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i74720HQ SR1Q8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000483
€8.70

i7-4720HQ SR1Q8 Stencil Template

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CPU FAN for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

CPU FAN for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

Description Brand new

Product Description

Product Type: CPU Fan for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

Power connection:4 Pins

Package: One piece CPU Fan (3-PIN)for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

Compatible Models & Part Numbers

for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

CH000484
€7.34

CPU FAN for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

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ENE KB9016QF A3

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000485
€3.97

ENE KB9016QF A3

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N14PGEOPA2

N14P-GE-OP-A2

Part Number N14P-GE-OP-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000486
€45.95

N14P-GE-OP-A2

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N4100 SR3S0 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000487
€14.92

N4100 SR3S0 Stencil Template 90*90

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N3450 SR2Z6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000488
€7.71

N3450 SR2Z6 Stencil Template

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Realtek RTL8110SBL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000489
€3.45

Realtek RTL8110SBL

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ATHEROS AR8131AL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000490
€3.45

ATHEROS AR8131-AL

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OBDII BreaK Out Box Protocol Detector Diagnostic Tool

OBDII Protocol Detector & Break Out Box mainly used car OBD line signal judgment and signal transfer. Using car fault diagnosis instrument can quickly determine car OBD signal receiving. Signal may not meet angle can take other signal transfer angle. Application is very convenient and solve risks across the line.

Features:

1. In the process of using decoder, error can be found and diagnosed OBD connector link.

2. You can monitor the OBD interface voltage and ground, showed low voltage. Display diagnostic stitching error.

3. Jump for OBD interface signals. Signal lines such as decoder of 7 to 15 vehicles online.

4. Rapid detection of OBD2 diagnostic connector whether every stitch of the normal communication.

5. Replace the battery, save the car data function. When replace the battery, plug OBD2 connector into the car, at the same time connect additional power to the control box, so that ensure vehicle data is not lost.

This OBDII Protocol Detector & Break Out Box has wide range of applications in diagnostics, key programming and chip tuning:

- To monitor data steam while performing test on vehicle using a Scantool. This makes it possible for you to both execute a test and simultaneously monitor the testing process.

- Display testing voltage on the car or truck

- Display communicating pin number

- Is an extension of OBD Diagnostic Link Connector (DLC)

Packing List:

1pc x Break Out Box Interface

1pc x OBD pin Cable

1pc x Box

CH000491
€60.92

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

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G84950A2

G84-950-A2

Part Number G84-950-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1215

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000492
€52.51

G84-950-A2

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Maxim MAX17030

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000493
€3.45

Maxim MAX17030

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GF100375A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000494
€5.59

GF100-375-A3 Stencil Template

i74720HQ SR1Q8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000483
€8.70

i7-4720HQ SR1Q8 Stencil Template

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Compare

CPU FAN for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

CPU FAN for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

Description Brand new

Product Description

Product Type: CPU Fan for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

Power connection:4 Pins

Package: One piece CPU Fan (3-PIN)for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

Compatible Models & Part Numbers

for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

CH000484
€7.34

CPU FAN for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

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Compare

ENE KB9016QF A3

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000485
€3.97

ENE KB9016QF A3

wishlist
Compare

N14PGEOPA2

N14P-GE-OP-A2

Part Number N14P-GE-OP-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000486
€45.95

N14P-GE-OP-A2

wishlist
Compare

N4100 SR3S0 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000487
€14.92

N4100 SR3S0 Stencil Template 90*90

wishlist
Compare

N3450 SR2Z6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000488
€7.71

N3450 SR2Z6 Stencil Template

wishlist
Compare

Realtek RTL8110SBL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000489
€3.45

Realtek RTL8110SBL

wishlist
Compare

ATHEROS AR8131AL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000490
€3.45

ATHEROS AR8131-AL

wishlist
Compare

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

OBDII Protocol Detector & Break Out Box mainly used car OBD line signal judgment and signal transfer. Using car fault diagnosis instrument can quickly determine car OBD signal receiving. Signal may not meet angle can take other signal transfer angle. Application is very convenient and solve risks across the line.

Features:

1. In the process of using decoder, error can be found and diagnosed OBD connector link.

2. You can monitor the OBD interface voltage and ground, showed low voltage. Display diagnostic stitching error.

3. Jump for OBD interface signals. Signal lines such as decoder of 7 to 15 vehicles online.

4. Rapid detection of OBD2 diagnostic connector whether every stitch of the normal communication.

5. Replace the battery, save the car data function. When replace the battery, plug OBD2 connector into the car, at the same time connect additional power to the control box, so that ensure vehicle data is not lost.

This OBDII Protocol Detector & Break Out Box has wide range of applications in diagnostics, key programming and chip tuning:

- To monitor data steam while performing test on vehicle using a Scantool. This makes it possible for you to both execute a test and simultaneously monitor the testing process.

- Display testing voltage on the car or truck

- Display communicating pin number

- Is an extension of OBD Diagnostic Link Connector (DLC)

Packing List:

1pc x Break Out Box Interface

1pc x OBD pin Cable

1pc x Box

CH000491
€60.92

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

wishlist
Compare

G84950A2

G84-950-A2

Part Number G84-950-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1215

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000492
€52.51

G84-950-A2

wishlist
Compare

Maxim MAX17030

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000493
€3.45

Maxim MAX17030

wishlist
Compare

GF100375A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000494
€5.59

GF100-375-A3 Stencil Template

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Compare
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