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  • Brand: Andk Kzt Hmilu
  • Brand: Chipsetpro.com
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  • Brand: Winbond & Macronix
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Multifunction Network Cable Tester Telephone Line Tracker Detector

Multifunction Network Cable Tester Telephone Line Tracker Detector

Description:

Rapidly identify the target wire among plenty of wires

Telephone wire, network cable and other electric wires scanning & finding

Locating target wire in wall without drilling

Network wire collation function:

According to 16 wire sequences, you can judge the characteristics of short

circuit, breaking circuit, open circuit and crossing

Auto scan mode rapidly test corresponding double

wisted cables (1,2,3,4,5,6,7,8 and G) to judge wrong connection, short/open circuit

Network wire sequence collation supports direct wire collation of operating switch

Continuity testing

This instrument set is an ideal tool for technicians in installation and maintenance of weak current systems such as communication line and comprehensive wiring circuit.

It is widely applicable to telephone systems, computer networks and other metal wire circuit and fields.

Specification:

The max working current: emitter: <=10mA; Receiver: <=30mA .

Signal output electric status: 8Vp-p .

Signal transmission format: multi-frequency impulse .

Distance of signal transmission: >=3km.

Power: 1604S 6F22 DC 9V battery (Not included)

Battery life: 50 hours continuously

Material: ABS plastic

Color: Red and Yellow (Random send)

Package Includes:

1 x Cable Transmitter

1 x Cable Receiver/Tracker

1 x RJ45 Cable

1 x RJ11 Cable

1 x Instruction manual

1 x Earphone

1 x Bag

CH000554
€21.76

Multifunction Network Cable Tester Telephone Line Tracker Detector

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218S4PASA13G IXP450 SB450

218S4PASA13G IXP450 SB450

Part Number 218S4PASA13G Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 06+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000555
€11.93

218S4PASA13G IXP450 SB450

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i32310M SR04S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000556
€5.40

i3-2310M SR04S Stencil Template

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N16EGXA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000557
€9.97

N16E-GX-A1 Stencil Template 90*90

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Realtek RTD2045L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000558
€3.45

Realtek RTD2045L

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PEF20571FV31

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000559
€31.77

PEF20571FV3.1

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Hantek DSO5102P USB Storage Oscilloscope Oszilloskope 2 Channels 100MHz 1GSas

Buy Probe Accessories: * PP-80 PP-150 PP-200 PP-150 T3100 Probe Accessories

Product description

Feature:

100MHz bandwidths

1GSa/s Real Time sample rate

Large (7.0-inch) color display,WVGA(800x480)

Record length up to 40K

Trigger mode: edge/pulse width/line selectable video/slop/overtime etc.

USB host and device connectivity, standard

Multiple automatic measurements

Four math functions, including FFTs standard

Provides software for PC real-time analysis

VGA Optional

Specification:

Bandwidth: 100MHz

Channel: 2

Real-Time Sample: 1GSa/s

Equivalent Sample: 25GSa/s

Memory Depth: 40K

Rise Time: 5ns

Time Base Accuracy: 50ppm

Time Base Range: 8ns/div-40s/div

Input Impendance: 1MO

VOLTS/DIV Range: 2mV/div????5V/div

A/D Converter: 8 bit

Bandwidth Limit: 20MHz

Trigger Types: Edge, Video, Pulse, Slope, Over time, Alternative

Trigger Source: CH1, CH2, EXT, EXT/5, AC Line

Math: +,-,x,,FFT

Size: 313mm x 108mm x 142mm

Weight: 2.08KG

Standard Probe: PP90

Package including:

1 x DSO5102P Digital Oscilloscope

2 x Probes

1 x Power Line

1 x USB Cord

1 x CD

CH000561
€279.72

Hantek DSO5102P USB Storage Oscilloscope Oszilloskope 2 Channels 100MHz 1GSa/s

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BROADCOM BCM5325EKQMG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000562
€23.83

BROADCOM BCM5325EKQMG

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QUICK 861DW leadFree hot 1000W 220V HighPower Hot air Disassembly Station

Buy Tweezers Set: * IC Chip Extractor Rework Tweezer Tool

Description

Model QUICK861DW

Type of soldering station

Temperature adjustment range 100 ~ 500 (?)

Scope of application Electronic products Welding input voltage 220 (V)

Output voltage 26 (V)

Fuse has

Resistance to ground resistance less than 2 (O)

Shell surface impedance less than 2 (O)

Welding Tsui to ground voltage less than 5 (mV)

Power 1000 (W)

Dimensions 188L * 245D * 135H (mm)

Heating time 1min

Net Weight 3.65 (kg)

Set QUICK861DW

Maximum air volume 120L / min

Whether the spot is

Air volume range of 1 ~ 120 level

CH000563
€297.13

QUICK 861DW lead-Free hot 1000W 220V High-Power Hot air Disassembly Station

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NPCT650JAAYX NUVOTON

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000564
€3.45

NPCT650JAAYX NUVOTON

Multifunction Network Cable Tester Telephone Line Tracker Detector

Multifunction Network Cable Tester Telephone Line Tracker Detector

Description:

Rapidly identify the target wire among plenty of wires

Telephone wire, network cable and other electric wires scanning & finding

Locating target wire in wall without drilling

Network wire collation function:

According to 16 wire sequences, you can judge the characteristics of short

circuit, breaking circuit, open circuit and crossing

Auto scan mode rapidly test corresponding double

wisted cables (1,2,3,4,5,6,7,8 and G) to judge wrong connection, short/open circuit

Network wire sequence collation supports direct wire collation of operating switch

Continuity testing

This instrument set is an ideal tool for technicians in installation and maintenance of weak current systems such as communication line and comprehensive wiring circuit.

It is widely applicable to telephone systems, computer networks and other metal wire circuit and fields.

Specification:

The max working current: emitter: <=10mA; Receiver: <=30mA .

Signal output electric status: 8Vp-p .

Signal transmission format: multi-frequency impulse .

Distance of signal transmission: >=3km.

Power: 1604S 6F22 DC 9V battery (Not included)

Battery life: 50 hours continuously

Material: ABS plastic

Color: Red and Yellow (Random send)

Package Includes:

1 x Cable Transmitter

1 x Cable Receiver/Tracker

1 x RJ45 Cable

1 x RJ11 Cable

1 x Instruction manual

1 x Earphone

1 x Bag

CH000554
€21.76

Multifunction Network Cable Tester Telephone Line Tracker Detector

wishlist
Compare

218S4PASA13G IXP450 SB450

218S4PASA13G IXP450 SB450

Part Number 218S4PASA13G Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 06+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000555
€11.93

218S4PASA13G IXP450 SB450

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Compare

i32310M SR04S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000556
€5.40

i3-2310M SR04S Stencil Template

wishlist
Compare

N16EGXA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000557
€9.97

N16E-GX-A1 Stencil Template 90*90

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Compare

Realtek RTD2045L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000558
€3.45

Realtek RTD2045L

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Compare

PEF20571FV31

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000559
€31.77

PEF20571FV3.1

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Compare

Hantek DSO5102P USB Storage Oscilloscope Oszilloskope 2 Channels 100MHz 1GSas

Buy Probe Accessories: * PP-80 PP-150 PP-200 PP-150 T3100 Probe Accessories

Product description

Feature:

100MHz bandwidths

1GSa/s Real Time sample rate

Large (7.0-inch) color display,WVGA(800x480)

Record length up to 40K

Trigger mode: edge/pulse width/line selectable video/slop/overtime etc.

USB host and device connectivity, standard

Multiple automatic measurements

Four math functions, including FFTs standard

Provides software for PC real-time analysis

VGA Optional

Specification:

Bandwidth: 100MHz

Channel: 2

Real-Time Sample: 1GSa/s

Equivalent Sample: 25GSa/s

Memory Depth: 40K

Rise Time: 5ns

Time Base Accuracy: 50ppm

Time Base Range: 8ns/div-40s/div

Input Impendance: 1MO

VOLTS/DIV Range: 2mV/div????5V/div

A/D Converter: 8 bit

Bandwidth Limit: 20MHz

Trigger Types: Edge, Video, Pulse, Slope, Over time, Alternative

Trigger Source: CH1, CH2, EXT, EXT/5, AC Line

Math: +,-,x,,FFT

Size: 313mm x 108mm x 142mm

Weight: 2.08KG

Standard Probe: PP90

Package including:

1 x DSO5102P Digital Oscilloscope

2 x Probes

1 x Power Line

1 x USB Cord

1 x CD

CH000561
€279.72

Hantek DSO5102P USB Storage Oscilloscope Oszilloskope 2 Channels 100MHz 1GSa/s

wishlist
Compare

BROADCOM BCM5325EKQMG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000562
€23.83

BROADCOM BCM5325EKQMG

wishlist
Compare

QUICK 861DW leadFree hot 1000W 220V HighPower Hot air Disassembly Station

Buy Tweezers Set: * IC Chip Extractor Rework Tweezer Tool

Description

Model QUICK861DW

Type of soldering station

Temperature adjustment range 100 ~ 500 (?)

Scope of application Electronic products Welding input voltage 220 (V)

Output voltage 26 (V)

Fuse has

Resistance to ground resistance less than 2 (O)

Shell surface impedance less than 2 (O)

Welding Tsui to ground voltage less than 5 (mV)

Power 1000 (W)

Dimensions 188L * 245D * 135H (mm)

Heating time 1min

Net Weight 3.65 (kg)

Set QUICK861DW

Maximum air volume 120L / min

Whether the spot is

Air volume range of 1 ~ 120 level

CH000563
€297.13

QUICK 861DW lead-Free hot 1000W 220V High-Power Hot air Disassembly Station

wishlist
Compare

NPCT650JAAYX NUVOTON

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000564
€3.45

NPCT650JAAYX NUVOTON

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Compare
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