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  • Categories: BGA Reballing Kits, Stencils
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  • Categories: PCI, CPU Socket Tester
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Wireless Serial 6 Pin Bluetooth RF Transceiver Module HC05 RS232 Master Slave

Features:

Notice:This is HC-05 Bluetooth module Slave and master two in one module~

This module can be set to a transmitter or receiver, transmitter could pairing with receiver , receiver and receiver or transmitter and transmitter can't communication between, receiver could pairing with computers and cell phone Bluetooth , when buying, the default for receiver.

Specification:

1. Use the CSR mainstream bluetooth chip, bluetooth V2.0 protocol standards.

2. Module working voltage 3.3 V.

3. Default potter rate is 9600, can be set up from 2400 to 115200 .

4. The core module size : 28 mm x 15 mm x 2.35 mm.

5. Working current: matching for 30 MA, matching the communication for 8 MA.

6. Dormancy current: no dormancy.

7. Used for GPS navigation system, water and electricity gas meter reading system.

8. With computer and bluetooth bluetooth adapter, PDA, seamless connection equipment

Highlights:

1. Commercial Series: Bluetooth module board Series

2. With LED indicator light, use 150mA and 3.3V regulation chip.

3. With VCC?GND?TXD?RXD foot for the Bluetooth

4. With "Re-seach" button(ON/OFF/WAKE foot for it , external MCU outinput "High level" can control module to re-search)

5. Compatible with bluetooth master module", slave module"or master-slave(whole) module.

6. put voltage: 3.3~6V

7. Size: 1.55cm*3.98cm

Note:

1. input power supply 3.3~6V, Prohibit more than 7V

2. No "Automatically prevent power supply peversing func", so please correctly connect power supply

3. We advise to install "Bluetooth master module"

4. The "State" is output foot for LED status, when bluetooth "Unconnected", output "Pulse" ; when bluetooth "connected", output "High level", we can determine the states from "MCU"

5. If only the board , No any "Bluetooth Function "

Package Included:

1Pcs X HC-05 bluetooth module with backboard

CH001373
£5.18

Wireless Serial 6 Pin Bluetooth RF Transceiver Module HC-05 RS232 Master Slave

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NF6150LENA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000940
£4.50

NF-6150LE-N-A2 Stencil Template

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2150807027 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000949
£4.50

215-0807027 Stencil Template

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M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

Part Number M402SD07G Manufacturer Futaba

Operating Temp -20 ? - 70 ? Made in Japan

Storage Temp -40 ? - 85 ? Description Original new

Digit Format: 5*7 Dot Matrix + Cursor

Outer Dimension: 240*43*20.6 MAX mm

Display Area: 16.4*186.8 mm

Number of Digit: 40 digits*2 lines

Digit Size: 5.0*3.5 mm

Digit Pitch: 10.0*4.7 mm

Color of Illumination: Green(?p=505nm)

Operating Temp: -20? - 70 ?

Storage Temp: -40? - 85 ?

CH001374
£637.33

M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

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MCP79MVLB2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000952
£4.50

MCP79MVL-B2 Stencil Template

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PCE16 6PN03 USB 30 PCIE 1X TO 16X Extender Riser Card Adapter SATA Power 50cm

This is the new version of the PCIe 1x to 16x riser with USB 3.0 cable. This is a must have item for 6+ gpu mining rigs. This is the most stable riser in existence today.

Brand New in anti-static bag. Just arrived from China.

1x to 16x PCI-e riser

3 capacitors so the card doesn't burn out like 1st edition riser

4 PIN Molex to 15 PIN SATA power cable (Reinforced 4 pin connector for extra strength)

Flat bottom so it can rest safely on your mining rig supports

50 cm / 20 inch USB 3.0 cable with plenty of length for spacing out your GPUs for maximum airflow.

Version 6.0 (Newest version available!)

Package Includes:

1x - 50cm / 20 inch USB 3.0 cable (Black)

1x - PCI-e 16x adapter board (Black)

1x - PCI-e 1x riser board (Black)

1x - SATA 15 Pin to 4 PIN Molex power cable

Make sure you're buying the best quality risers to protect your expensive GPUs. Ribbon cables and first generation PCI-e risers are dangerous. These risers have 3 capacitors instead of 2 and are from a new / improved vendor.

CH001376
£4.97

PCE16 6P-N03 USB 3.0 PCI-E 1X TO 16X Extender Riser Card Adapter SATA Power 50cm

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N12PGV2A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000954
£4.50

N12P-GV2-A1 Stencil Template

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N2930 SR1W3 Stencil Template

N2930 SR1W3 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000956
£5.18

N2930 SR1W3 Stencil Template

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i53210M SR0N0 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000958
£4.50

i5-3210M SR0N0 Stencil Template

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SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000965
£4.50

SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template

Wireless Serial 6 Pin Bluetooth RF Transceiver Module HC05 RS232 Master Slave

Features:

Notice:This is HC-05 Bluetooth module Slave and master two in one module~

This module can be set to a transmitter or receiver, transmitter could pairing with receiver , receiver and receiver or transmitter and transmitter can't communication between, receiver could pairing with computers and cell phone Bluetooth , when buying, the default for receiver.

