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  • Categories: Other BGA Chips & ICs
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16MP Digital HDMI USB Microscopio Camera 40X simulfocal Trinocular Stereo Microscope

Image sensor: Sony CMOS 1 / 2.9 sensor

Video output: 1080p Full HD (HDMI output); 720p (USB output)

Sensor Size: 1 / 2.9 in

pixel size: 2.85 2.85m

Photo resolution: 4608 3456 (16 million pixels)

Video recording: Support 1080p video recording

Image snapshot: Support 1080p still photos

Photo format: JPEG

Lens type: Standard C / CS interface

Resolution: 1920x1080@30FPS; 720P 160@FPS;

Video output interface: HDMI/USB

Storage: TF memory card, maximum capacity 64g

PC Support: Support Windows XP / 7 / 8 / 10 system, PC software with measurement function (free)

Image scaling: 4.0xx zoom digital zoom

Image measurement: Support hayear software measurement

Language settings: Chinese, English, Japanese, French, German, Russian, Italian, Korean, Turkish

CH001614
€379.18

16MP Digital HDMI USB Microscopio Camera 4.0X simul-focal Trinocular Stereo Microscope

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SiliconLa SL1052 Silego

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000865
€3.45

SiliconLa SL1052 Silego

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SIS M672

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000872
€9.53

SIS M672

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Realtek RTL8271B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000873
€3.45

Realtek RTL8271B

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15m S993A S995A Pump Solder Sucker Gun Suction nozzle

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001631
€8.58

1.5m S-993A S-995A Pump Solder Sucker Gun Suction nozzle

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ICS 9LPRS387BKLF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000874
€3.45

ICS 9LPRS387BKLF

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OZMICRO OZ8384LN

OZMICRO OZ8384LN

Part Number OZ8384LN Manufacturer OZMICRO

QFN No Pb/Lead Free Date Code 1117

Package/Case 2000 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000875
€3.45

OZMICRO OZ8384LN

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MPC5554MZP132 FREESCALE BGA416

MPC5554MZP132 FREESCALE BGA416

Part Number MPC5554MZP132 Manufacturer FREESCALE

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000876
€48.00

MPC5554MZP132 FREESCALE BGA416

16MP Digital HDMI USB Microscopio Camera 40X simulfocal Trinocular Stereo Microscope

Image sensor: Sony CMOS 1 / 2.9 sensor

Video output: 1080p Full HD (HDMI output); 720p (USB output)

Sensor Size: 1 / 2.9 in

pixel size: 2.85 2.85m

Photo resolution: 4608 3456 (16 million pixels)

Video recording: Support 1080p video recording

Image snapshot: Support 1080p still photos

Photo format: JPEG

Lens type: Standard C / CS interface

Resolution: 1920x1080@30FPS; 720P 160@FPS;

Video output interface: HDMI/USB

Storage: TF memory card, maximum capacity 64g

PC Support: Support Windows XP / 7 / 8 / 10 system, PC software with measurement function (free)

Image scaling: 4.0xx zoom digital zoom

Image measurement: Support hayear software measurement

Language settings: Chinese, English, Japanese, French, German, Russian, Italian, Korean, Turkish

CH001614
€379.18

16MP Digital HDMI USB Microscopio Camera 4.0X simul-focal Trinocular Stereo Microscope

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SiliconLa SL1052 Silego

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000865
€3.45

SiliconLa SL1052 Silego

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Compare

SIS M672

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000872
€9.53

SIS M672

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Compare

Realtek RTL8271B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000873
€3.45

Realtek RTL8271B

wishlist
Compare

15m S993A S995A Pump Solder Sucker Gun Suction nozzle

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001631
€8.58

1.5m S-993A S-995A Pump Solder Sucker Gun Suction nozzle

wishlist
Compare

ICS 9LPRS387BKLF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000874
€3.45

ICS 9LPRS387BKLF

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Compare

OZMICRO OZ8384LN

OZMICRO OZ8384LN

Part Number OZ8384LN Manufacturer OZMICRO

QFN No Pb/Lead Free Date Code 1117

Package/Case 2000 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000875
€3.45

OZMICRO OZ8384LN

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Compare

MPC5554MZP132 FREESCALE BGA416

MPC5554MZP132 FREESCALE BGA416

Part Number MPC5554MZP132 Manufacturer FREESCALE

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000876
€48.00

MPC5554MZP132 FREESCALE BGA416

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