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  • Categories: CPU and Graphic Chips
  • Categories: Pin Holder
  • Categories: Programmer
  • Categories: Programmer & Sockets
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SOP to PLCC 10 Adapter Programmer Sockets forTL866 RT809H

1. 150mil SOP8--DIP8 Adapter

2. 200mil-208mil SOP8--DIP8 Adapter

3. SOP16--DIP16 Adapter (300mil)

4 PLCC44--DIP40 Adapter

5. PLCC32--DIP32 Adapter

6. PLCC28--DIP24 Adapter

7. PLCC20--DIP20 Adapter

8. 8pin DIP SMD Adapter

9. SSOP28Pin 0.65mm Adapter Board

10. SOP28Pin 1.27mm Adapter Board

CH002799
€16.90

SOP to PLCC 10 Adapter Programmer Sockets forTL866 RT809H

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GF9300730IB2

GF-9300-730I-B2

Part Number GF-9300-730I-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0839

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001997
€16.41

GF-9300-730I-B2

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DH82QM87 QE98ES

DH82QM87 QE98ES

Part Number DH82QM87 QE98ES Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002001
€23.79

DH82QM87 QE98ES

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N11MOP1SA3 G210M

N11M-OP1-S-A3 G210M

Part Number N11M-OP1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002007
€16.85

N11M-OP1-S-A3 G210M

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SR0D6 i52467M

i5-2467M SR0D6

Part Number SR0D6 i5-2467M Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002009
€24.62

SR0D6 i5-2467M

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SR2F1 i76600U

SR2F1 i7-6600U

Part Number SR2F1 i7-6600U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 18+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002012
€270.77

SR2F1 i7-6600U

SOP to PLCC 10 Adapter Programmer Sockets forTL866 RT809H

1. 150mil SOP8--DIP8 Adapter

2. 200mil-208mil SOP8--DIP8 Adapter

3. SOP16--DIP16 Adapter (300mil)

4 PLCC44--DIP40 Adapter

5. PLCC32--DIP32 Adapter

6. PLCC28--DIP24 Adapter

7. PLCC20--DIP20 Adapter

8. 8pin DIP SMD Adapter

9. SSOP28Pin 0.65mm Adapter Board

10. SOP28Pin 1.27mm Adapter Board

CH002799
€16.90

SOP to PLCC 10 Adapter Programmer Sockets forTL866 RT809H

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GF9300730IB2

GF-9300-730I-B2

Part Number GF-9300-730I-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0839

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001997
€16.41

GF-9300-730I-B2

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DH82QM87 QE98ES

DH82QM87 QE98ES

Part Number DH82QM87 QE98ES Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002001
€23.79

DH82QM87 QE98ES

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N11MOP1SA3 G210M

N11M-OP1-S-A3 G210M

Part Number N11M-OP1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002007
€16.85

N11M-OP1-S-A3 G210M

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SR0D6 i52467M

i5-2467M SR0D6

Part Number SR0D6 i5-2467M Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002009
€24.62

SR0D6 i5-2467M

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SR2F1 i76600U

SR2F1 i7-6600U

Part Number SR2F1 i7-6600U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 18+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002012
€270.77

SR2F1 i7-6600U

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