Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

1.65mm

Acer Travelmate DC Power Jack Connector: C100, Z9000

Compaq Armada DC Power Jack Connector: M700

Compaq Presario M2000 Series DC Power Jack Connector: M20xx, M21xx, M22xx, M23xx, M24xx, M25xx

HP Pavilion ZE2000 Series DC Power Jack Connector: ZE20xx, ZE21xx, ZE22xx, ZE23xx, ZE24xx, ZE25xx

2.0mm

Gateway Tablet DC Power Jack Connector: M1200, M1300

Gateway DC Power Jack Connector: M275, M305CRV, 400SD4, 400VTX, M405, 450SX4, 450ROG, 450RGH

Gateway Solo DC Power Jack Connector: 1150, 5300, 5350, 9100, 9150

2.5mm

Asus DC Power Jack Connector: M3000N

Averatec DC Power Jack Connector: 2100, 2200, 3150, 3200, 3220, 3250, 3300, 5110H, 6200, 7100 Series

Clevo-Sager DC Power Jack Connector: 98

Compal DC Power Jack Connector: ACL-10

HP Pavilion ZT Series DC Power Jack Connector: ZT1000, ZT1100, ZT1125, ZT1130, ZT1135, ZT1145, ZT1155, ZT1170, ZT1175, ZT1180, ZT1190, ZT1230, ZT1235, ZT1260

HP Omnibook DC Power Jack Connector: XT1500

**Fujitsu Seimens Esprimo DC Power Jack Connector: V5535

Hyperdata DC Power Jack Connector: 3000

IBM DC Power Jack Connector: I Series

Motion DC Power Jack Connector: LS800 Tablet

Philips Freevents X59 Series DC Power Jack Connector: X59

Toshiba Satellite 1000 Series DC Power Jack Connector: 1000-S157 (PS100U-0012HLNC), 1000-S158, 1000-Z2

Toshiba Satellite 1005 Series DC Power Jack Connector: 1005-S157 (PS100U-0012HNNC), 1005-S158

Toshiba Satellite 1200 Series DC Power Jack Connector: 1200-S121 (PS120U-00DJX7), 1200-S122, 1200-S252

Toshiba Satellite 3000 Series DC Power Jack Connector: 3000-100, 3000-214, 3000-400, 3000-504, 3000-514, 3000-601, 3000-A423, 3000-H200, 3000-Q65, 3000-S303, 3000-S304 (PS302U-00QZ37B), 3000-S307 (PS302U-019XD3B), 3000-S309, 3000-S353 (PS300U-03YKN2E), 3000-S403, 3000-S514, 3000-S601, 3000-X4, 3000-X11

Toshiba Satellite 3005 Series DC Power Jack Connector: 3005-A423, 3005-H200, 3005-S303 (PS300U-03ENNHD), 3005-S304 (PS302U-00QZ3X), 3005-S307 (PS302U-019XDX), 3005-S308, 3005-S353, 3005-S403, 3005-S504

Twinhead E14B Series DC Power Jack Connector: E14B

Twinhead H12Y Series DC Power Jack Connector: H12YT3

Versa DC Power Jack Connector: E120

The Shield can easily be removed if you do not need it.

** Remove the middle contact on the back of the Jack with pliers.

Sony SVF13N DC Jack Power

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Lenovo Idea Pad DC Power Jack Connector: 3000 N500, 3000 Y410, 3000 Y430, 7757, C460M, G530

Note: This is the Jack only and does not include the harness. You will need to reuse your harness.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Samsung NP P40 Series DC Power Jack Connector: P40, NP P40, NP-P40

Samsung NP P500 Series DC Power Jack Connector: P500, NP P500, NP-P500

Samsung NP Q10 Series DC Power Jack Connector: Q10, NP Q10, NP-Q10

Samsung NP Q20 Series DC Power Jack Connector: Q20, NP Q20, NP-Q20

Samsung NP Q25 Series DC Power Jack Connector: Q25, NP Q25, NP-Q25

Samsung NP Q30 Series DC Power Jack Connector: Q30, NP Q30, NP-Q30

Samsung NP Q35 Series DC Power Jack Connector: Q35, NP Q35, NP-Q35

Samsung NP Q40 Series DC Power Jack Connector: Q40, NP Q40, NP-Q40

Samsung NP Q45 Series DC Power Jack Connector: Q45, NP Q45, NP-Q45

Samsung NP Q68 Series DC Power Jack Connector: Q68, NP Q68, NP-Q68

Samsung NP R20 Series DC Power Jack Connector: R20, NP R20, NP-R20

Samsung NP R40 Series DC Power Jack Connector: R40, NP R40, NP-R40

Samsung NP R505 Series DC Power Jack Connector: NP R505, NP R505-xxxxxx, NP R505-FAxxxx, NP R505-FA01xx, NP R505-FA02xx, NP R505-FA03xx, NP R505-FA04xx, NP R505-FSxxxx, NP R505-FS01xx, NP R505-FS02xx, NP R505-FS03xx, NP R505-FS04xx, NP R505-FS05xx

