Introductions:

Suppose that the LED screen of your beloved laptop has something wrong, you could not see anything from the laptop, you must feel upset. Don't worry, this 13" Mirror Screen for MacBook Pro can avoid the similar situation. One good feature of this mirror screen is its compact size and high quality material, ideal for most travelers or for those who will be consistently lugging their laptops around town. Another one is it enjoys overall brightness and color vividness so you can use it very comfortable. This mirror screen is an ideal replacement screen used to replace your cracked, scratched or damaged screen.

Features:

1. High quality, best choice for computer

2. New and fully functioning

3. It is used to repair faulty screen

4. Reasonable price and fast shipment

5. Solid construction for long-term use

Specifications:

1. Dimensions: (12.59 x 8.39)" / (32 x 21.3)cm (L x W)

2. Weight: 4.2 oz / 119 g

3. Color: Black Side

4. Compatible with: 13" Macbook Pro

Package Includes:

1 x Mirror Screen

N13P-GT-A2 GT630M

Part Number N13P-GT-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1249

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Features:

100% brand new.

M.2 (NGFF) & mSATA to SATA III Module.

Build in Mini PCI-e 52pin male connector.

Build in M.2 (NGFF) B key male connector.

2.5" SATA SSD Form Factor: 98 x 65 x 5mm.

Green LED indicate power status.

Red LED indicate active status.

Insert both M.2 & mSATA SSD on Board, M.2 SSD is the first priority,mSATA won't work.

Support SATA Reversion 3.2.

Compatible with PCI Express M.2 Spec. Version 1.0.

PWM synchronous buck converter Power IC.

3A maximum output current.

Short circuit protection.

In-rush current suppression.

Thermal shutdown protection.

ESD HBM (Human Body Mode)/2KV.

Applications:

Internet Appliances.

Industrial Computers.

Desk-top PC.

Kiosks.

Routers.

Firewalls.

Uncompatible model:

For Micron C400 C500 SSD.

NOTE: Not compatible with MINI PCI-E SSD,eg. Brand ASUS EeePC SSD, Sandisk SSD, they are not same interface, please check before buying!

Package Included:

1 x Msata/NGFF SSD to Sata Converter

Note:This item come without retail box,but we will pack well before shipping!

N18P-G0-MP-A1

Part Number N18P-G0-MP-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 08+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Thunderbolt display all-in-one cable (922-9941)

G92-985-A2

Part Number G92-985-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

The battery test/charge/activation board brings old or dead Apple iPhone batteries back to life.

Advanced design allows you to charge a maximum of two batteries at any one time.

2A Current Protection/cut off if the current of voltage are too high the protection automatically disconnects the power supply.

Short circuit protection: If the battery has a short-circuit, the warning lamp will illuminate - Do not to charge the battery!

Visual display - A dual LCD display showing current & voltage.

Safe and easy to use - Attach battery and power to use, when the battery is full it will stop the output charge current to prevent overcharging.

Low voltage activation: os battery voltage is below 3V, the battery can be re-activated using the activation button.

216-0732025 HD4850M

Part Number 216-0732025 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 360 Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Product Description

Features of I7 bluetooth headset:

1. listening to the song correct, support songs and call,

2. remind call number, the last call back, all intelligent Chinese and English voice prompts, boot, pair, shut down the phone power will be low voice prompts;

3. Power capacity will show on your Apple Iphone, you can see the power situation anytime, do not worry about the electricity ,make your life without worry;

4. Can be connected to two mobile phones at the same time

5. Bluetooth headset connected to the phone after the shutdown, and then open the Bluetooth headset will connect back to the phoneautomatically, more convenient;

6. Intelligent compatibility: support all Bluetooth mobile phone, tablet, notebook, singing it, QQ music, movies, etc., universal all mobile phone;

Specification:

1. Driver: 15mm

2. Impedance: 32 OHM

3. Bluetooth version: Bluetooth v4.1 + EDR

4. Bluetooth use band: 2.4GHz

5. Power level: CLASS II

6. Output power: 30mW

7. Bluetooth distance: 10 meters barrier

8. Frequency response: 20-20000Hz

9. Operating voltage range: 3.0V-4.2V

10. Mitou sensitivity: -42dB

11. With A2DP / AVRCP high quality stereo audio transmission and remote control protocol

12. Powerful noise de-noising circuit (active noise reduction)

13. switch between Chinese and English (boot does not connect Bluetooth state, press the switch 2 times, hear the tone switch successfully)

14. Charging time about 1 hour (power indicator charging: red light, full power: red light off (blue light).)

15. Product Size: Length 25MM. Width 15MM. High 35mm

16. Talk time is about 4-5 hours

17. music time about 4-5 hours

18. Standby time is about 120 hours

19. The charging time is about 60 minutes

20. Battery capacity 60MAH

Package Includes:

1*mini Bluetooth Headphones (Only 1pcs)

1*USB Charging Cable

1*User Manual

SR1YW N3540

Part Number SR1YW N3540 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 240 PCS Description Original new

SR1YW N3540 FH8065301919700 Intel Pentium CPU BGA1170 2.16 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SMC from Board 820-3332-A Maintenance Board

215-0752007 RX881

Part Number 215-0752007 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock