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TI TPS51622TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000785
€3.45

TI TPS51622TI

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T2 ROM EFI Bluetooth WiFi A1932 A1989 A1990 A2141 A2159 A2179 A2251 A2289

Product description:

Adapter T2 ROM XSON Wifi BT ROM SOP8 WSON Wlcsp BGA12 Wlcsp BGA16

 This specialized PCB offering seamless accessibility to extract information from SPI Flash Memory packages used for EFI and T2 Rom's. Can be read the following:

  • T2 ROM;
  • SPI Flash Memory (EFI);
  • Bluetooth/WiFi SPI Flash Memory;
  • USB SPI Flash Memory;
  • GPU SPI Flash Memory.

In package:

1 pcs x BLACK PCB ADAPTER

Greater support are provided with this adapter:

  • SOP-8
  • USON-8 3x2 
  • USON-8 4x3
  • WSON-8 6x5
  • WSON-8 8x6
  • XSON-8
  • WLCSP BGA12
  • WLCSP BGA16

 

MacBook T2 ROM Support
Model # Board # MacBook Series
a2289 820-01987 MacBook Pro (13-inch, 2020)
a2251 820-01949 MacBook Pro (13-inch, 2020 )
a2179 820-01958 MacBook Air (Retina, 13-inch, 2020)
a2159 820-01598 MacBook Pro (13-inch, 2019 )
a2141 820-01700 MacBook Pro (16-inch, 2019)
a1990 820-01041 MacBook Pro (15-inch, 2018 , 2019)
a1989 820-00850 MacBook Pro (13-inch, 2018 , 2019)
a1932 820-01521 MacBook Air (Retina, 13-inch, 2018 , 2019)

 

Product description:

SVOD4 , SVOD3 , RT809F+1.8V adapter, RT809H, Xeltek , TNM , CH341A.v1.7+with 1.8V power output


 Shipping time

Please to select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited: 5-10 working days  (Europe and Worldwide)

 

Warranty

This product will have a 90-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax !!!

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Canada, Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Canada, Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000165
€16.53

Adapter T2 ROM Xson Wifi BT ROM SOP8 WSON Wlcsp

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Winbond W83L950D

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000786
€3.45

Winbond W83L950D

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ITE IT8502E JXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000787
€3.45

ITE IT8502E JXA

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ITE IT8518E HXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000788
€3.45

ITE IT8518E HXA

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OZMICRO OZ8291L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000793
€3.45

OZMICRO OZ8291L

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Intersil ISL6262ACRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000794
€3.45

Intersil ISL6262ACRZ

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ENE KB9028Q C

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000801
€3.45

ENE KB9028Q C

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PM8058

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000808
€3.45

PM8058

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PM8921

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000812
€3.45

PM8921

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ICS 9LPR462AGLF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000819
€3.45

ICS 9LPR462AGLF

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Realtek ALC269 7x7

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000823
€3.45

Realtek ALC269 7x7

TI TPS51622TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000785
€3.45

TI TPS51622TI

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T2 ROM EFI Bluetooth WiFi A1932 A1989 A1990 A2141 A2159 A2179 A2251 A2289

Product description:

Adapter T2 ROM XSON Wifi BT ROM SOP8 WSON Wlcsp BGA12 Wlcsp BGA16

 This specialized PCB offering seamless accessibility to extract information from SPI Flash Memory packages used for EFI and T2 Rom's. Can be read the following:

  • T2 ROM;
  • SPI Flash Memory (EFI);
  • Bluetooth/WiFi SPI Flash Memory;
  • USB SPI Flash Memory;
  • GPU SPI Flash Memory.

In package:

1 pcs x BLACK PCB ADAPTER

Greater support are provided with this adapter:

  • SOP-8
  • USON-8 3x2 
  • USON-8 4x3
  • WSON-8 6x5
  • WSON-8 8x6
  • XSON-8
  • WLCSP BGA12
  • WLCSP BGA16

 

MacBook T2 ROM Support
Model # Board # MacBook Series
a2289 820-01987 MacBook Pro (13-inch, 2020)
a2251 820-01949 MacBook Pro (13-inch, 2020 )
a2179 820-01958 MacBook Air (Retina, 13-inch, 2020)
a2159 820-01598 MacBook Pro (13-inch, 2019 )
a2141 820-01700 MacBook Pro (16-inch, 2019)
a1990 820-01041 MacBook Pro (15-inch, 2018 , 2019)
a1989 820-00850 MacBook Pro (13-inch, 2018 , 2019)
a1932 820-01521 MacBook Air (Retina, 13-inch, 2018 , 2019)

 

Product description:

SVOD4 , SVOD3 , RT809F+1.8V adapter, RT809H, Xeltek , TNM , CH341A.v1.7+with 1.8V power output


 Shipping time

Please to select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited: 5-10 working days  (Europe and Worldwide)

 

Warranty

This product will have a 90-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax !!!

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Canada, Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Canada, Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000165
€16.53

Adapter T2 ROM Xson Wifi BT ROM SOP8 WSON Wlcsp

wishlist
Compare

Winbond W83L950D

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000786
€3.45

Winbond W83L950D

wishlist
Compare

ITE IT8502E JXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000787
€3.45

ITE IT8502E JXA

wishlist
Compare

ITE IT8518E HXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000788
€3.45

ITE IT8518E HXA

wishlist
Compare

OZMICRO OZ8291L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000793
€3.45

OZMICRO OZ8291L

wishlist
Compare

Intersil ISL6262ACRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000794
€3.45

Intersil ISL6262ACRZ

wishlist
Compare

ENE KB9028Q C

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000801
€3.45

ENE KB9028Q C

wishlist
Compare

PM8058

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000808
€3.45

PM8058

wishlist
Compare

PM8921

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000812
€3.45

PM8921

wishlist
Compare

ICS 9LPR462AGLF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000819
€3.45

ICS 9LPR462AGLF

wishlist
Compare

Realtek ALC269 7x7

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000823
€3.45

Realtek ALC269 7x7

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Compare
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