Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SA404 Adapter for XELTEK SuperPro 610P

Model: CX3002/DX3002/EX3002/GX3002

Description: QFP44

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX1011 Adapter for XELTEK SuperPro 6100N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX5046-1 Adapter for XELTEK SuperPro 6100N

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000 SoFi-SP8 SoFi-SP16

Cable Size: 40CM

SPI FLASH chip SOP8 and SOP16 connection

A lot of new types of notebook and router is currently using 25 SPI memory chip, SOP16 chip package, such as MX25L3205 chip; although many programmers can support MX25L3205 chip, but it is the MX25L3205 chip supports SOP8 package, the MX25L3205 chip does not directly support the SOP16 package; and the adapter chip are not the same. One is 8 feet, one is 16 feet. So, is it possible to program SOP15 MX25L3205 chips in a simple way? In fact, the process is simple, because the 25 SPI chip SOP8 and SOP16 package chip, the definition of the corresponding foot is the same, as long as the corresponding SOP16 feet and SOP8 feet corresponding connection, the operating process can be used SOP8 MX25L3205 chip to operate on SOP16 MX25L3205 chip. (as long as 25 SPI chip models are identical, SOP8 and SOP16 chips can be used in this way)

25 SPI chip, SOP8 and SOP16 chip is interchangeable, as long as the chip pin corresponding to the line

Specifications for SOP8 packages and SOP16 packages:

SOP8 and SOP16 package, the foot spacing is the same, are 1.27, but the chip width is different. And chip definition of the corresponding pin is exactly the same, but the SOP16 chip packaging more than 8 feet NC empty feet (for future expansion as a basis), refer to the following figure, you can easily determine the SOP and SOP 25 SPI chip foot definition:

25 SPI SOP16 and SOP8 chip pins define the relationship:

The program can be programmed as long as the SOP16 pin is connected to the SOP8 adapter or directly to the programmer's seat.

In addition, MX25L3205 also has a TSSOP14 chip, the foot corresponding to the following picture:

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

ELM327 HH Android Bluetooth OBD 2 OBD II Diagnostic Scan Tool elm 327 Scanner

Login to Download: Download software

V2.1 Mini Bluetooth ELM327 OBD HH OBDII Protocolos OBD2 Car Diagnostic Scanner

Top 5 Reasons to Get V2.1 Mini Bluetooth ELM327 OBD HH:

1.This is a vehicle diagnostic tool interface scanner, which is is used to read trouble codes, clear trouble codes and detect fuel pressure and so on.

2.OBDII Software for ELM327 is a free program that allows you to use your PC and a hardware interface to get the information from your car's computer.

3.The program is very user-friendly, and easy to learn. It is also very easy to install: simply extract the files into a folder on your computer's hard drive, and you're ready to go.

4. To uninstall the program, simply delete the entire contents of the folder where the program resides.

5.The software supports four platforms - For DOS/Windows/Android. This product is a non-oem, generic product.

Notice: This device can't work with IOS system.

Mini Bluetooth ELM327 is the newly developed wireless scan tool. It supports all OBD-II protocols:

? Works with all OBD-II compliant vehicles

? Wireless (Bluetooth)

? Software included for Palm, PDA

? Software included for Windows PC

? Software included for Windows Smartphone

? Supports ISO 9141, KWP2000

? Supports SAE J1850

? Supports CAN bus

V2.1 Mini Bluetooth ELM327 OBD HH Car Diagnostic Scanner Specification:

Support OBD-II protocols as follows: * ISO15765-4 (CAN) * ISO14230-4 (KWP2000) * ISO9141-2 * J1850 VPW * J1850 PWM

SAE J1850 PWM (41.6 kbaud)

SAE J1850 VPW (10.4 kbaud)

ISO 9141-2 (5 baud init, 10.4 kbaud)

ISO 14230-4 KWP (5 baud init, 10.4 kbaud)

ISO 14230-4 KWP (fast init, 10.4 kbaud)

ISO 15765-4 CAN (11 bit ID, 500 kbaud)

ISO 15765-4 CAN (29 bit ID, 500 kbaud)

ISO 15765-4 CAN (11 bit ID, 250 kbaud)

ISO 15765-4 CAN (29 bit ID, 250 kbaud)

Device type: Car bluetooth read interface scanner

Interface type: Auto ELM327 V1.5 interface

V2.1 Mini Bluetooth ELM327 OBD HH Car Diagnostic Scanner Free Software:

1. Scantool.net

2. GM Mode 22 Scan Tool by Terry

3. OBD Gauge for PalmOS and Pocket PC by Dana Peters

4. OBD Logger by Jonathan Senkerik

5. OBD-II ScanMaster by Wladimir Gurskij (ScanMaster 3.52 - local copy)

6. obd2crazy.com

7. OBD2 Scantool by Ivan Andrewjeski

8. OBDII for ELM322 by David Huffman

9. pyOBD by Donour Sizemore for MacOSX and Linux

10. RDDTC by Pete Calinski

11. Real Scan by Brent Harris

12. ScanTest for Pocket PC by Ivan Ganev aka a-ser

13. OBD by WDT

V2.1 Mini Bluetooth ELM327 OBD HH Car Diagnostic Scanner Functions:

Read diagnostic trouble codes, both generic and manufacturer-specific, and display their meaning (over 3000 generic code definitions in the database).

Clear trouble codes and turn off the MIL ("Check Engine" light)

Display current sensor data, including:

Engine RPM

Calculated Load Value

Coolant Temperature

Fuel System Status

Vehicle Speed

Short Term Fuel Trim

Long Term Fuel Trim

Intake Manifold Pressure

Timing Advance

Intake Air Temperature

Air Flow Rate

Absolute Throttle Position

Oxygen sensor voltages/associated short term fuel trims

Fuel System status

Fuel Pressure

Many others

Package Including:

1pc x ELM 327 OBD HH Mini Bluetooth V2.1

1pc x CD Driver

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock