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  • Categories: CPU and Graphic Chips
  • Categories: Laptop Parts, Repair tool
  • Availability: In stock

N10MGLMSA3

N10M-GLM-S-A3

Part Number N10M-GLM-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1015

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001965
€18.02

N10M-GLM-S-A3

Laptop Motherboard Socket 754M Base BGA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001422
€4.85

Laptop Motherboard Socket 754M Base BGA

25ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 3.94inch/10cm

Width: approx. 1.42inch/3.6cm

Model: B-7000

Net weight: 0.84fl.oz (25ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001428
€4.35

25ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

2160728014 HD4500

216-0728014 HD4500

Part Number 216-0728014 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 400 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001973
€36.22

216-0728014 HD4500

GF9300730IB2

GF-9300-730I-B2

Part Number GF-9300-730I-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0839

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001997
€16.41

GF-9300-730I-B2

40W Soldering Iron with Thead Blue Teflon Cable

40W (100-230V) Soldering Iron T-Tip (head) and Teflon rubber for Pixel Ribbon cable Repair

The 40W Electronic Soldering Iron comes with a T-Tip head and Rubber Cable used for repairing and replacing car LCD flat ribbon cables.

Work Voltage: 100-230V

Application:

For BMW dashboard and mid radio ribbon , for Mercedes Benz instrument cluster ribbon , SAAB ( automatic climate control, SID1, SID2), Opel ribbon.etc.

Pacakge:

1P x T-tip (head)

1P x Rubber

Note: Different size for soldering iron Tip, so the power of the tip must the same with your electronic soldering iron power.

CH001449
€2.70

40W Soldering Iron with T-head + Blue Teflon Cable

DH82QM87 QE98ES

DH82QM87 QE98ES

Part Number DH82QM87 QE98ES Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002001
€23.79

DH82QM87 QE98ES

N11MOP1SA3 G210M

N11M-OP1-S-A3 G210M

Part Number N11M-OP1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002007
€16.85

N11M-OP1-S-A3 G210M

SR0D6 i52467M

i5-2467M SR0D6

Part Number SR0D6 i5-2467M Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002009
€24.62

SR0D6 i5-2467M

N10MGLMSA3

N10M-GLM-S-A3

Part Number N10M-GLM-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1015

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001965
€18.02

N10M-GLM-S-A3

Laptop Motherboard Socket 754M Base BGA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001422
€4.85

Laptop Motherboard Socket 754M Base BGA

25ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 3.94inch/10cm

Width: approx. 1.42inch/3.6cm

Model: B-7000

Net weight: 0.84fl.oz (25ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001428
€4.35

25ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

2160728014 HD4500

216-0728014 HD4500

Part Number 216-0728014 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 400 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001973
€36.22

216-0728014 HD4500

GF9300730IB2

GF-9300-730I-B2

Part Number GF-9300-730I-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0839

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001997
€16.41

GF-9300-730I-B2

40W Soldering Iron with Thead Blue Teflon Cable

40W (100-230V) Soldering Iron T-Tip (head) and Teflon rubber for Pixel Ribbon cable Repair

The 40W Electronic Soldering Iron comes with a T-Tip head and Rubber Cable used for repairing and replacing car LCD flat ribbon cables.

Work Voltage: 100-230V

Application:

For BMW dashboard and mid radio ribbon , for Mercedes Benz instrument cluster ribbon , SAAB ( automatic climate control, SID1, SID2), Opel ribbon.etc.

Pacakge:

1P x T-tip (head)

1P x Rubber

Note: Different size for soldering iron Tip, so the power of the tip must the same with your electronic soldering iron power.

CH001449
€2.70

40W Soldering Iron with T-head + Blue Teflon Cable

DH82QM87 QE98ES

DH82QM87 QE98ES

Part Number DH82QM87 QE98ES Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002001
€23.79

DH82QM87 QE98ES

N11MOP1SA3 G210M

N11M-OP1-S-A3 G210M

Part Number N11M-OP1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002007
€16.85

N11M-OP1-S-A3 G210M

SR0D6 i52467M

i5-2467M SR0D6

Part Number SR0D6 i5-2467M Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002009
€24.62

SR0D6 i5-2467M