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M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

Part Number M402SD07G Manufacturer Futaba

Operating Temp -20 ? - 70 ? Made in Japan

Storage Temp -40 ? - 85 ? Description Original new

Digit Format: 5*7 Dot Matrix + Cursor

Outer Dimension: 240*43*20.6 MAX mm

Display Area: 16.4*186.8 mm

Number of Digit: 40 digits*2 lines

Digit Size: 5.0*3.5 mm

Digit Pitch: 10.0*4.7 mm

Color of Illumination: Green(?p=505nm)

Operating Temp: -20? - 70 ?

Storage Temp: -40? - 85 ?

CH001374
€764.57

M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

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TI TPS51622TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000785
€3.45

TI TPS51622TI

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PCE16 6PN03 USB 30 PCIE 1X TO 16X Extender Riser Card Adapter SATA Power 50cm

This is the new version of the PCIe 1x to 16x riser with USB 3.0 cable. This is a must have item for 6+ gpu mining rigs. This is the most stable riser in existence today.

Brand New in anti-static bag. Just arrived from China.

1x to 16x PCI-e riser

3 capacitors so the card doesn't burn out like 1st edition riser

4 PIN Molex to 15 PIN SATA power cable (Reinforced 4 pin connector for extra strength)

Flat bottom so it can rest safely on your mining rig supports

50 cm / 20 inch USB 3.0 cable with plenty of length for spacing out your GPUs for maximum airflow.

Version 6.0 (Newest version available!)

Package Includes:

1x - 50cm / 20 inch USB 3.0 cable (Black)

1x - PCI-e 16x adapter board (Black)

1x - PCI-e 1x riser board (Black)

1x - SATA 15 Pin to 4 PIN Molex power cable

Make sure you're buying the best quality risers to protect your expensive GPUs. Ribbon cables and first generation PCI-e risers are dangerous. These risers have 3 capacitors instead of 2 and are from a new / improved vendor.

CH001376
€5.97

PCE16 6P-N03 USB 3.0 PCI-E 1X TO 16X Extender Riser Card Adapter SATA Power 50cm

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Winbond W83L950D

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000786
€3.45

Winbond W83L950D

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ITE IT8502E JXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000787
€3.45

ITE IT8502E JXA

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ITE IT8518E HXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000788
€3.45

ITE IT8518E HXA

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OZMICRO OZ8291L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000793
€3.45

OZMICRO OZ8291L

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Intersil ISL6262ACRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000794
€3.45

Intersil ISL6262ACRZ

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Laptop Motherboard Socket 754M Base BGA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001422
€4.85

Laptop Motherboard Socket 754M Base BGA

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ENE KB9028Q C

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000801
€3.45

ENE KB9028Q C

M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

Part Number M402SD07G Manufacturer Futaba

Operating Temp -20 ? - 70 ? Made in Japan

Storage Temp -40 ? - 85 ? Description Original new

Digit Format: 5*7 Dot Matrix + Cursor

Outer Dimension: 240*43*20.6 MAX mm

Display Area: 16.4*186.8 mm

Number of Digit: 40 digits*2 lines

Digit Size: 5.0*3.5 mm

Digit Pitch: 10.0*4.7 mm

Color of Illumination: Green(?p=505nm)

Operating Temp: -20? - 70 ?

Storage Temp: -40? - 85 ?

CH001374
€764.57

M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

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TI TPS51622TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000785
€3.45

TI TPS51622TI

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PCE16 6PN03 USB 30 PCIE 1X TO 16X Extender Riser Card Adapter SATA Power 50cm

This is the new version of the PCIe 1x to 16x riser with USB 3.0 cable. This is a must have item for 6+ gpu mining rigs. This is the most stable riser in existence today.

Brand New in anti-static bag. Just arrived from China.

1x to 16x PCI-e riser

3 capacitors so the card doesn't burn out like 1st edition riser

4 PIN Molex to 15 PIN SATA power cable (Reinforced 4 pin connector for extra strength)

Flat bottom so it can rest safely on your mining rig supports

50 cm / 20 inch USB 3.0 cable with plenty of length for spacing out your GPUs for maximum airflow.

Version 6.0 (Newest version available!)

Package Includes:

1x - 50cm / 20 inch USB 3.0 cable (Black)

1x - PCI-e 16x adapter board (Black)

1x - PCI-e 1x riser board (Black)

1x - SATA 15 Pin to 4 PIN Molex power cable

Make sure you're buying the best quality risers to protect your expensive GPUs. Ribbon cables and first generation PCI-e risers are dangerous. These risers have 3 capacitors instead of 2 and are from a new / improved vendor.

CH001376
€5.97

PCE16 6P-N03 USB 3.0 PCI-E 1X TO 16X Extender Riser Card Adapter SATA Power 50cm

wishlist
Compare

Winbond W83L950D

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000786
€3.45

Winbond W83L950D

wishlist
Compare

ITE IT8502E JXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000787
€3.45

ITE IT8502E JXA

wishlist
Compare

ITE IT8518E HXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000788
€3.45

ITE IT8518E HXA

wishlist
Compare

OZMICRO OZ8291L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000793
€3.45

OZMICRO OZ8291L

wishlist
Compare

Intersil ISL6262ACRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000794
€3.45

Intersil ISL6262ACRZ

wishlist
Compare

Laptop Motherboard Socket 754M Base BGA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001422
€4.85

Laptop Motherboard Socket 754M Base BGA

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Compare

ENE KB9028Q C

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000801
€3.45

ENE KB9028Q C

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