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  • Brand: Andk Kzt Hmilu
  • Brand: Chipsetpro.com
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  • Brand: Winbond & Macronix
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Diodes APL3510BXI TRG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000542
€3.45

Diodes APL3510BXI TRG

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GF106150A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000544
€5.40

GF106-150-A1 Stencil Template

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i73517U SR0N6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000545
€5.40

i7-3517U SR0N6 Stencil Template

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Realtek RTL8100CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000546
€3.45

Realtek RTL8100CL

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ITE IT8572E AXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000547
€3.45

ITE IT8572E AXS

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TOP3000 Universal Programmer for MCU and EPROMs Programming ECU Chip Tunning

TOP3000 Auto Car Universal Programmer for MCU and EPROMs programming ECU Chip Tunning Tool

Login to Download: Download software

Specifications:

? Power supply input: 110 ~ 240VAC, 50/60Hz

? Power output: 5VDC, 2A

? Included: TOP3000 programmer,software CD, USB cable, power supply cable

Benefits:

? The TOP3000 programmer supports 2.5 ~ 6.5V devices

? Powered by your USB interface or the included 5V external power supply

? Fast transmission speed of 12MHz/s via the USB port

? Auto detects the device's manufacturer and part number

? Compatible with Notebooks and desktop computers

? The in-built connection inspection checks the connection for every pins in the unit

? Current protection function protects both the programmer and connected devices

? Has 48-pin self-lock sockets

? Compact programmer with tough plastic casing

Supports:

Actrans (EEPROM)

AMD (PLD, MPU, EPROM, EEPROM)

AMIC (EEPROM)

ASD (EEPROM)

Atmel (PLD, MPU, EPROM, EEPROM)

BDTIC (RAM)

Catalyst (EPROM, EEPROM)

Crescentec (MPU)

Dallas (RAM, MPU, EEPROM)

Elan (MPU)

EON (EEPROM)

EXEL (EEPROM)

Fujitsu (EPROM, EEPROM)

Future (MPU)

Hitachi (EPROM, EEPROM)

HMWIN (MPU)

Holtek (MPU)

Hynix (EEPROM)

Hyundai (EPROM)

ICT (EPROM)

Intel (MPU, RAM, EPROM, EEPROM)

ISSI (MPU, EEPROM)

Lattice (PLD)

LG (MPU)

Linksmart (EEPROM)

Macronix (EEPROM)

Matsushita (EPROM)

Megawin (MPU)

Micon (MPU)

Microchip (MPU, EPROM, EEPROM)

Mitsubishi (EPROM, EEPROM)

Mosel (MPU, EEPROM)

MXIC (EPROM, EEPROM)

NEC (EPROM, EEPROM)

NS (PLD, EPROM)

OKI (EPROM, EEPROM)

PDK (MPU)

Philips (MPU)

PMC (EEPROM)

PTC (EEPROM)

Ricoh (EPROM)

Samsung (MPU, EPROM, EEPROM)

SEEQ (EPROM, EEPROM)

SGS Thomson (PLD, EPROM, EEPROM)

Signetics (EPROM)

SMOS (EPROM

Sony (EPROM)

Sonix (MPU)

Spansion (EEPROM)

SST (MPU, EEPROM)

ST (EPROM, EEPROM)

STC (MPU)

Stand (RAM)

Syncmos (MPU, EEPROM)

TI (EPROM, EEPROM)

Topro (MPU)

Toptek (MPU)

Toshiba (EPROM, EEPROM)

Versachip (MPU)

VLSI (PLD, EPROM, EEPROM)

Winbond (MPU, RAM, EEPROM)

WSI (EPROM)

Xicor (EEPROM)

Package Include:

1pc x TOP3000 universal programmer

1pc x USB 2.0 cable (USB 1.1 compatible)

1pc x 5V/2A AC adapter

1pc x TOPwin software CD

1pc x English User Manual

CH000548
€98.21

TOP3000 Universal Programmer for MCU and EPROMs Programming ECU Chip Tunning

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88E1145BBM MARVELL

88E1145-BBM MARVELL

Part Number 88E1145-BBM Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000549
€10.33

88E1145-BBM MARVELL

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N14MGEBA2

N14M-GE-B-A2

Part Number N14M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000550
€25.93

N14M-GE-B-A2

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SR23Y i55200U

SR23Y i5-5200U

Part Number SR23Y i5-5200U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000551
€177.23

SR23Y i5-5200U

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GK110425B1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000552
€6.22

GK110-425-B1 Stencil Template

Diodes APL3510BXI TRG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000542
€3.45

Diodes APL3510BXI TRG

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GF106150A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000544
€5.40

GF106-150-A1 Stencil Template

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i73517U SR0N6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000545
€5.40

i7-3517U SR0N6 Stencil Template

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Realtek RTL8100CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000546
€3.45

Realtek RTL8100CL

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ITE IT8572E AXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000547
€3.45

ITE IT8572E AXS

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Compare

TOP3000 Universal Programmer for MCU and EPROMs Programming ECU Chip Tunning

TOP3000 Auto Car Universal Programmer for MCU and EPROMs programming ECU Chip Tunning Tool

Login to Download: Download software

Specifications:

? Power supply input: 110 ~ 240VAC, 50/60Hz

? Power output: 5VDC, 2A

? Included: TOP3000 programmer,software CD, USB cable, power supply cable

Benefits:

? The TOP3000 programmer supports 2.5 ~ 6.5V devices

? Powered by your USB interface or the included 5V external power supply

? Fast transmission speed of 12MHz/s via the USB port

? Auto detects the device's manufacturer and part number

? Compatible with Notebooks and desktop computers

? The in-built connection inspection checks the connection for every pins in the unit

? Current protection function protects both the programmer and connected devices

? Has 48-pin self-lock sockets

? Compact programmer with tough plastic casing

Supports:

Actrans (EEPROM)

AMD (PLD, MPU, EPROM, EEPROM)

AMIC (EEPROM)

ASD (EEPROM)

Atmel (PLD, MPU, EPROM, EEPROM)

BDTIC (RAM)

Catalyst (EPROM, EEPROM)

Crescentec (MPU)

Dallas (RAM, MPU, EEPROM)

Elan (MPU)

EON (EEPROM)

EXEL (EEPROM)

Fujitsu (EPROM, EEPROM)

Future (MPU)

Hitachi (EPROM, EEPROM)

HMWIN (MPU)

Holtek (MPU)

Hynix (EEPROM)

Hyundai (EPROM)

ICT (EPROM)

Intel (MPU, RAM, EPROM, EEPROM)

ISSI (MPU, EEPROM)

Lattice (PLD)

LG (MPU)

Linksmart (EEPROM)

Macronix (EEPROM)

Matsushita (EPROM)

Megawin (MPU)

Micon (MPU)

Microchip (MPU, EPROM, EEPROM)

Mitsubishi (EPROM, EEPROM)

Mosel (MPU, EEPROM)

MXIC (EPROM, EEPROM)

NEC (EPROM, EEPROM)

NS (PLD, EPROM)

OKI (EPROM, EEPROM)

PDK (MPU)

Philips (MPU)

PMC (EEPROM)

PTC (EEPROM)

Ricoh (EPROM)

Samsung (MPU, EPROM, EEPROM)

SEEQ (EPROM, EEPROM)

SGS Thomson (PLD, EPROM, EEPROM)

Signetics (EPROM)

SMOS (EPROM

Sony (EPROM)

Sonix (MPU)

Spansion (EEPROM)

SST (MPU, EEPROM)

ST (EPROM, EEPROM)

STC (MPU)

Stand (RAM)

Syncmos (MPU, EEPROM)

TI (EPROM, EEPROM)

Topro (MPU)

Toptek (MPU)

Toshiba (EPROM, EEPROM)

Versachip (MPU)

VLSI (PLD, EPROM, EEPROM)

Winbond (MPU, RAM, EEPROM)

WSI (EPROM)

Xicor (EEPROM)

Package Include:

1pc x TOP3000 universal programmer

1pc x USB 2.0 cable (USB 1.1 compatible)

1pc x 5V/2A AC adapter

1pc x TOPwin software CD

1pc x English User Manual

CH000548
€98.21

TOP3000 Universal Programmer for MCU and EPROMs Programming ECU Chip Tunning

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88E1145BBM MARVELL

88E1145-BBM MARVELL

Part Number 88E1145-BBM Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000549
€10.33

88E1145-BBM MARVELL

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N14MGEBA2

N14M-GE-B-A2

Part Number N14M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000550
€25.93

N14M-GE-B-A2

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SR23Y i55200U

SR23Y i5-5200U

Part Number SR23Y i5-5200U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000551
€177.23

SR23Y i5-5200U

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Compare

GK110425B1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000552
€6.22

GK110-425-B1 Stencil Template

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