Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description:

1 - Flat printed circuit connector (30 Pin)

COMPATIBILITY:

MacBook Unibody 13" A1278

MacBook5,1 Late 2008: MB466LL/A (2.0 GHz Core 2 Duo)

MacBook5,1 Late 2008: MB467LL/A (2.4 GHz Core 2 Duo)

MacBook Unibody 13" A1342

MacBook6,1 Late 2009: MC207LL/A (2.26 GHz Core 2 Duo)

MacBook7,1 Mid 2010: MC516LL/A (2.4 GHz Core 2 Duo)

MacBook Pro Unibody 13" A1278

MacBookPro5,5 Mid 2009: MB990LL/A (2.26 GHz Core 2 Duo)

MacBookPro5,5 Mid 2009: MB991LL/A (2.53 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC374LL/A (2.4 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC375LL/A (2.66 GHz Core 2 Duo)

MacBookPro8,1 Early 2011: MC700LL/A (2.3 GHz Core i5)

MacBookPro8,1 Early 2011: MC724LL/A (2.7 GHz Core i7)

MacBookPro8,1 Late 2011: MD313LL/A (2.4 GHz Core i5)

MacBookPro8,1 Late 2011: MD314LL/A (2.8 GHz Core i7)

MacBookPro9,2 Mid 2012: MD101LL/A (2.5 GHz Core i5)

MacBookPro9,2 Mid 2012: MD102LL/A (2.9 GHz Core i7)

MacBook Pro Unibody 15" A1286

MacBookPro5,1 Late 2008: MB470LL/A (2.4 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.53 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB985LL/A (2.66 Ghz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (3.06 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MC406LL/A (2.8 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,3 Mid 2009: MC406LL/A (3.06 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,4 Mid 2009: MC118LL/A (2.53 GHz Core 2 Duo)

MacBookPro6,2 Mid 2010: MC371LL/A (2.4 GHz Core i5)

MacBookPro6,2 Mid 2010: MC372LL/A (2.53 GHz Core i5)

MacBookPro6,2 Mid 2010: MC373LL/A (2.66 GHz Core i7)

MacBookPro6,2 Mid 2010: MC373LL/A (2.8 GHZ Core i7)

MacBookPro8,2 Early 2011: MC721LL/A (2.0 GHz Core i7)

MacBookPro8,2 Early 2011: MC723LL/A (2.2 GHz Core i7)

MacBookPro8,2 Early 2011: MD035LL/A (2.3 GHz Core i7)

MacBookPro8,2 Late 2011: MD318LL/A (2.2 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.4 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.5 GHz Core i7)

MacBookPro9,1 Mid 2012: MD103LL/A (2.3 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.6 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.7 GHz Core i7)

MacBook Pro Unibody 17" A1297

MacBookPro5,2 Early 2009: MB604LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,2 Early 2009: MB604LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (3.06 GHz Core 2 Duo)

MacBookPro6,1 Mid 2010: MC024LL/A (2.53 GHz Core i5)

MacBookPro6,1 Mid 2010: MC024LL/A (2.66 GHz Core i7)

MacBookPro6,1 Mid 2010: MC024LL/A (2.8 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.2 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.3 GHz Core i7)

MacBookPro8,3 Late 2011: MD311LL/A (2.4 GHz Core i7)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Lenovo G500s G505s p/n: DC02001QI10 90202878 90202880 DC02001RR10 902028

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock