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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Laptop Parts, Repair tool
  • Categories: Programmer & Sockets
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9V20V Universal CCFL LCD Display Screen Inverter Board INPUT

Features:

Voltage:9V-20V

A small interface

Interface Definition:VIN(power) On/Off(switch) ADJ(brightness control)GND(ground)

Size:9*1*0.43cm

Suitable for laptop repair and modification-small valum-super wide votage design- support 9V-12V-15V-16V-26V and 20V , every voltage conected to three wires , will be lighted up convenient necessary accessories of laptop maintenance.

Package includes:

1*inverter

CH000925
€2.70

9V-20V Universal CCFL LCD Display Screen Inverter Board INPUT

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i32350M SR0DQ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000682
€9.97

i3-2350M SR0DQ Stencil Template 90*90

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eMMC FBGA169 BGA153 Adapter 11513 to SD

Buy Limit Frame: * 11.5*13mm, 12*16mm, 12*18mm, 14*18mm

Product Characteristics

1. Using standard SD interface mode, the corresponding operation such as test or burning can be realized by connecting card reader with computer or through SD interface of programmer.

2. Compatible with ball-and-ball testing, IC limit frame is molded in one. It can be replaced by different size limit frame according to IC, so that IC of different size can be used universally.

3. Supporting hot plug-in and testing for PIN connection through SD interface or through connection with board row;

4. PCB adopts four-layer circuit structure to reduce the instability of test caused by signal interference. The golden finger is plated with thick gold to ensure durability and contact.

5. At the same time compatible: Toshiba, Samsung, Hynix, Intel, Sandisk and other brand IC;

6. Compatible with 153-FBGA 169-FBGA;

7. The shrapnel is stamped by imported beryllium copper through high precision die, the head-shaped probe is designed, and the later stage is hardened and plated with thick gold layer to ensure the stability and durability of the product.

8. The whole structure of the contact module reduces the repetitive positioning problem, ensures the precise alignment between the contact point and the IC PAD, and has a high pass rate in one test.

9. The through-hole welding structure is adopted to ensure good contact, and the positioning holes of SOCKET and PCBA are precisely positioned to facilitate replacement.

10. The top-window structure is adopted, which is compatible with manual and automatic testing and easy to operate.

11. Pressure IC adopts self-adapting structure of integral moulding and spring, which ensures that IC with different thickness does not need any adjustment to ensure good contact and wide universality of IC for testing.

12. The structure is formed by injection moulding, with precise positioning, easy access to IC and higher working efficiency.

CH001879
€92.00

eMMC FBGA169/BGA153 Adapter 11.5*13 to SD

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G84602A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000686
€5.40

G84-602-A2 Stencil Template

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Pentium DualCore Mobile 987 SR0V4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000688
€5.40

Pentium Dual-Core Mobile 987 SR0V4 Stencil Template

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800pcs AntiStatic ESD Rubber Finger Cot Protector Cover

Latex Finger Cots are comfortably be worn all day for improved performance in assembly.

It can reduce static that widely use in industrial, such as electronic repair or electronic DIY.

Product Name : Finger Cots;Material : Latex

Quantity : 100Pcs;Folded Size (Approx.) : 2 x 0.3cm/ 0.79" x 0.12"(D*H)

Unfolded Size (Approx.) : 1.5 x 6.5cm/ 0.59" x 2.56"(D*L);Color : Off White

Weight : 500g

Package Content : 800(+/- 2%) x Finger Cots

CH000935
€7.34

800pcs Anti-Static ESD Rubber Finger Cot Protector Cover

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TQFP44 to DIP44 Programmer Adapter Socket for RT809H XELTEK USB programmer

CHIP PROGRAMMER SOCKET TQFP44 TO DIP44 adapter socket support ATMEGA8 series

Description:

Best quality, QFP44 to 44Dip Adapter

Suitable for QFP44 IC

patch size : 0.8mm 10mm * 10mm

Feature:

Support Atmel Atmega TQFP44 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP44 Atmega328 format, Pin to pin comptabile with Atmega DIP44 MCU format

Package included:

Programmer Adapter QFP44 to DIP44

Note:

Type A: Use for XELTEK USB Programmer - Overlapping

Type B: Use for TNM5000 Programmer - Pin to Pin

CH001885
€28.00

TQFP44 to DIP44 Programmer Adapter Socket for RT809H XELTEK USB programmer

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BD82HM65 SLH9D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000689
€5.40

BD82HM65 SLH9D Stencil Template

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AM950BADY23AB Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000694
€9.97

AM950BADY23AB Stencil Template 90*90

9V20V Universal CCFL LCD Display Screen Inverter Board INPUT

Features:

Voltage:9V-20V

A small interface

Interface Definition:VIN(power) On/Off(switch) ADJ(brightness control)GND(ground)

Size:9*1*0.43cm

Suitable for laptop repair and modification-small valum-super wide votage design- support 9V-12V-15V-16V-26V and 20V , every voltage conected to three wires , will be lighted up convenient necessary accessories of laptop maintenance.

