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  • Categories: BGA Reballing Kits, Stencils
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i32370M SR0DR Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001058
€9.97

i3-2370M SR0DR Stencil Template 90*90

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2180755113 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001071
€5.40

218-0755113 Stencil Template

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16MP Digital HDMI USB Microscopio Camera 40X simulfocal Trinocular Stereo Microscope

Image sensor: Sony CMOS 1 / 2.9 sensor

Video output: 1080p Full HD (HDMI output); 720p (USB output)

Sensor Size: 1 / 2.9 in

pixel size: 2.85 2.85m

Photo resolution: 4608 3456 (16 million pixels)

Video recording: Support 1080p video recording

Image snapshot: Support 1080p still photos

Photo format: JPEG

Lens type: Standard C / CS interface

Resolution: 1920x1080@30FPS; 720P 160@FPS;

Video output interface: HDMI/USB

Storage: TF memory card, maximum capacity 64g

PC Support: Support Windows XP / 7 / 8 / 10 system, PC software with measurement function (free)

Image scaling: 4.0xx zoom digital zoom

Image measurement: Support hayear software measurement

Language settings: Chinese, English, Japanese, French, German, Russian, Italian, Korean, Turkish

CH001614
€379.18

16MP Digital HDMI USB Microscopio Camera 4.0X simul-focal Trinocular Stereo Microscope

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i52557M SR0CS Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001075
€5.40

i5-2557M SR0CS Stencil Template

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N14MGLSA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001077
€5.40

N14M-GL-S-A2 Stencil Template

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H59457 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001082
€9.97

H59457 Stencil Template 90*90

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G98304U2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001092
€5.40

G98-304-U2 Stencil Template

i32370M SR0DR Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001058
€9.97

i3-2370M SR0DR Stencil Template 90*90

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LCD LED Screen Video Cable For Lenovo IdeaPad G500 G505 G510 DC02001PS00

Lenovo IdeaPad G500 G505 G510 For Integrated graphics FHD LCD LED Video Flex Cable DC02001PS00

Brand New and Tested 100% Working before shipment.

Model Part Number: DC02001PS00

Compatible model: Lenovo IdeaPad G500 G505 G510 Laptop

Package Include:

1 x LCD Cable For Lenovo IdeaPad G500 G505 G510

CH001599
€6.09

LCD LED Screen Video Cable For Lenovo IdeaPad G500 G505 G510 DC02001PS00

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2180755113 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001071
€5.40

218-0755113 Stencil Template

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Compare

16MP Digital HDMI USB Microscopio Camera 40X simulfocal Trinocular Stereo Microscope

Image sensor: Sony CMOS 1 / 2.9 sensor

Video output: 1080p Full HD (HDMI output); 720p (USB output)

Sensor Size: 1 / 2.9 in

pixel size: 2.85 2.85m

Photo resolution: 4608 3456 (16 million pixels)

Video recording: Support 1080p video recording

Image snapshot: Support 1080p still photos

Photo format: JPEG

Lens type: Standard C / CS interface

Resolution: 1920x1080@30FPS; 720P 160@FPS;

Video output interface: HDMI/USB

Storage: TF memory card, maximum capacity 64g

PC Support: Support Windows XP / 7 / 8 / 10 system, PC software with measurement function (free)

Image scaling: 4.0xx zoom digital zoom

Image measurement: Support hayear software measurement

Language settings: Chinese, English, Japanese, French, German, Russian, Italian, Korean, Turkish

CH001614
€379.18

16MP Digital HDMI USB Microscopio Camera 4.0X simul-focal Trinocular Stereo Microscope

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i52557M SR0CS Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001075
€5.40

i5-2557M SR0CS Stencil Template

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Compare

N14MGLSA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001077
€5.40

N14M-GL-S-A2 Stencil Template

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H59457 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001082
€9.97

H59457 Stencil Template 90*90

wishlist
Compare

G98304U2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001092
€5.40

G98-304-U2 Stencil Template

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