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  • Categories: Other BGA Chips & ICs
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TS30A Short Killer PCB Short Circuit Fault Detector Box

Description:

New short killer box is an professional short-circuit Fault diagnosis instrument for mobile phone motherboard repair tool, Help the technician to judge the current interruption of the main board accurately and quickly, Short-circuit fault detection for various mobile phones and computers. Bring you a convenient short-circuit fault detection and repair experience, TS-30A TS-20A Short Killer PCB Short Circuit Fault Detector Box.

Features:

Overheating protrction

Ovrcurrent protection

Overvoltage protection

Sound prompt

Automatic recovery

Safe and efficient

Positive and negative-polarity recognition

Support output voltage 0-5.5v current 0-20A/0-30A

Short killer is good for detecing all kinds of short circuit

it can detect short circuits in seconds and fix it

it can be use to decect shortcircuit on any cellphone and laptop pcb

Short circuit restore

This pen can also be used on the multimeter

WARNING:

This box a large current output Long-term short-circuit test is strictly prohibited

CH001477
€73.35

TS-30A Short Killer PCB Short Circuit Fault Detector Box

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TI BQ20z451

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000839
€5.56

TI BQ20z451

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RICHTEK RT8243BZQW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000841
€3.45

RICHTEK RT8243BZQW

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RICHTEK RT8232AZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000842
€3.45

RICHTEK RT8232AZ

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Intersil ISL6268

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000844
€3.45

Intersil ISL6268

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Intersil ISL9563BHZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000845
€3.45

Intersil ISL9563BHZ

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SMSC MEC5004LNU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000846
€3.45

SMSC MEC5004L-NU

TS30A Short Killer PCB Short Circuit Fault Detector Box

Description:

New short killer box is an professional short-circuit Fault diagnosis instrument for mobile phone motherboard repair tool, Help the technician to judge the current interruption of the main board accurately and quickly, Short-circuit fault detection for various mobile phones and computers. Bring you a convenient short-circuit fault detection and repair experience, TS-30A TS-20A Short Killer PCB Short Circuit Fault Detector Box.

Features:

Overheating protrction

Ovrcurrent protection

Overvoltage protection

Sound prompt

Automatic recovery

Safe and efficient

Positive and negative-polarity recognition

Support output voltage 0-5.5v current 0-20A/0-30A

Short killer is good for detecing all kinds of short circuit

it can detect short circuits in seconds and fix it

it can be use to decect shortcircuit on any cellphone and laptop pcb

Short circuit restore

This pen can also be used on the multimeter

WARNING:

This box a large current output Long-term short-circuit test is strictly prohibited

CH001477
€73.35

TS-30A Short Killer PCB Short Circuit Fault Detector Box

wishlist
Compare

TI BQ20z451

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000839
€5.56

TI BQ20z451

wishlist
Compare

RICHTEK RT8243BZQW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000841
€3.45

RICHTEK RT8243BZQW

wishlist
Compare

RICHTEK RT8232AZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000842
€3.45

RICHTEK RT8232AZ

wishlist
Compare

Intersil ISL6268

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000844
€3.45

Intersil ISL6268

wishlist
Compare

Intersil ISL9563BHZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000845
€3.45

Intersil ISL9563BHZ

wishlist
Compare

SMSC MEC5004LNU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000846
€3.45

SMSC MEC5004L-NU

wishlist
Compare
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