SR2EY i5-6200U

Part Number i5-6200U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Lenovo B570 B575 V570 P/N: 50.4lH07.002 50.4IH07.002 50.4IH07.032

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

AM5545HE44HL A8-5545M

Part Number AM5545HE44HL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

AM5545HE44HL A8-5545M Processor for Laptop AMD A-Series BGA827 1.7 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N12E-GE2-B-A1 GT555M

Part Number N12E-GE2-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1047

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description:

1 - Flat printed circuit connector (30 Pin)

COMPATIBILITY:

MacBook Unibody 13" A1278

MacBook5,1 Late 2008: MB466LL/A (2.0 GHz Core 2 Duo)

MacBook5,1 Late 2008: MB467LL/A (2.4 GHz Core 2 Duo)

MacBook Unibody 13" A1342

MacBook6,1 Late 2009: MC207LL/A (2.26 GHz Core 2 Duo)

MacBook7,1 Mid 2010: MC516LL/A (2.4 GHz Core 2 Duo)

MacBook Pro Unibody 13" A1278

MacBookPro5,5 Mid 2009: MB990LL/A (2.26 GHz Core 2 Duo)

MacBookPro5,5 Mid 2009: MB991LL/A (2.53 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC374LL/A (2.4 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC375LL/A (2.66 GHz Core 2 Duo)

MacBookPro8,1 Early 2011: MC700LL/A (2.3 GHz Core i5)

MacBookPro8,1 Early 2011: MC724LL/A (2.7 GHz Core i7)

MacBookPro8,1 Late 2011: MD313LL/A (2.4 GHz Core i5)

MacBookPro8,1 Late 2011: MD314LL/A (2.8 GHz Core i7)

MacBookPro9,2 Mid 2012: MD101LL/A (2.5 GHz Core i5)

MacBookPro9,2 Mid 2012: MD102LL/A (2.9 GHz Core i7)

MacBook Pro Unibody 15" A1286

MacBookPro5,1 Late 2008: MB470LL/A (2.4 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.53 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB985LL/A (2.66 Ghz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (3.06 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MC406LL/A (2.8 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,3 Mid 2009: MC406LL/A (3.06 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,4 Mid 2009: MC118LL/A (2.53 GHz Core 2 Duo)

MacBookPro6,2 Mid 2010: MC371LL/A (2.4 GHz Core i5)

MacBookPro6,2 Mid 2010: MC372LL/A (2.53 GHz Core i5)

MacBookPro6,2 Mid 2010: MC373LL/A (2.66 GHz Core i7)

MacBookPro6,2 Mid 2010: MC373LL/A (2.8 GHZ Core i7)

MacBookPro8,2 Early 2011: MC721LL/A (2.0 GHz Core i7)

MacBookPro8,2 Early 2011: MC723LL/A (2.2 GHz Core i7)

MacBookPro8,2 Early 2011: MD035LL/A (2.3 GHz Core i7)

MacBookPro8,2 Late 2011: MD318LL/A (2.2 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.4 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.5 GHz Core i7)

MacBookPro9,1 Mid 2012: MD103LL/A (2.3 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.6 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.7 GHz Core i7)

MacBook Pro Unibody 17" A1297

MacBookPro5,2 Early 2009: MB604LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,2 Early 2009: MB604LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (3.06 GHz Core 2 Duo)

MacBookPro6,1 Mid 2010: MC024LL/A (2.53 GHz Core i5)

MacBookPro6,1 Mid 2010: MC024LL/A (2.66 GHz Core i7)

MacBookPro6,1 Mid 2010: MC024LL/A (2.8 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.2 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.3 GHz Core i7)

MacBookPro8,3 Late 2011: MD311LL/A (2.4 GHz Core i7)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Lenovo G500s G505s p/n: DC02001QI10 90202878 90202880 DC02001RR10 902028

G98-634-U2

Part Number G98-634-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1135

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N13M-GE-B-A2

Part Number N13M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock