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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
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H26M42003GMRA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000586
€8.74

H26M42003GMRA

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A1425 EMC 2557 Bios Chip EFI Firmware 820-3462 Retina Late 2012 Core i7 I73520M ME116LLA

PO000081
€18.00 €22.50

A1425 EMC 2557 Bios EFI Firmware 820-3462 Retina Late 2012 Core i7 I7-3520M ME116LL/A

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QDFX350MTNA3

QD-FX-350MT-N-A3

Part Number QD-FX-350MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001277
€21.33

QD-FX-350MT-N-A3

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NUVOTON NPCE783LA0DX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000587
€3.45

NUVOTON NPCE783LA0DX

  • -20%
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A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i5 I53230M ME662LLA

PO000082
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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G73VZANA2

G73-VZA-N-A2

Part Number G73-VZA-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1018

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001286
€24.62

G73-VZA-N-A2

  • -20%
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A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i7 I73540M BTOCTO

PO000083
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i7 I7-3540M BTO/CTO

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N13PGSWKBA2

N13P-GS-W-KB-A2

Part Number N13P-GS-W-KB-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001291
€46.77

N13P-GS-W-KB-A2

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TI TPS51116RG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000590
€3.45

TI TPS51116RG

  • -20%
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A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000084
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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ACTIONS ATC2603A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000591
€3.45

ACTIONS ATC2603A

H26M42003GMRA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000586
€8.74

H26M42003GMRA

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  • -20%

A1425 EMC 2557 Bios Chip EFI Firmware 820-3462 Retina Late 2012 Core i7 I73520M ME116LLA

PO000081
€18.00 €22.50

A1425 EMC 2557 Bios EFI Firmware 820-3462 Retina Late 2012 Core i7 I7-3520M ME116LL/A

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QDFX350MTNA3

QD-FX-350MT-N-A3

Part Number QD-FX-350MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001277
€21.33

QD-FX-350MT-N-A3

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NUVOTON NPCE783LA0DX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000587
€3.45

NUVOTON NPCE783LA0DX

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  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i5 I53230M ME662LLA

PO000082
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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G73VZANA2

G73-VZA-N-A2

Part Number G73-VZA-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1018

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001286
€24.62

G73-VZA-N-A2

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  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i7 I73540M BTOCTO

PO000083
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i7 I7-3540M BTO/CTO

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Compare

N13PGSWKBA2

N13P-GS-W-KB-A2

Part Number N13P-GS-W-KB-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001291
€46.77

N13P-GS-W-KB-A2

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TI TPS51116RG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000590
€3.45

TI TPS51116RG

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Compare
  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000084
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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Compare

ACTIONS ATC2603A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000591
€3.45

ACTIONS ATC2603A

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