD7350EA, ZD7360US, ZD7373EA, ZD7374EA, ZD7375EA, ZD7376EA, ZD7377EA, ZD7378EA, ZD7379CL, ZD7379EA, ZD7380EA, ZD7380US, ZD7381EA, ZD7382EA, ZD7383EA, ZD7385EA, ZD7389CL, ZD7390EA, ZD7392EA, ZD7395EA, ZD7998US, ZD7999US, ZD8000, ZD8002, ZD8003, ZD8004

HP ZV series DC Power Jack Connector: ZV5000, ZV5000t, ZV5000z, ZV5001US, ZV5002, ZV5002US, ZV5003AP, ZV5004AP, ZV5005AP, ZV5010AP, ZV5012AP, ZV5015AP, ZV5021AP, ZV5029AP, ZV5030US, ZV5034US, ZV5037WM, ZV5045EA, ZV5101US, ZV5103, ZV5103AP, ZV5103US, ZV5105US, ZV5120, ZV5120CA, ZV5120US, ZV5160, ZV5160CA, ZV5160US, ZV5200, ZV5200T, ZV5201, ZV5201US, ZV5202, ZV5210, ZV5210ca, ZV5210US, ZV5220, ZV5220US, ZV5240US, ZV5227, ZV5230, ZV5235, ZV5240, ZV5242QV, ZV5247LA, ZV5255US, ZV5257LA, ZV5260US, ZV5267LA, ZV5270US, ZV5277LA, ZV5287LA, ZV5316US, ZV5320, ZV5325, ZV5330, ZV5330, ZV5340, ZV5343, ZV5346, ZV5348, ZV5360, ZV5370, ZV5380, ZV5386, ZV6000

HP ZX series DC Power Jack Connector: ZX5000, ZX5002, ZX5040US, ZX5040EA, ZX5041, ZX5060US, ZX5065US, ZX5070US, ZX5078, ZX5180US, ZX5190US, ZX5200, ZX5275US, ZX5280US

Compaq Presario DC Power Jack Connector: R3000, R3000T, R3000Z, R3001, R3001US, R3002, R3003, R3003US, R3004, R3004US, R3005, R3005US, R3020, R3030, R3030US, R3038, R3038CL, R3040, R3050, R3050US, R3055, R3055CA, R3055US, R3056RS, R3060, R3060CA, R3060EA, R3060US, R3065, R3065US, R3070, R3070US, R3120CA, R3120US, R3140, R3140CA, R3140US, R3150, R3158, R3160, R3160US, R3190, R3190EA, R3190US, R3200, R3210, R3220, R3230, R3240, R3265, R3290, R3550US

Compaq Presario DC Power Jack Connector: 3000, 3000US, 3005, 3005US, 3008, 3008CL, 3015, 3015CA, 3015US, 3016US, 3017, 3017CL, 3017US, 3019, 3019CL, 3020, 3020US, 3045, 3045US, 3050, 3050US, 3070, 3070US, 3077, 3077WM, 3080, 3080US

Everx Stepnote DC Power Jack Connector: NC1500, VA4100, VA4100M, VA4101M, VA4103M, VA4300, VA4300M, LM7WZ

*Gateway 4000 Series DC Power Jack Connector: M325, 4012GZ, 4024GZ, 4025GZ, 4026GZ, 4028GZ, 4028JP, 4030GZ, 4520GZ, 4525GZ, 4530GH, 4530GZ, 4535GZ, 4536GZ, 4538GZ, 4540GZ, 4541BZ, 4542GP, 4543BZ

*Gateway 7000 Series: M520, 7110GX, 7210GX, 7215GX, 7305GZ, 7320GZ, 7322GZ,7324GZ, 7325GZ, 7326GZ, 7330GH, 7330GZ, 7405GH, 7405GX, 7410GX, 7415GX, 7422GX, 7426GX, 7508GX, 7510GX, MX7118, MX7315, MX7337, MX7337H, MX7340, MX7515, MX7515H, MX7525, S-7200C

IBM Thinkpad DC Power Jack Connector: 570E, 600, 600A, 600D, 600E, 600X, A20, A20M, A20P, A21, A21E, A21M, A21P, A22, A22E, A22M, A22P, A30, A30P, A31, A31P, X, X20, X21, X22, X23, X24, X30

Toshiba Satellite DC Power Jack Connector: A70, A75, A79, M30X, M35X, L15-S104, 1800, 1900, 1905, 1955

Acer TravelMate DC Power Jack Connector:252ELCi, 430, 1500, 1510, 2200

*eMachine DC Power Jack Connector: M2100 Series, M2300 series, M6800 Series

Fujitsu Amilo DC Power Jack Connector: L1300

Packard Bell DC Power Jack Connector: E5, E6

WinBook DC Power Jack Connector: 700 series

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock