Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N16V-GM-B1

Part Number N16V-GM-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DC Power Jack Board for Ideapad

Item Description:

? Great Part to replace the broken and non working DC Power Jack Board for Lenovo Ideapad Yoga 11S 11S-5937 11S-59370514.

? This DC Power Jack Board is guaranteed to work.

Specifications:

? Unbranded / Generic / Aftermarket

? Brand new and high quality.

? Material:Plastic

? Color: Yellow

? Dimensions: 2 x 1.6 x 0.6 cm

Compatible with:

? Lenovo Ideapad Yoga 11

? Lenovo Ideapad Yoga 11S Series

? Lenovo Ideapad Yoga 11S-5937

? Lenovo Ideapad Yoga 11S-59370514

Package Includes:

? 1 x DC Power Jack Board for Lenovo Ideapad Yoga 11S 11S-5937 11S-59370514

? No instruction manual included. Professional Installation Skills Required

GF-9300-730I-B2

Part Number GF-9300-730I-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0839

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

HP/Compaq Business Notebook DC Power Jack Connector: NC6220, NC6230, NC8000, NW8000, NX5000

Compaq Presario V1000 Series DC Power Jack Connector: V1000 CTO, V1001AD, V1001AP, V1002AD, V1002AP, V1003AD, V1003AP, V1004, V1004AD, V1004AP, V1005AD, V1005AP, V1006AD, V1006AP, V1007AD, V1007AP, V1008AD, V1008AP, V1009AD, V1009AP, V1010AP, V1011AP, V1012AP, V1013AP, V1014AP, V1015AP, V1016AP, V1017AP, V1018AP, V1019AP, V1020AP, V1021AP, V1022AP, V1023AP, V1024AP, V1025AP, V1026AP, V1027AP, V1028AP, V1029AP, V1030AP, V1031AP, V1032AP, V1033AP, V1034AP, V1035AP, V1036AP, V1037AP, V1038AP, V1039AP, V1040AP, V1041AP, V1042AP, V1043xx, V1044AP, V1045AP, V1046AP, V1047AP, V1048AP, V1049AP, V1050AP, V1051AP, V1052AP, V1053AP, V1054AP, V1055AP, V1056AP, V1057AP, V1058AP, V1059AP, V1060AP, V1061AP, V1062AP, V1065AP, V1066AP, V1067AP, V1068AP, V1069AP, V1070AP, V1071AP, V1072AP, V1073AP, V1074AP, V1075AP, V1100 CTO, V1101AP, V1102AP, V1103AP, V1104AP, V1105AP, V1106AP, V1107AP, V1108AP, V1109AP, V1110AP, V1111AP, V1112AP, V1113AP, V1114AP, V1115AP, V1116AP, V1117AP, V1118AP, V1119AP, V1120AP, V1121AP, V1122AP, V1123AP, V1124AP, V1125AP, V1126AP, V1127AP, V1128AP, V1129AP, V1130AP, V1131AP, V1132AP, V1133AP, V1134AP

DH82QM87 QE98ES

Part Number DH82QM87 QE98ES Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Compatible Models: FOR LENOVO G50-70 G50-80 G50-85 G50-90, #VJ-20

Package included

1 x DC Power Jack

N11M-OP1-S-A3 G210M

Part Number N11M-OP1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Dell Latitude DC Power Jack Connector: C-Series, CP, CPi, CPiA, CPiD, CPiR, CPm, CPt, CPtC, CPtS, CPtV, CPx, CPxH, CPxJ, CS, CSR, CSX, C400, C500, C510, C540, C600, C610, C640, C800, C805, C810, C840, C-Dock, C-Port, V700, V710, V740, Xpi 133ST, Xpi 75, Xpi CD, Xpi P100SD, XPi P133

Dell Inspiron DC Power Jack Connector: 1100, 2500, 2600, 2650, 3650, 3700, 3800, 4000, 4100, 4150, 5000, 5000E, 5100, 7500, 8000, 8100, 8200

Dell Precision Workstation DC Power Jack Connector: M40, M50

i5-2467M SR0D6

Part Number SR0D6 i5-2467M Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR2F1 i7-6600U

Part Number SR2F1 i7-6600U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 18+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0774007

Part Number 216-0774007 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock