N10M-GLM-S-A3

Part Number N10M-GLM-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1015

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

ELM327 HH Android Bluetooth OBD 2 OBD II Diagnostic Scan Tool elm 327 Scanner

Login to Download: Download software

V2.1 Mini Bluetooth ELM327 OBD HH OBDII Protocolos OBD2 Car Diagnostic Scanner

Top 5 Reasons to Get V2.1 Mini Bluetooth ELM327 OBD HH:

1.This is a vehicle diagnostic tool interface scanner, which is is used to read trouble codes, clear trouble codes and detect fuel pressure and so on.

2.OBDII Software for ELM327 is a free program that allows you to use your PC and a hardware interface to get the information from your car's computer.

3.The program is very user-friendly, and easy to learn. It is also very easy to install: simply extract the files into a folder on your computer's hard drive, and you're ready to go.

4. To uninstall the program, simply delete the entire contents of the folder where the program resides.

5.The software supports four platforms - For DOS/Windows/Android. This product is a non-oem, generic product.

Notice: This device can't work with IOS system.

Mini Bluetooth ELM327 is the newly developed wireless scan tool. It supports all OBD-II protocols:

? Works with all OBD-II compliant vehicles

? Wireless (Bluetooth)

? Software included for Palm, PDA

? Software included for Windows PC

? Software included for Windows Smartphone

? Supports ISO 9141, KWP2000

? Supports SAE J1850

? Supports CAN bus

V2.1 Mini Bluetooth ELM327 OBD HH Car Diagnostic Scanner Specification:

Support OBD-II protocols as follows: * ISO15765-4 (CAN) * ISO14230-4 (KWP2000) * ISO9141-2 * J1850 VPW * J1850 PWM

SAE J1850 PWM (41.6 kbaud)

SAE J1850 VPW (10.4 kbaud)

ISO 9141-2 (5 baud init, 10.4 kbaud)

ISO 14230-4 KWP (5 baud init, 10.4 kbaud)

ISO 14230-4 KWP (fast init, 10.4 kbaud)

ISO 15765-4 CAN (11 bit ID, 500 kbaud)

ISO 15765-4 CAN (29 bit ID, 500 kbaud)

ISO 15765-4 CAN (11 bit ID, 250 kbaud)

ISO 15765-4 CAN (29 bit ID, 250 kbaud)

Device type: Car bluetooth read interface scanner

Interface type: Auto ELM327 V1.5 interface

V2.1 Mini Bluetooth ELM327 OBD HH Car Diagnostic Scanner Free Software:

1. Scantool.net

2. GM Mode 22 Scan Tool by Terry

3. OBD Gauge for PalmOS and Pocket PC by Dana Peters

4. OBD Logger by Jonathan Senkerik

5. OBD-II ScanMaster by Wladimir Gurskij (ScanMaster 3.52 - local copy)

6. obd2crazy.com

7. OBD2 Scantool by Ivan Andrewjeski

8. OBDII for ELM322 by David Huffman

9. pyOBD by Donour Sizemore for MacOSX and Linux

10. RDDTC by Pete Calinski

11. Real Scan by Brent Harris

12. ScanTest for Pocket PC by Ivan Ganev aka a-ser

13. OBD by WDT

V2.1 Mini Bluetooth ELM327 OBD HH Car Diagnostic Scanner Functions:

Read diagnostic trouble codes, both generic and manufacturer-specific, and display their meaning (over 3000 generic code definitions in the database).

Clear trouble codes and turn off the MIL ("Check Engine" light)

Display current sensor data, including:

Engine RPM

Calculated Load Value

Coolant Temperature

Fuel System Status

Vehicle Speed

Short Term Fuel Trim

Long Term Fuel Trim

Intake Manifold Pressure

Timing Advance

Intake Air Temperature

Air Flow Rate

Absolute Throttle Position

Oxygen sensor voltages/associated short term fuel trims

Fuel System status

Fuel Pressure

Many others

Package Including:

1pc x ELM 327 OBD HH Mini Bluetooth V2.1

1pc x CD Driver

216-0728014 HD4500

Part Number 216-0728014 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 400 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

the scope of delivery.

packing list:

1 * adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

BGA24 / TFBGA24 to DIP8 ic socket / adapter / Adaptor for 8X6 mm body width BGA chips

this adapter can be used on all long-term, such as willem, SKYPRO, TL866, TNM, SuperPro and so on.RT809H RT809F TL966CS TL866A TL866II EZP2010 EZP2013 willem SKYPRO TNM, SuperPro and so on.

size: 1.0 mm

applicable ic dimensions (REF.) 8X6 mm (4x6 & 5x5 size of the standards)

applicable body chip, BGA 24

BGA 24 can support the body of spi flash, for example, W25Q16, W25Q32, W25Q64, W25Q128, W25Q256 and so on.

N16V-GM-B1

Part Number N16V-GM-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

1. 150mil SOP8--DIP8 Adapter

2. 200mil-208mil SOP8--DIP8 Adapter

3. SOP16--DIP16 Adapter (300mil)

4 PLCC44--DIP40 Adapter

5. PLCC32--DIP32 Adapter

6. PLCC28--DIP24 Adapter

7. PLCC20--DIP20 Adapter

8. 8pin DIP SMD Adapter

9. SSOP28Pin 0.65mm Adapter Board

10. SOP28Pin 1.27mm Adapter Board

GF-9300-730I-B2

Part Number GF-9300-730I-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0839

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Package type FBGA64

Adapter type COVER

SA245A-B4805 Adapter for XELTEK SuperPro 610P 611S

DH82QM87 QE98ES

Part Number DH82QM87 QE98ES Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX3007 Adapter for XELTEK SuperPro 6100N

N11M-OP1-S-A3 G210M

Part Number N11M-OP1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock