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ENE KB9028Q C

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000801
€3.45

ENE KB9028Q C

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BGA24 to DIP8 Adapters for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 Sofi

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

the scope of delivery.

packing list:

1 * adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

BGA24 / TFBGA24 to DIP8 ic socket / adapter / Adaptor for 8X6 mm body width BGA chips

this adapter can be used on all long-term, such as willem, SKYPRO, TL866, TNM, SuperPro and so on.RT809H RT809F TL966CS TL866A TL866II EZP2010 EZP2013 willem SKYPRO TNM, SuperPro and so on.

size: 1.0 mm

applicable ic dimensions (REF.) 8X6 mm (4x6 & 5x5 size of the standards)

applicable body chip, BGA 24

BGA 24 can support the body of spi flash, for example, W25Q16, W25Q32, W25Q64, W25Q128, W25Q256 and so on.

CH002789
€48.00

BGA24 to DIP8 Adapters for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 Sofi

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PM8058

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000808
€3.45

PM8058

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SOP to PLCC 10 Adapter Programmer Sockets forTL866 RT809H

1. 150mil SOP8--DIP8 Adapter

2. 200mil-208mil SOP8--DIP8 Adapter

3. SOP16--DIP16 Adapter (300mil)

4 PLCC44--DIP40 Adapter

5. PLCC32--DIP32 Adapter

6. PLCC28--DIP24 Adapter

7. PLCC20--DIP20 Adapter

8. 8pin DIP SMD Adapter

9. SSOP28Pin 0.65mm Adapter Board

10. SOP28Pin 1.27mm Adapter Board

CH002799
€16.90

SOP to PLCC 10 Adapter Programmer Sockets forTL866 RT809H

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PM8921

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000812
€3.45

PM8921

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ICS 9LPR462AGLF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000819
€3.45

ICS 9LPR462AGLF

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Realtek ALC269 7x7

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000823
€3.45

Realtek ALC269 7x7

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Maxim MAX1634EAI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000824
€3.45

Maxim MAX1634EAI

ENE KB9028Q C

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000801
€3.45

ENE KB9028Q C

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BGA24 to DIP8 Adapters for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 Sofi

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

the scope of delivery.

packing list:

1 * adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

BGA24 / TFBGA24 to DIP8 ic socket / adapter / Adaptor for 8X6 mm body width BGA chips

this adapter can be used on all long-term, such as willem, SKYPRO, TL866, TNM, SuperPro and so on.RT809H RT809F TL966CS TL866A TL866II EZP2010 EZP2013 willem SKYPRO TNM, SuperPro and so on.

size: 1.0 mm

applicable ic dimensions (REF.) 8X6 mm (4x6 & 5x5 size of the standards)

applicable body chip, BGA 24

BGA 24 can support the body of spi flash, for example, W25Q16, W25Q32, W25Q64, W25Q128, W25Q256 and so on.

CH002789
€48.00

BGA24 to DIP8 Adapters for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 Sofi

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PM8058

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000808
€3.45

PM8058

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SOP to PLCC 10 Adapter Programmer Sockets forTL866 RT809H

1. 150mil SOP8--DIP8 Adapter

2. 200mil-208mil SOP8--DIP8 Adapter

3. SOP16--DIP16 Adapter (300mil)

4 PLCC44--DIP40 Adapter

5. PLCC32--DIP32 Adapter

6. PLCC28--DIP24 Adapter

7. PLCC20--DIP20 Adapter

8. 8pin DIP SMD Adapter

9. SSOP28Pin 0.65mm Adapter Board

10. SOP28Pin 1.27mm Adapter Board

CH002799
€16.90

SOP to PLCC 10 Adapter Programmer Sockets forTL866 RT809H

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PM8921

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000812
€3.45

PM8921

wishlist
Compare

ICS 9LPR462AGLF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000819
€3.45

ICS 9LPR462AGLF

wishlist
Compare

Realtek ALC269 7x7

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000823
€3.45

Realtek ALC269 7x7

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Compare

Maxim MAX1634EAI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000824
€3.45

Maxim MAX1634EAI

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