Specification:

1. Use the CSR mainstream bluetooth chip, bluetooth V2.0 protocol standards.

2. Module working voltage 3.3 V.

3. Default potter rate is 9600, can be set up from 2400 to 115200 .

4. The core module size : 28 mm x 15 mm x 2.35 mm.

5. Working current: matching for 30 MA, matching the communication for 8 MA.

6. Dormancy current: no dormancy.

7. Used for GPS navigation system, water and electricity gas meter reading system.

8. With computer and bluetooth bluetooth adapter, PDA, seamless connection equipment

Highlights:

1. Commercial Series: Bluetooth module board Series

2. With LED indicator light, use 150mA and 3.3V regulation chip.

3. With VCC?GND?TXD?RXD foot for the Bluetooth

4. With "Re-seach" button(ON/OFF/WAKE foot for it , external MCU outinput "High level" can control module to re-search)

5. Compatible with bluetooth master module", slave module"or master-slave(whole) module.

6. put voltage: 3.3~6V

7. Size: 1.55cm*3.98cm

Note:

1. input power supply 3.3~6V, Prohibit more than 7V

2. No "Automatically prevent power supply peversing func", so please correctly connect power supply

3. We advise to install "Bluetooth master module"

4. The "State" is output foot for LED status, when bluetooth "Unconnected", output "Pulse" ; when bluetooth "connected", output "High level", we can determine the states from "MCU"

5. If only the board , No any "Bluetooth Function "

Package Included:

1Pcs X HC-05 bluetooth module with backboard

CH001373
£5.18

Wireless Serial 6 Pin Bluetooth RF Transceiver Module HC-05 RS232 Master Slave

wishlist
Compare

NF6150LENA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000940
£4.50

NF-6150LE-N-A2 Stencil Template

wishlist
Compare

2150807027 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000949
£4.50

215-0807027 Stencil Template

wishlist
Compare

M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

Part Number M402SD07G Manufacturer Futaba

Operating Temp -20 ? - 70 ? Made in Japan

Storage Temp -40 ? - 85 ? Description Original new

Digit Format: 5*7 Dot Matrix + Cursor

Outer Dimension: 240*43*20.6 MAX mm

Display Area: 16.4*186.8 mm

Number of Digit: 40 digits*2 lines

Digit Size: 5.0*3.5 mm

Digit Pitch: 10.0*4.7 mm

Color of Illumination: Green(?p=505nm)

Operating Temp: -20? - 70 ?

Storage Temp: -40? - 85 ?

CH001374
£637.33

M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

wishlist
Compare

MCP79MVLB2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000952
£4.50

MCP79MVL-B2 Stencil Template

wishlist
Compare

PCE16 6PN03 USB 30 PCIE 1X TO 16X Extender Riser Card Adapter SATA Power 50cm

This is the new version of the PCIe 1x to 16x riser with USB 3.0 cable. This is a must have item for 6+ gpu mining rigs. This is the most stable riser in existence today.

Brand New in anti-static bag. Just arrived from China.

1x to 16x PCI-e riser

3 capacitors so the card doesn't burn out like 1st edition riser

4 PIN Molex to 15 PIN SATA power cable (Reinforced 4 pin connector for extra strength)

Flat bottom so it can rest safely on your mining rig supports

50 cm / 20 inch USB 3.0 cable with plenty of length for spacing out your GPUs for maximum airflow.

Version 6.0 (Newest version available!)

Package Includes:

1x - 50cm / 20 inch USB 3.0 cable (Black)

1x - PCI-e 16x adapter board (Black)

1x - PCI-e 1x riser board (Black)

1x - SATA 15 Pin to 4 PIN Molex power cable

Make sure you're buying the best quality risers to protect your expensive GPUs. Ribbon cables and first generation PCI-e risers are dangerous. These risers have 3 capacitors instead of 2 and are from a new / improved vendor.

CH001376
£4.97

PCE16 6P-N03 USB 3.0 PCI-E 1X TO 16X Extender Riser Card Adapter SATA Power 50cm

wishlist
Compare

N12PGV2A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000954
£4.50

N12P-GV2-A1 Stencil Template

wishlist
Compare

N2930 SR1W3 Stencil Template

N2930 SR1W3 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000956
£5.18

N2930 SR1W3 Stencil Template

wishlist
Compare

i53210M SR0N0 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000958
£4.50

i5-3210M SR0N0 Stencil Template

wishlist
Compare

SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000965
£4.50

SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template

wishlist
Compare
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