Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GL82B150 SR2C7

Part Number GL82B150 SR2C7 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0772000 HD5650

Part Number 216-0772000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N12M-GS2-S-A1 GT520M

Part Number N12M-GS2-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1510

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Please note: Due to too many models, the factory can only guarantee 95% model accuracy, about 5% error, please understand!

ATI 1100 / 1150 / RS485MC / 216TQA6AVA12FG 0.50

ATI 21515 / M64S / M72S / M82S / 216-0707011

ATI 216-0728018 / 0749001 / 0774009 0.50

ATI 215 0719090 / 8014 / 9042 0.50

ATI SB700 / RD780 / 2160674022 / 216-0674024 / 216-0674026 / 216-0752001 0.50

ATI RS800ME / RS600ME 0.50

Intel LE82GL960 / PM965 / GM965

Intel 945GM / 945PM / 82940GML / 943GML 0.50

Intel QG82 945GMS / 945GSE 0.50

Intel AC82PM45 / 82GM45 / 82GL40 / AC88CTPM 0.40

Intel NH82801GBM / GR / GB 0.60

Intel 82801HBM IBM 0.60

Intel BD82HM55 / BD82PM55 / BD82HM57

Intel AC82GS45 / AC82GS40 / LE82GS965

INTEL BD82HM65 / BD82HM67

NVidia NF G6150 / G6100 N A2 0.60

NVidia NF4 NA3 / NF4 A3 0.60

NVidia MCP67M / MCP6767MV / MCP77MV A2 0.50

GO7200 / 7300 / 7400N-A3 / 6200AGP / 630-A2 603 A2

NVIDIA NF 7100 / 6301 A2 0.50

nVidia G96 630 A1 / G96 600 A1

Nvidia G84 600 A2 / GO6200 / GO7600 / G86-730 / 750 / 770 0.60

Via VT8237A / 8235 0.60

Via C7M

Via VN896 / CN896 / P4M900 0.60

SIS M671 / M672 / 671DX 0.60

Universal 0.50

Universal 0.60

Universal 0.76

ATI 216 0697010 / 7020 / 0792006 0.50

SIS 756 0.60

MT5502ASNJ 0.50

ATI IXP460 0.50

QF9EES SR1W5 SR1SG 0.35mm

Intel i5-4200U i7-4500 SR1EB SR170 SR191 SR1EF SR16M

Nvidia GK107 N13P-GL-A1 N13M-GE1-B-A1

Intel i7-620M SLBTX i3-370M 0.4

Intel i5-2415M SR071 BGA1023 0.45

Nvidia N13M-GS-S-A2 N14M-GL-S-A2 0.50

Intel SR04S CPU i3-2310M BGA1023 SR109

Nvidia MCP79U-B2

Universal 0.30

ATI 215-0821056 0821060 0.50

Universal 0.40

ATI 218-0697010 0697020 0792006 0.50

Universal 0.45

Nvidia GK104-325-A2 0.50

SR1SF N2920

Part Number SR1SF N2920 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1342

Package/Case 240 PCS Description Original new

SR1SF N2920 FH8065301616203 Intel Pentium CPU BGA1170 1.86 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR1SG N2820

Part Number SR1SG N2820 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1342

Package/Case 240 PCS Description Original new

SR1SG N2820 FH8065301616603 Intel Pentium CPU BGA1170 2.13 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0732026

Part Number 216-0732026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 2009+

Package/Case 360 Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock