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  • Categories: Bios Chip Programming
  • Categories: DC Jacks, Connector
  • Categories: Other BGA Chips & ICs
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MXIC MX25L1605DM2I

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000659
€3.45

MXIC MX25L1605DM2I

  • -20%
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A1398 EMC 2512 Bios Chip EFI Firmware 820-3332 Retina Mid2012 Core i7 I73720QM MC976LLA

PO000111
€18.00 €22.50

A1398 EMC 2512 Bios EFI Firmware 820-3332 Retina Mid-2012 Core i7 I7-3720QM MC976LL/A

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DC Power Jack Part PJ006

2.0mm

Gateway DC Power Jack Connector: M500, M505

2.5mm

Toshiba Satellite DC Power Jack Connector: 1105, 1110-S153, 1115-S103, 1115-S104, 1115-S107, 1115-S123

HP Pavilion DC Power Jack Connector: N5415, N5425 and others from the N54xx Series that use this type shield

IBM DC Power Jack Connector: R30, R31, R32

CH003680
€7.21

DC Power Jack, Part #PJ006

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BGEE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000661
€3.45

BG=EE

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SIS 630S

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000664
€15.89

SIS 630S

  • -20%
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A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73635QM ME664LLA

PO000113
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3635QM ME664LL/A

  • -20%
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A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73740QM ME665LLA

PO000114
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3740QM ME665LL/A

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Realtek RTL8101L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000672
€3.45

Realtek RTL8101L

MXIC MX25L1605DM2I

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000659
€3.45

MXIC MX25L1605DM2I

wishlist
Compare
  • -20%

A1398 EMC 2512 Bios Chip EFI Firmware 820-3332 Retina Mid2012 Core i7 I73720QM MC976LLA

PO000111
€18.00 €22.50

A1398 EMC 2512 Bios EFI Firmware 820-3332 Retina Mid-2012 Core i7 I7-3720QM MC976LL/A

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DC Power Jack Part PJ006

2.0mm

Gateway DC Power Jack Connector: M500, M505

2.5mm

Toshiba Satellite DC Power Jack Connector: 1105, 1110-S153, 1115-S103, 1115-S104, 1115-S107, 1115-S123

HP Pavilion DC Power Jack Connector: N5415, N5425 and others from the N54xx Series that use this type shield

IBM DC Power Jack Connector: R30, R31, R32

CH003680
€7.21

DC Power Jack, Part #PJ006

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BGEE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000661
€3.45

BG=EE

wishlist
Compare

SIS 630S

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000664
€15.89

SIS 630S

wishlist
Compare
  • -20%

A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73635QM ME664LLA

PO000113
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3635QM ME664LL/A

wishlist
Compare
  • -20%

A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73740QM ME665LLA

PO000114
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3740QM ME665LL/A

wishlist
Compare

Realtek RTL8101L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000672
€3.45

Realtek RTL8101L

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