Samsung NP R510 Series DC Power Jack Connector: NP R510, NP R510-xxxxxx, NP R510-FAxxxx, NP R510-FAA2xx, NP R510-FAADxx, NP R510-FAADxx, NP R510-FAAGxx, NP R510-FA01xx, NP R510-FA02xx, NP R510-FA03xx, NP R510-FA04xx, NP R510-FA05xx, NP R510-FA06xx, NP R510-FA07xx, NP R510-FA08xx, NP R510-FA09xx, NP R510-FA0Gxx, NP R510-FA0Jxx, NP R510-FA0Mxx, NP R510-FSxxxx, NP R510-FS01xx, NP R510-FS02xx, NP R510-FS03xx, NP R510-FS04xx, NP R510-FS05xx, NP R510-FS06xx, NP R510-FS07xx, NP R510-FS08xx, NP R510-FS09xx, NP R510-FS0Axx, NP R510-FS0Bxx, NP R510-FS0Cxx, NP R510-FS0Exx, NP R510-FS0Gxx, NP R510-FS0Hxx, NP R510-FS0Jxx, NP R510-FS0Kxx, NP R510-FS0Lxx, NP R510-FS0Nxx, NP R510-FS0Pxx

Samsung NP R560 Series DC Power Jack Connector: R560, NP R560, NP-R560

Samsung NP R60 R60+ Series DC Power Jack Connector: R60, NP R60, NP-R60, R60+, NP R60+, NP-R60+

Samsung NP R70 Series DC Power Jack Connector: R70, NP R70, NP-R70

Samsung NP R700 Series DC Power Jack Connector: NP R700, NP R700-xxxxxx, NP R700-A0xxxx, NP R700-A003xx, NP R700-A00Axx

Samsung NP X1 Series DC Power Jack Connector: X1, NP X1, NP-X1

Samsung NP X60 Series DC Power Jack Connector: X60, NP X60, NP-X60

Samsung NP X460 Series DC Power Jack Connector: NP X460, NP X460-xxxxxx, NP X460-42x, NP X460-44x, NP X460-ASxxxx, NP X460-AS01xx, NP X460-AS02xx, NP X460-AS03xx, NP X460-AS04xx, NP X460-AS05xx, NP X460-AS06xx, NP X460-AS07xx

Samsung Sens X22 Series DC Power Jack Connector: X22, X22-xxxx, X22-A0xx, X22-A004, X22-A005, X22-A007, X22-A008

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Samsung NP 700G7A Series DC Power Jack Connector: NP 700G7A, NP 700G7A-xxxxx, NP 700G7A-S0xxx, NP 700G7A-S01xx, NP 700G7A-S02xx, NP 700G7A-S03xx

Samsung NP 700G7C Series DC Power Jack Connector: NP 700G7C, NP 700G7C-xxxxx, NP 700G7C-C0xxx, NP 700G7C-C01xx, NP 700G7C-S0xxx, NP 700G7C-S01xx, NP 700G7C-S03xx

Samsung NP 700Z3A Series DC Power Jack Connector: NP 700Z3A, NP 700Z3A-xxxxx, NP 700Z3A-S0xxx, NP 700Z3A-S01xx, NP 700Z3A-S02xx, NP 700Z3A-S03xx, NP 700Z3A-S04xx, NP 700Z3A-S05xx, NP 700Z3A-S06xx, NP 700Z3A-S07xx

Samsung NP 700Z3C Series DC Power Jack Connector: NP 700Z3C, NP 700Z3C-xxxxx, NP 700Z3C-S0xxx, NP 700Z3C-S01xx, NP 700Z3C-S02xx

Samsung NP 700Z4A Series DC Power Jack Connector: NP 700Z4A, NP 700Z4A-xxxxx, NP 700Z4A-S0xxx, NP 700Z4A-S01xx, NP 700Z4A-S02xx, NP 700Z4A-SDxxx, NP 700Z4A-SD1xx

Samsung NP 700Z5A Series DC Power Jack Connector: NP 700Z5A, NP 700Z5A-xxxxx, NP 700Z5A-A01xx, NP 700Z5A-S0xxx, NP 700Z5A-S01xx, NP 700Z5A-S02xx, NP 700Z5A-S03xx, NP 700Z5A-S04xx, NP 700Z5A-S05xx, NP 700Z5A-S06xx, NP 700Z5A-S07xx, NP 700Z5AH, NP 700Z5AI

Samsung NT 700Z5A Series DC Power Jack Connector: NT 700Z5A, NT 700Z5A-xxxx, NT 700Z5A-PS3, NT 700Z5A-S54S, NT 700Z5A-S58, NT 700Z5A-S78

Samsung NP 700Z5B Series DC Power Jack Connector: NP 700Z5B, NP 700Z5B-xxxxx, NP 700Z5B-S01xx, NP 700Z5B-S02xx, NP 700Z5B-W0xxx, NP 700Z5B-W01xx, 700Z5BH

Samsung NP 700Z5C Series DC Power Jack Connector: NP 700Z5C, NP 700Z5C-xxxxx, NP 700Z5C-A03xx, NP 700Z5C-S01xx, NP 700Z5C-S02xx, NP 700Z5C-S03xx, NP 700Z5C-S04xx, NP 700Z5C-S05xx, NP 700Z5C-S06xx, NP 700Z5C-S07xx, NP 700Z5C-SB1xx, NP 700Z5C-SB2xx, NP 700Z5CH, NP 700Z5CI

Samsung NT 700Z5C Series DC Power Jack Connector: NT 700Z5C, NT 700Z5C-xxxx, NT 700Z5C-S54S, NT 700Z5C-S58, NT 700Z5C-S64S, NT 700Z5C-S68, NT 700Z5C-S711Z, NT 700Z5C-S78, NT 700Z5C-S88

Samsung NP 700Z7C Series DC Power Jack Connector: NP 700Z7C, NP 700Z7C-xxxxx, NP 700Z7C-S01xx, NP 700Z7C-S02xx, NP 700Z7C-S03xx, NP 700Z7C-S04xx

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock