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  • Categories: Programmer & Sockets
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2150674042

215-0674042

Part Number 215-0674042 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002231
€33.05

215-0674042

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2160732019 M98

216-0732019 M98

Part Number 216-0732025 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Refunished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002243
€26.12

216-0732019 M98

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Iprog Programmer V85 Support IMMO Mileage Airbag till 2019

Iprog+ Programmer V85 Support IMMO +Mileage +Airbag till 2019

Top 3 Reasons to Get Iprog+ Programmer:

1. Functions including airbag, dashboard, car radio, ecu, eeprom, immo, mcu.

and more special functions like dpf off, MIL to KM, PINABS, PINCODE SMATRA3,PINCODE SENSOR SPEED LIMIT,ODO Adjust, Fujutsu, Microchip, Motorola, Motorola912EN, NECV850, BLR, CAN,CRC_Cript, ibutton, sd_unlocker,test etc.

2. Reasonable price: much more cheaper than original iprog+, but work as well as the original

3. IProg+ is designed to work in the operating systems of the Windows family:

Windows xp

Windows vista

Windows 7

Windows 8

IProg+ Programmer Detailed Function List:

Working with odometers on OBDII connector

Working with odometers on the table through adapters

Work with multimedia unlocking the tape recorder

Work with keys (IMMO, Transponders), copying, preparation, unlocking

Work with IMMO-Key Auto dumps

Working with the airbag computer, deleting crash data

Transfer readings from miles to km

Read and write processors and its used in cars

Removing the particulate filter in the dump

Working with keys to the intercom

Realign Pin cod from dump (some brands)

Control board number, + scripts full Base number. Ability to update!

Iprog+ Programmer Software Display:

1. Airbag:

Read and erase crash to some cars

Read and erase DTC

Repair CFG

2. Dashboard:

Read km

Write a new km

3. Car Radio & ECU:

Car Radio:

Read and erase info

Reset count

ECU:

Immo OFF

DPF off

4. Eeprom:

Read/write/erase eeprom

5. Immo:

Program and copy chips for cars and truck

Unlock keys

Cover Toyota smart keys: reset key prepare

Write a key by immo dump

6. Mcu:

Read and write chips

Cover chips Atmel, Fujitsu and microchips Motorola, NEC v850

7. Special functions:

Mile to km

Pincode from dump

Iprog+ Programmer Connection Display:

IProg+ Programmer Package List:

1pc x iprog+ Main Unit

1pc x RFID 125+134 adapter

1pc x Eeprom adapter

1pc x UARTBDM adapter

1pc x OBD Cable

1pc x USB

1pc x CD

1pc x Can Adapter (Newly Add since Sep 16th, 2019)

1pc x K-line Adapter (Newly Add since Sep 16th, 2019)

1pc x Welding Line (Newly Add since Sep 16th, 2019)

CH003199
€92.00

Iprog+ Programmer V85 Support IMMO +Mileage +Airbag till 2019

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2160731004

216-0731004

Part Number 216-0731004 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002249
€26.12

216-0731004

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G84603A2 8600MGT 128Bit 256Mb

G84-603-A2 8600MGT 128Bit 256Mb

Part Number G84-603-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1304

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002270
€49.23

G84-603-A2 8600MGT 128Bit 256Mb

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GL82H170 SR2C8

GL82H170 SR2C8

Part Number GL82H170 SR2C8 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002272
€41.03

GL82H170 SR2C8

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N13MGE5BA1 GT610M

N13M-GE5-B-A1 GT610M

Part Number N13M-GE5-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1216

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002279
€26.75

N13M-GE5-B-A1 GT610M

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SOP to PLCC 16 Universal Programmer Adapter Sockets for TL866 RT809H

16 Universal Adapter Package Contents

1: 1.8 V Adpater 1 pcs

2: TSSOP28 Adpater< Gold Plating >1 pcs

3: SOIC8 SOP8 IC Flash clip 1 pcs

4: Adaptador 300mil SOP28-DIP28 < Gold Plating > 1 pcs

5: SOP20-DIP20 Adaptador 200-208mil< Gold Plating > 1 pcs

6: SOP8-DIP8 200-208mil adpater< Gold Plating > 1 pcs

7: Adaptador 150mil SOP16-DIP16 < Gold Plating > 1 pcs

8: Adaptador 150mil SOP8-DIP8< Gold Plating > 1 pcs

9. Adaptador PLCC44-DIP40 1 pcs

10: PLCC32-DIP32 1 pcs

11. Adaptador PLCC28-DIP24 1 pcs

12. Adaptador PLCC20-DIP20 1 pcs

13: SOP16/SOP14/SOP8-DIP8 adpater

14. SOP8/MSOP8/SSOP8/SOP16-DIP16 simple adaptador 1 pcs

15. Adaptador SOP8-DIP8 simples 1 pcs

16: PLCC IC Extractor 1 pcs

CH003261
€45.00

SOP to PLCC 16 Universal Programmer Adapter Sockets for TL866 RT809H

2150674042

215-0674042

Part Number 215-0674042 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002231
€33.05

215-0674042

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Compare

2160732019 M98

216-0732019 M98

Part Number 216-0732025 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Refunished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002243
€26.12

216-0732019 M98

wishlist
Compare

Iprog Programmer V85 Support IMMO Mileage Airbag till 2019

Iprog+ Programmer V85 Support IMMO +Mileage +Airbag till 2019

Top 3 Reasons to Get Iprog+ Programmer:

1. Functions including airbag, dashboard, car radio, ecu, eeprom, immo, mcu.

and more special functions like dpf off, MIL to KM, PINABS, PINCODE SMATRA3,PINCODE SENSOR SPEED LIMIT,ODO Adjust, Fujutsu, Microchip, Motorola, Motorola912EN, NECV850, BLR, CAN,CRC_Cript, ibutton, sd_unlocker,test etc.

2. Reasonable price: much more cheaper than original iprog+, but work as well as the original

3. IProg+ is designed to work in the operating systems of the Windows family:

Windows xp

Windows vista

Windows 7

Windows 8

IProg+ Programmer Detailed Function List:

Working with odometers on OBDII connector

Working with odometers on the table through adapters

Work with multimedia unlocking the tape recorder

Work with keys (IMMO, Transponders), copying, preparation, unlocking

Work with IMMO-Key Auto dumps

Working with the airbag computer, deleting crash data

Transfer readings from miles to km

Read and write processors and its used in cars

Removing the particulate filter in the dump

Working with keys to the intercom

Realign Pin cod from dump (some brands)

Control board number, + scripts full Base number. Ability to update!

Iprog+ Programmer Software Display:

1. Airbag:

Read and erase crash to some cars

Read and erase DTC

Repair CFG

2. Dashboard:

Read km

Write a new km

3. Car Radio & ECU:

Car Radio:

Read and erase info

Reset count

ECU:

Immo OFF

DPF off

4. Eeprom:

Read/write/erase eeprom

5. Immo:

Program and copy chips for cars and truck

Unlock keys

Cover Toyota smart keys: reset key prepare

Write a key by immo dump

6. Mcu:

Read and write chips

Cover chips Atmel, Fujitsu and microchips Motorola, NEC v850

7. Special functions:

Mile to km

Pincode from dump

Iprog+ Programmer Connection Display:

IProg+ Programmer Package List:

1pc x iprog+ Main Unit

1pc x RFID 125+134 adapter

1pc x Eeprom adapter

1pc x UARTBDM adapter

1pc x OBD Cable

1pc x USB

1pc x CD

1pc x Can Adapter (Newly Add since Sep 16th, 2019)

1pc x K-line Adapter (Newly Add since Sep 16th, 2019)

1pc x Welding Line (Newly Add since Sep 16th, 2019)

CH003199
€92.00

Iprog+ Programmer V85 Support IMMO +Mileage +Airbag till 2019

wishlist
Compare

2160731004

216-0731004

Part Number 216-0731004 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002249
€26.12

216-0731004

wishlist
Compare

G84603A2 8600MGT 128Bit 256Mb

G84-603-A2 8600MGT 128Bit 256Mb

Part Number G84-603-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1304

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002270
€49.23

G84-603-A2 8600MGT 128Bit 256Mb

wishlist
Compare

GL82H170 SR2C8

GL82H170 SR2C8

Part Number GL82H170 SR2C8 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002272
€41.03

GL82H170 SR2C8

wishlist
Compare

N13MGE5BA1 GT610M

N13M-GE5-B-A1 GT610M

Part Number N13M-GE5-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1216

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002279
€26.75

N13M-GE5-B-A1 GT610M

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SOP to PLCC 16 Universal Programmer Adapter Sockets for TL866 RT809H

16 Universal Adapter Package Contents

1: 1.8 V Adpater 1 pcs

2: TSSOP28 Adpater< Gold Plating >1 pcs

3: SOIC8 SOP8 IC Flash clip 1 pcs

4: Adaptador 300mil SOP28-DIP28 < Gold Plating > 1 pcs

5: SOP20-DIP20 Adaptador 200-208mil< Gold Plating > 1 pcs

6: SOP8-DIP8 200-208mil adpater< Gold Plating > 1 pcs

7: Adaptador 150mil SOP16-DIP16 < Gold Plating > 1 pcs

8: Adaptador 150mil SOP8-DIP8< Gold Plating > 1 pcs

9. Adaptador PLCC44-DIP40 1 pcs

10: PLCC32-DIP32 1 pcs

11. Adaptador PLCC28-DIP24 1 pcs

12. Adaptador PLCC20-DIP20 1 pcs

13: SOP16/SOP14/SOP8-DIP8 adpater

14. SOP8/MSOP8/SSOP8/SOP16-DIP16 simple adaptador 1 pcs

15. Adaptador SOP8-DIP8 simples 1 pcs

16: PLCC IC Extractor 1 pcs

CH003261
€45.00

SOP to PLCC 16 Universal Programmer Adapter Sockets for TL866 RT809H

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