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  • Categories: CPU and Graphic Chips
  • Categories: DC Jacks, Connector
  • Categories: Pin Holder
  • Categories: Programmer & Sockets
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QFP64 to DIP64 CHIP PROGRAMMER SOCKET QFP6405REV2 TypeU adapter socket

Model:

QFP64/LQFP64/TQFP64-0.5 (compatible with XWDZ-QFP64-0.5/FPQ-64-0.5-06)

Product use:

Programming block and test stand, burning and testing the IC chip of QFP64.

Suitable for packaging:

QFP64 LQFP64 TQFP64 CQFP64 pin Pitch 0.5mm

Characteristic:

The bottom pin is fully led out by the chip, which is convenient for the two development.

Overall size of the seat:

Long 57mm, wide 50mm

Common: STM32 QFP64 encapsulation

STM32L1xxR series (e.g. STM32L151R8, STM32L152RB)

STM32F0xxR series (e.g. STM32F051RC, STM32F051RB)

STM32F1xxR series (e.g. STM32F103RC, STM32F100RB)

STM32F2xxR series (e.g. STM32F207RC, STM32F215RB)

STM32F3xxR series (e.g. STM32F303R8, STM32F373RB)

STM32F4xxR series (e.g. STM32F407RC, STM32F415RB)

CH001970
€28.00

QFP64 to DIP64 CHIP PROGRAMMER SOCKET QFP64-0.5-REV2 Type-U adapter socket

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1.8V Conversion Block 25 series low voltage chip adapter Apple LCD Tablet PC BIOS

Adapt to

Winbond:

W25Q10EW, W25Q20EW, W25Q20BW, W25Q40EW, W25Q40BW, W25Q80EW, W25Q80BW, W25Q16DW, W25Q16FW, W25Q32DW, W25Q32FW, W25Q64DW, W25Q64FW, W25F128FW...

MXIC:

MX25U5121E,MX25R512F,MX25U1001E,MX25R1035F,MX25U2033E,MX25R2035F,MX25U4035,

MX25U4033E,MX25U4032E,MX25R4035F,MX25U8035,MX25U8035E,MX25U8033E,MX25U8032E,

MX25R8035F,MX25U1635E,MX25V1635F,MX25U1635F,MX25R1635F,MX25U3235E,MX25U3235F,

MX25R3235F,MX25U6473F,MX25U6435F,MX25R6435F,MX25U12873F,MX25U12835F,

MX25U25635F,MX25U51245G,MX25UM51245G,MX66U51235F...

CH000087
€4.96

1.8V Conversion Block 25 series low voltage chip adapter Apple LCD Tablet PC BIOS

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N12EGE2BA1 GT555M

N12E-GE2-B-A1 GT555M

Part Number N12E-GE2-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1047

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001508
€45.95

N12E-GE2-B-A1 GT555M

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RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA100-01 V2.5

1pcs x Frame 14x18

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH001979
€89.00

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

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G98634U2

G98-634-U2

Part Number G98-634-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1135

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001522
€6.56

G98-634-U2

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N13MGEBA2

N13M-GE-B-A2

Part Number N13M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001530
€25.93

N13M-GE-B-A2

QFP64 to DIP64 CHIP PROGRAMMER SOCKET QFP6405REV2 TypeU adapter socket

Model:

QFP64/LQFP64/TQFP64-0.5 (compatible with XWDZ-QFP64-0.5/FPQ-64-0.5-06)

Product use:

Programming block and test stand, burning and testing the IC chip of QFP64.

Suitable for packaging:

QFP64 LQFP64 TQFP64 CQFP64 pin Pitch 0.5mm

Characteristic:

The bottom pin is fully led out by the chip, which is convenient for the two development.

Overall size of the seat:

Long 57mm, wide 50mm

Common: STM32 QFP64 encapsulation

STM32L1xxR series (e.g. STM32L151R8, STM32L152RB)

STM32F0xxR series (e.g. STM32F051RC, STM32F051RB)

STM32F1xxR series (e.g. STM32F103RC, STM32F100RB)

STM32F2xxR series (e.g. STM32F207RC, STM32F215RB)

STM32F3xxR series (e.g. STM32F303R8, STM32F373RB)

STM32F4xxR series (e.g. STM32F407RC, STM32F415RB)

CH001970
€28.00

QFP64 to DIP64 CHIP PROGRAMMER SOCKET QFP64-0.5-REV2 Type-U adapter socket

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1.8V Conversion Block 25 series low voltage chip adapter Apple LCD Tablet PC BIOS

Adapt to

Winbond:

W25Q10EW, W25Q20EW, W25Q20BW, W25Q40EW, W25Q40BW, W25Q80EW, W25Q80BW, W25Q16DW, W25Q16FW, W25Q32DW, W25Q32FW, W25Q64DW, W25Q64FW, W25F128FW...

MXIC:

MX25U5121E,MX25R512F,MX25U1001E,MX25R1035F,MX25U2033E,MX25R2035F,MX25U4035,

MX25U4033E,MX25U4032E,MX25R4035F,MX25U8035,MX25U8035E,MX25U8033E,MX25U8032E,

MX25R8035F,MX25U1635E,MX25V1635F,MX25U1635F,MX25R1635F,MX25U3235E,MX25U3235F,

MX25R3235F,MX25U6473F,MX25U6435F,MX25R6435F,MX25U12873F,MX25U12835F,

MX25U25635F,MX25U51245G,MX25UM51245G,MX66U51235F...

CH000087
€4.96

1.8V Conversion Block 25 series low voltage chip adapter Apple LCD Tablet PC BIOS

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N12EGE2BA1 GT555M

N12E-GE2-B-A1 GT555M

Part Number N12E-GE2-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1047

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001508
€45.95

N12E-GE2-B-A1 GT555M

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RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA100-01 V2.5

1pcs x Frame 14x18

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH001979
€89.00

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

wishlist
Compare

G98634U2

G98-634-U2

Part Number G98-634-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1135

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001522
€6.56

G98-634-U2

wishlist
Compare

N13MGEBA2

N13M-GE-B-A2

Part Number N13M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001530
€25.93

N13M-GE-B-A2

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