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2160728014 HD4500

216-0728014 HD4500

Part Number 216-0728014 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 400 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001973
€36.22

216-0728014 HD4500

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BGA24 to DIP8 Adapters for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 Sofi

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

the scope of delivery.

packing list:

1 * adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

BGA24 / TFBGA24 to DIP8 ic socket / adapter / Adaptor for 8X6 mm body width BGA chips

this adapter can be used on all long-term, such as willem, SKYPRO, TL866, TNM, SuperPro and so on.RT809H RT809F TL966CS TL866A TL866II EZP2010 EZP2013 willem SKYPRO TNM, SuperPro and so on.

size: 1.0 mm

applicable ic dimensions (REF.) 8X6 mm (4x6 & 5x5 size of the standards)

applicable body chip, BGA 24

BGA 24 can support the body of spi flash, for example, W25Q16, W25Q32, W25Q64, W25Q128, W25Q256 and so on.

CH002789
€48.00

BGA24 to DIP8 Adapters for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 Sofi

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N16VGMB1

N16V-GM-B1

Part Number N16V-GM-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001992
€25.44

N16V-GM-B1

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SOP to PLCC 10 Adapter Programmer Sockets forTL866 RT809H

1. 150mil SOP8--DIP8 Adapter

2. 200mil-208mil SOP8--DIP8 Adapter

3. SOP16--DIP16 Adapter (300mil)

4 PLCC44--DIP40 Adapter

5. PLCC32--DIP32 Adapter

6. PLCC28--DIP24 Adapter

7. PLCC20--DIP20 Adapter

8. 8pin DIP SMD Adapter

9. SSOP28Pin 0.65mm Adapter Board

10. SOP28Pin 1.27mm Adapter Board

CH002799
€16.90

SOP to PLCC 10 Adapter Programmer Sockets forTL866 RT809H

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GF9300730IB2

GF-9300-730I-B2

Part Number GF-9300-730I-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0839

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001997
€16.41

GF-9300-730I-B2

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DH82QM87 QE98ES

DH82QM87 QE98ES

Part Number DH82QM87 QE98ES Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002001
€23.79

DH82QM87 QE98ES

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N11MOP1SA3 G210M

N11M-OP1-S-A3 G210M

Part Number N11M-OP1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002007
€16.85

N11M-OP1-S-A3 G210M

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SR0D6 i52467M

i5-2467M SR0D6

Part Number SR0D6 i5-2467M Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002009
€24.62

SR0D6 i5-2467M

2160728014 HD4500

216-0728014 HD4500

Part Number 216-0728014 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 400 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001973
€36.22

216-0728014 HD4500

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BGA24 to DIP8 Adapters for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 Sofi

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

the scope of delivery.

packing list:

1 * adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

BGA24 / TFBGA24 to DIP8 ic socket / adapter / Adaptor for 8X6 mm body width BGA chips

this adapter can be used on all long-term, such as willem, SKYPRO, TL866, TNM, SuperPro and so on.RT809H RT809F TL966CS TL866A TL866II EZP2010 EZP2013 willem SKYPRO TNM, SuperPro and so on.

size: 1.0 mm

applicable ic dimensions (REF.) 8X6 mm (4x6 & 5x5 size of the standards)

applicable body chip, BGA 24

BGA 24 can support the body of spi flash, for example, W25Q16, W25Q32, W25Q64, W25Q128, W25Q256 and so on.

CH002789
€48.00

BGA24 to DIP8 Adapters for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 Sofi

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N16VGMB1

N16V-GM-B1

Part Number N16V-GM-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001992
€25.44

N16V-GM-B1

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SOP to PLCC 10 Adapter Programmer Sockets forTL866 RT809H

1. 150mil SOP8--DIP8 Adapter

2. 200mil-208mil SOP8--DIP8 Adapter

3. SOP16--DIP16 Adapter (300mil)

4 PLCC44--DIP40 Adapter

5. PLCC32--DIP32 Adapter

6. PLCC28--DIP24 Adapter

7. PLCC20--DIP20 Adapter

8. 8pin DIP SMD Adapter

9. SSOP28Pin 0.65mm Adapter Board

10. SOP28Pin 1.27mm Adapter Board

CH002799
€16.90

SOP to PLCC 10 Adapter Programmer Sockets forTL866 RT809H

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GF9300730IB2

GF-9300-730I-B2

Part Number GF-9300-730I-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0839

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001997
€16.41

GF-9300-730I-B2

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DH82QM87 QE98ES

DH82QM87 QE98ES

Part Number DH82QM87 QE98ES Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002001
€23.79

DH82QM87 QE98ES

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N11MOP1SA3 G210M

N11M-OP1-S-A3 G210M

Part Number N11M-OP1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002007
€16.85

N11M-OP1-S-A3 G210M

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SR0D6 i52467M

i5-2467M SR0D6

Part Number SR0D6 i5-2467M Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002009
€24.62

SR0D6 i5-2467M

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