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  • Categories: CPU and Graphic Chips
  • Categories: Laptop Parts, Repair tool
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N15PGXA2 GTX860M

N15P-GX-A2 GTX860M

Part Number N15P-GX-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1443

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001938
€96.82

N15P-GX-A2 GTX860M

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BD82HM57 SLGZR

BD82HM57 SLGZR

Part Number AC82GL40 SLB95 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001944
€45.95

BD82HM57 SLGZR

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GFGO7600TNB1

GF-GO7600T-N-B1

Part Number GF-GO7600T-N-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0921

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001946
€24.62

GF-GO7600T-N-B1

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2160728020 HD4570

216-0728020 HD4570

Part Number 216-0728020 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 360 Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001954
€22.64

216-0728020 HD4570

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2160729051 HD4670

216-0729051 HD4670

Part Number 216-0729051 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001964
€24.34

216-0729051 HD4670

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Laptop Motherboard Socket 754M Base BGA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001422
€4.85

Laptop Motherboard Socket 754M Base BGA

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N10MGLMSA3

N10M-GLM-S-A3

Part Number N10M-GLM-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1015

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001965
€18.02

N10M-GLM-S-A3

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25ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 3.94inch/10cm

Width: approx. 1.42inch/3.6cm

Model: B-7000

Net weight: 0.84fl.oz (25ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001428
€4.35

25ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

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2160728014 HD4500

216-0728014 HD4500

Part Number 216-0728014 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 400 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001973
€36.22

216-0728014 HD4500

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N16VGMB1

N16V-GM-B1

Part Number N16V-GM-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001992
€25.44

N16V-GM-B1

N15PGXA2 GTX860M

N15P-GX-A2 GTX860M

Part Number N15P-GX-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1443

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001938
€96.82

N15P-GX-A2 GTX860M

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BD82HM57 SLGZR

BD82HM57 SLGZR

Part Number AC82GL40 SLB95 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001944
€45.95

BD82HM57 SLGZR

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GFGO7600TNB1

GF-GO7600T-N-B1

Part Number GF-GO7600T-N-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0921

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001946
€24.62

GF-GO7600T-N-B1

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2160728020 HD4570

216-0728020 HD4570

Part Number 216-0728020 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 360 Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001954
€22.64

216-0728020 HD4570

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2160729051 HD4670

216-0729051 HD4670

Part Number 216-0729051 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001964
€24.34

216-0729051 HD4670

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Compare

Laptop Motherboard Socket 754M Base BGA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001422
€4.85

Laptop Motherboard Socket 754M Base BGA

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Compare

N10MGLMSA3

N10M-GLM-S-A3

Part Number N10M-GLM-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1015

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001965
€18.02

N10M-GLM-S-A3

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25ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 3.94inch/10cm

Width: approx. 1.42inch/3.6cm

Model: B-7000

Net weight: 0.84fl.oz (25ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001428
€4.35

25ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

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Compare

2160728014 HD4500

216-0728014 HD4500

Part Number 216-0728014 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 400 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001973
€36.22

216-0728014 HD4500

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Compare

N16VGMB1

N16V-GM-B1

Part Number N16V-GM-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001992
€25.44

N16V-GM-B1

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