Package includes:

1*inverter

CH000925
€2.70

9V-20V Universal CCFL LCD Display Screen Inverter Board INPUT

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i32350M SR0DQ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000682
€9.97

i3-2350M SR0DQ Stencil Template 90*90

wishlist
Compare

eMMC FBGA169 BGA153 Adapter 11513 to SD

Buy Limit Frame: * 11.5*13mm, 12*16mm, 12*18mm, 14*18mm

Product Characteristics

1. Using standard SD interface mode, the corresponding operation such as test or burning can be realized by connecting card reader with computer or through SD interface of programmer.

2. Compatible with ball-and-ball testing, IC limit frame is molded in one. It can be replaced by different size limit frame according to IC, so that IC of different size can be used universally.

3. Supporting hot plug-in and testing for PIN connection through SD interface or through connection with board row;

4. PCB adopts four-layer circuit structure to reduce the instability of test caused by signal interference. The golden finger is plated with thick gold to ensure durability and contact.

5. At the same time compatible: Toshiba, Samsung, Hynix, Intel, Sandisk and other brand IC;

6. Compatible with 153-FBGA 169-FBGA;

7. The shrapnel is stamped by imported beryllium copper through high precision die, the head-shaped probe is designed, and the later stage is hardened and plated with thick gold layer to ensure the stability and durability of the product.

8. The whole structure of the contact module reduces the repetitive positioning problem, ensures the precise alignment between the contact point and the IC PAD, and has a high pass rate in one test.

9. The through-hole welding structure is adopted to ensure good contact, and the positioning holes of SOCKET and PCBA are precisely positioned to facilitate replacement.

10. The top-window structure is adopted, which is compatible with manual and automatic testing and easy to operate.

11. Pressure IC adopts self-adapting structure of integral moulding and spring, which ensures that IC with different thickness does not need any adjustment to ensure good contact and wide universality of IC for testing.

12. The structure is formed by injection moulding, with precise positioning, easy access to IC and higher working efficiency.

CH001879
€92.00

eMMC FBGA169/BGA153 Adapter 11.5*13 to SD

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Compare

G84602A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000686
€5.40

G84-602-A2 Stencil Template

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Compare

Pentium DualCore Mobile 987 SR0V4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000688
€5.40

Pentium Dual-Core Mobile 987 SR0V4 Stencil Template

wishlist
Compare

800pcs AntiStatic ESD Rubber Finger Cot Protector Cover

Latex Finger Cots are comfortably be worn all day for improved performance in assembly.

It can reduce static that widely use in industrial, such as electronic repair or electronic DIY.

Product Name : Finger Cots;Material : Latex

Quantity : 100Pcs;Folded Size (Approx.) : 2 x 0.3cm/ 0.79" x 0.12"(D*H)

Unfolded Size (Approx.) : 1.5 x 6.5cm/ 0.59" x 2.56"(D*L);Color : Off White

Weight : 500g

Package Content : 800(+/- 2%) x Finger Cots

CH000935
€7.34

800pcs Anti-Static ESD Rubber Finger Cot Protector Cover

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TQFP44 to DIP44 Programmer Adapter Socket for RT809H XELTEK USB programmer

CHIP PROGRAMMER SOCKET TQFP44 TO DIP44 adapter socket support ATMEGA8 series

Description:

Best quality, QFP44 to 44Dip Adapter

Suitable for QFP44 IC

patch size : 0.8mm 10mm * 10mm

Feature:

Support Atmel Atmega TQFP44 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP44 Atmega328 format, Pin to pin comptabile with Atmega DIP44 MCU format

Package included:

Programmer Adapter QFP44 to DIP44

Note:

Type A: Use for XELTEK USB Programmer - Overlapping

Type B: Use for TNM5000 Programmer - Pin to Pin

CH001885
€28.00

TQFP44 to DIP44 Programmer Adapter Socket for RT809H XELTEK USB programmer

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BD82HM65 SLH9D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000689
€5.40

BD82HM65 SLH9D Stencil Template

wishlist
Compare

AM950BADY23AB Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000694
€9.97

AM950BADY23AB Stencil Template 90*90

wishlist
Compare
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