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  • Categories: Laptop Parts, Repair tool
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AMD AM2 CPU Motherboard Replacement Socket

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002652
€9.92

AMD AM2 CPU Motherboard Replacement Socket

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6in1 Repair Opening Metal Spudger Pry Tools Disassemble Set for Cell Phone GPS

Features:

1. Brand new 6in1 Repair Opening Pry Tools Set

2. Light weight,convenient to carry

3. With these repair tools, you'll be able to easily disassemble your phones

4. Quick disassemble and install your Phone without any damage

5. Can be reused for many times

Package include:

5 x Plastic Pry Tools

1 x Metal Spudger Pry tool

CH002689
€2.70

6in1 Repair Opening Metal Spudger Pry Tools Disassemble Set for Cell Phone GPS

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ACHI IR6500 BGA rework station

ACHI IR6500 infrared BGA Soldering Rework Station IR 6500 For Motherboard Chip PCB Refurbished Repair System Solder Welding 220V

Buy BGA repaired Nozzle: * BGA repaired Nozzle

IR6500 infrared BGA Soldering Rework Station IR 6000 For Motherboard Chip PCB Refurbished Repair System

1. USB interface.

2. 2 temperature zones

3. With tempering glass,more uniform heating

4. Hot sale model, praised by many customers.

5. Low cost.

6. Technical support is always available

7. Original Factory, look for worldwide distributors

Where this IR6500 DIY IR BGA Reflow Rework Station Price Good can be used for ?

1. For repairing Mobile phones

2. For repairing Notebooks/ Laptops/computers

3. For repairing game consoles, especially for XBOX360/PS3/WII

4. For repairing any other mainboards with size from 22x22mm to 500x400mm

5. For preheating chips or mainboards before soldering to improve rework efficiency.

Specifications of this IR6500 DIY IR BGA Reflow Rework Station Price Good

Total power 1250W

Voltage AC220V10% 50/60Hz

Top heater IR 400W

Size of topr heater 80mm*80mm

Bottom heater IR 800W

Size of bottom heating 180mm*180mm

PCB size Max. 400*305 mm

BGA chip size Max. 70*70 mm

Positioning V-groove PCB

Temperature control K Type temperature Sensor and Closed loop

Temperature accuracy 2C

Dimension 475*480*420mm

Net weight 20.5 KG

CH002691
€794.41

ACHI IR6500 BGA rework station

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rPGA989 Foxconn BGA Socket Intel CPU Base New Model 989pin

rPGA-989 Foxconn BGA Socket Intel CPU Base New Model 989pin

Part Number rPGA-989 Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Date Code 19+

Package/Case 1 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002703
€4.60

rPGA-989 Foxconn BGA Socket Intel CPU Base New Model 989pin

AMD AM2 CPU Motherboard Replacement Socket

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002652
€9.92

AMD AM2 CPU Motherboard Replacement Socket

wishlist
Compare

6in1 Repair Opening Metal Spudger Pry Tools Disassemble Set for Cell Phone GPS

Features:

1. Brand new 6in1 Repair Opening Pry Tools Set

2. Light weight,convenient to carry

3. With these repair tools, you'll be able to easily disassemble your phones

4. Quick disassemble and install your Phone without any damage

5. Can be reused for many times

Package include:

5 x Plastic Pry Tools

1 x Metal Spudger Pry tool

CH002689
€2.70

6in1 Repair Opening Metal Spudger Pry Tools Disassemble Set for Cell Phone GPS

wishlist
Compare

ACHI IR6500 BGA rework station

ACHI IR6500 infrared BGA Soldering Rework Station IR 6500 For Motherboard Chip PCB Refurbished Repair System Solder Welding 220V

Buy BGA repaired Nozzle: * BGA repaired Nozzle

IR6500 infrared BGA Soldering Rework Station IR 6000 For Motherboard Chip PCB Refurbished Repair System

1. USB interface.

2. 2 temperature zones

3. With tempering glass,more uniform heating

4. Hot sale model, praised by many customers.

5. Low cost.

6. Technical support is always available

7. Original Factory, look for worldwide distributors

Where this IR6500 DIY IR BGA Reflow Rework Station Price Good can be used for ?

1. For repairing Mobile phones

2. For repairing Notebooks/ Laptops/computers

3. For repairing game consoles, especially for XBOX360/PS3/WII

4. For repairing any other mainboards with size from 22x22mm to 500x400mm

5. For preheating chips or mainboards before soldering to improve rework efficiency.

Specifications of this IR6500 DIY IR BGA Reflow Rework Station Price Good

Total power 1250W

Voltage AC220V10% 50/60Hz

Top heater IR 400W

Size of topr heater 80mm*80mm

Bottom heater IR 800W

Size of bottom heating 180mm*180mm

PCB size Max. 400*305 mm

BGA chip size Max. 70*70 mm

Positioning V-groove PCB

Temperature control K Type temperature Sensor and Closed loop

Temperature accuracy 2C

Dimension 475*480*420mm

Net weight 20.5 KG

CH002691
€794.41

ACHI IR6500 BGA rework station

wishlist
Compare

rPGA989 Foxconn BGA Socket Intel CPU Base New Model 989pin

rPGA-989 Foxconn BGA Socket Intel CPU Base New Model 989pin

Part Number rPGA-989 Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Date Code 19+

Package/Case 1 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002703
€4.60

rPGA-989 Foxconn BGA Socket Intel CPU Base New Model 989pin

wishlist
Compare
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