Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 3.54inch/9cm

Width: approx. 1.26inch/3.2cm

Model: B-7000

Net weight: 0.5fl.oz (15ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

RT9166A-25GXL Richtek J D=FED3Y

Part Number RT9166A-25GXL Manufacturer Richtek

BGA Alloy No Pb/Lead Free Date Code 1331

Package/Case 3000 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Battery for Asus N45 N55 N75 (11.1V 5200mAh) Black p/n: A32-N55

Battery Type Li-ion p/n A32-N55

Voltage 11.1V Color Black

Capacity 5200mAh Condition New OEM

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Screen protection/removal high temperature resistance screen refurbish tape 80mm by 50 meter

80MM x 50 meter

very useful tape , only to be used for screen removal , high temperature resistance

you can use it for cleaning dust or micro parts as well

simply apply the tape before heating process ,keep it all in one piece

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Features:

Notice:This is HC-05 Bluetooth module Slave and master two in one module~

This module can be set to a transmitter or receiver, transmitter could pairing with receiver , receiver and receiver or transmitter and transmitter can't communication between, receiver could pairing with computers and cell phone Bluetooth , when buying, the default for receiver.

Specification:

1. Use the CSR mainstream bluetooth chip, bluetooth V2.0 protocol standards.

2. Module working voltage 3.3 V.

3. Default potter rate is 9600, can be set up from 2400 to 115200 .

4. The core module size : 28 mm x 15 mm x 2.35 mm.

5. Working current: matching for 30 MA, matching the communication for 8 MA.

6. Dormancy current: no dormancy.

7. Used for GPS navigation system, water and electricity gas meter reading system.

8. With computer and bluetooth bluetooth adapter, PDA, seamless connection equipment

Highlights:

1. Commercial Series: Bluetooth module board Series

2. With LED indicator light, use 150mA and 3.3V regulation chip.

3. With VCC?GND?TXD?RXD foot for the Bluetooth

4. With "Re-seach" button(ON/OFF/WAKE foot for it , external MCU outinput "High level" can control module to re-search)

5. Compatible with bluetooth master module", slave module"or master-slave(whole) module.

6. put voltage: 3.3~6V

7. Size: 1.55cm*3.98cm

Note:

1. input power supply 3.3~6V, Prohibit more than 7V

2. No "Automatically prevent power supply peversing func", so please correctly connect power supply

3. We advise to install "Bluetooth master module"

4. The "State" is output foot for LED status, when bluetooth "Unconnected", output "Pulse" ; when bluetooth "connected", output "High level", we can determine the states from "MCU"

5. If only the board , No any "Bluetooth Function "

Package Included:

1Pcs X HC-05 bluetooth module with backboard

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

Part Number M402SD07G Manufacturer Futaba

Operating Temp -20 ? - 70 ? Made in Japan

Storage Temp -40 ? - 85 ? Description Original new

Digit Format: 5*7 Dot Matrix + Cursor

Outer Dimension: 240*43*20.6 MAX mm

Display Area: 16.4*186.8 mm

Number of Digit: 40 digits*2 lines

Digit Size: 5.0*3.5 mm

Digit Pitch: 10.0*4.7 mm

Color of Illumination: Green(?p=505nm)

Operating Temp: -20? - 70 ?

Storage Temp: -40? - 85 ?

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock