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FREESCALE MPC850SRZQ50BU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004860
€19.06

FREESCALE MPC850SRZQ50BU

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DC Power Jack Part PJ041

Samsung NP P40 Series DC Power Jack Connector: P40, NP P40, NP-P40

Samsung NP P500 Series DC Power Jack Connector: P500, NP P500, NP-P500

Samsung NP Q10 Series DC Power Jack Connector: Q10, NP Q10, NP-Q10

Samsung NP Q20 Series DC Power Jack Connector: Q20, NP Q20, NP-Q20

Samsung NP Q25 Series DC Power Jack Connector: Q25, NP Q25, NP-Q25

Samsung NP Q30 Series DC Power Jack Connector: Q30, NP Q30, NP-Q30

Samsung NP Q35 Series DC Power Jack Connector: Q35, NP Q35, NP-Q35

Samsung NP Q40 Series DC Power Jack Connector: Q40, NP Q40, NP-Q40

Samsung NP Q45 Series DC Power Jack Connector: Q45, NP Q45, NP-Q45

Samsung NP Q68 Series DC Power Jack Connector: Q68, NP Q68, NP-Q68

Samsung NP R20 Series DC Power Jack Connector: R20, NP R20, NP-R20

Samsung NP R40 Series DC Power Jack Connector: R40, NP R40, NP-R40

Samsung NP R505 Series DC Power Jack Connector: NP R505, NP R505-xxxxxx, NP R505-FAxxxx, NP R505-FA01xx, NP R505-FA02xx, NP R505-FA03xx, NP R505-FA04xx, NP R505-FSxxxx, NP R505-FS01xx, NP R505-FS02xx, NP R505-FS03xx, NP R505-FS04xx, NP R505-FS05xx

Samsung NP R510 Series DC Power Jack Connector: NP R510, NP R510-xxxxxx, NP R510-FAxxxx, NP R510-FAA2xx, NP R510-FAADxx, NP R510-FAADxx, NP R510-FAAGxx, NP R510-FA01xx, NP R510-FA02xx, NP R510-FA03xx, NP R510-FA04xx, NP R510-FA05xx, NP R510-FA06xx, NP R510-FA07xx, NP R510-FA08xx, NP R510-FA09xx, NP R510-FA0Gxx, NP R510-FA0Jxx, NP R510-FA0Mxx, NP R510-FSxxxx, NP R510-FS01xx, NP R510-FS02xx, NP R510-FS03xx, NP R510-FS04xx, NP R510-FS05xx, NP R510-FS06xx, NP R510-FS07xx, NP R510-FS08xx, NP R510-FS09xx, NP R510-FS0Axx, NP R510-FS0Bxx, NP R510-FS0Cxx, NP R510-FS0Exx, NP R510-FS0Gxx, NP R510-FS0Hxx, NP R510-FS0Jxx, NP R510-FS0Kxx, NP R510-FS0Lxx, NP R510-FS0Nxx, NP R510-FS0Pxx

Samsung NP R560 Series DC Power Jack Connector: R560, NP R560, NP-R560

Samsung NP R60 R60+ Series DC Power Jack Connector: R60, NP R60, NP-R60, R60+, NP R60+, NP-R60+

Samsung NP R70 Series DC Power Jack Connector: R70, NP R70, NP-R70

Samsung NP R700 Series DC Power Jack Connector: NP R700, NP R700-xxxxxx, NP R700-A0xxxx, NP R700-A003xx, NP R700-A00Axx

Samsung NP X1 Series DC Power Jack Connector: X1, NP X1, NP-X1

Samsung NP X60 Series DC Power Jack Connector: X60, NP X60, NP-X60

Samsung NP X460 Series DC Power Jack Connector: NP X460, NP X460-xxxxxx, NP X460-42x, NP X460-44x, NP X460-ASxxxx, NP X460-AS01xx, NP X460-AS02xx, NP X460-AS03xx, NP X460-AS04xx, NP X460-AS05xx, NP X460-AS06xx, NP X460-AS07xx

Samsung Sens X22 Series DC Power Jack Connector: X22, X22-xxxx, X22-A0xx, X22-A004, X22-A005, X22-A007, X22-A008

CH004862
€7.21

DC Power Jack, Part #PJ041

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i53427U SR0N7 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004863
€5.40

i5-3427U SR0N7 Stencil Template

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DC Power Jack Part PJ082

Samsung NP 700G7A Series DC Power Jack Connector: NP 700G7A, NP 700G7A-xxxxx, NP 700G7A-S0xxx, NP 700G7A-S01xx, NP 700G7A-S02xx, NP 700G7A-S03xx

Samsung NP 700G7C Series DC Power Jack Connector: NP 700G7C, NP 700G7C-xxxxx, NP 700G7C-C0xxx, NP 700G7C-C01xx, NP 700G7C-S0xxx, NP 700G7C-S01xx, NP 700G7C-S03xx

Samsung NP 700Z3A Series DC Power Jack Connector: NP 700Z3A, NP 700Z3A-xxxxx, NP 700Z3A-S0xxx, NP 700Z3A-S01xx, NP 700Z3A-S02xx, NP 700Z3A-S03xx, NP 700Z3A-S04xx, NP 700Z3A-S05xx, NP 700Z3A-S06xx, NP 700Z3A-S07xx

Samsung NP 700Z3C Series DC Power Jack Connector: NP 700Z3C, NP 700Z3C-xxxxx, NP 700Z3C-S0xxx, NP 700Z3C-S01xx, NP 700Z3C-S02xx

Samsung NP 700Z4A Series DC Power Jack Connector: NP 700Z4A, NP 700Z4A-xxxxx, NP 700Z4A-S0xxx, NP 700Z4A-S01xx, NP 700Z4A-S02xx, NP 700Z4A-SDxxx, NP 700Z4A-SD1xx

Samsung NP 700Z5A Series DC Power Jack Connector: NP 700Z5A, NP 700Z5A-xxxxx, NP 700Z5A-A01xx, NP 700Z5A-S0xxx, NP 700Z5A-S01xx, NP 700Z5A-S02xx, NP 700Z5A-S03xx, NP 700Z5A-S04xx, NP 700Z5A-S05xx, NP 700Z5A-S06xx, NP 700Z5A-S07xx, NP 700Z5AH, NP 700Z5AI

Samsung NT 700Z5A Series DC Power Jack Connector: NT 700Z5A, NT 700Z5A-xxxx, NT 700Z5A-PS3, NT 700Z5A-S54S, NT 700Z5A-S58, NT 700Z5A-S78

Samsung NP 700Z5B Series DC Power Jack Connector: NP 700Z5B, NP 700Z5B-xxxxx, NP 700Z5B-S01xx, NP 700Z5B-S02xx, NP 700Z5B-W0xxx, NP 700Z5B-W01xx, 700Z5BH

Samsung NP 700Z5C Series DC Power Jack Connector: NP 700Z5C, NP 700Z5C-xxxxx, NP 700Z5C-A03xx, NP 700Z5C-S01xx, NP 700Z5C-S02xx, NP 700Z5C-S03xx, NP 700Z5C-S04xx, NP 700Z5C-S05xx, NP 700Z5C-S06xx, NP 700Z5C-S07xx, NP 700Z5C-SB1xx, NP 700Z5C-SB2xx, NP 700Z5CH, NP 700Z5CI

Samsung NT 700Z5C Series DC Power Jack Connector: NT 700Z5C, NT 700Z5C-xxxx, NT 700Z5C-S54S, NT 700Z5C-S58, NT 700Z5C-S64S, NT 700Z5C-S68, NT 700Z5C-S711Z, NT 700Z5C-S78, NT 700Z5C-S88

Samsung NP 700Z7C Series DC Power Jack Connector: NP 700Z7C, NP 700Z7C-xxxxx, NP 700Z7C-S01xx, NP 700Z7C-S02xx, NP 700Z7C-S03xx, NP 700Z7C-S04xx

CH004864
€7.21

DC Power Jack, Part #PJ082

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G73GTHNB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004865
€5.40

G73-GT-H-N-B1 Stencil Template

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Compare
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900MT16D KINGBOX 936 leadfree soldering iron head thermostatic head

Taiwan lead-free high quality 936 iron head

Characteristic:

1. special cast iron process, corrosion resistance, oxidation resistance, especially for long life.

2. strong immersion prolonged, easy to melt, Shangxi, solder joint round.

3. ? uniform inductance, stable quality, lead-free material.

4. lead-free environmental production, has passed the SGS test.

All soldering stations used in the 900M-T series

Such as table machine, 936 series welding platform

900M series lead-free soldering iron

? made of pure copper components, high thermal conductivity, fast heat transfer

? special iron surface plating, high temperature resistance, corrosion resistance

Special process, suitable for lead-free solder welding

? strong tin capacity, no oxidation, no tin, no tin, tin climbing phenomenon

? the outer layer is bright and delicate and very strong in rust resistance

? this product has passed the SGS environmental protection test

Life of soldering iron head

The life of the iron head is determined by the number of welds, and the length of life guaranteed depends on the coating thickness of the head. The thicker the coating, the longer the life of the iron head, but the heat transfer efficiency will be greatly reduced, the life of the iron tip for the same temperature series of iron head, fine iron head, life expectancy than a rough iron head life is shorter. Because the iron head is working, it will inevitably cause wear and tear on the surface of the nozzle life. Therefore, the fine iron head is more prone to wear, so to reduce the life of the soldering iron.

Maintenance of iron head

The use of new electric iron, electric iron can not bring the new use, need to be plated with a layer of solder in the iron head method is: according to the power supply when the temperature gradually increased, the rosin coated iron head; rosin smoke, to melt the solder iron head, with a the solder layer so as to strengthen the tip life.

CH004867
€3.61

900M-T-1.6D KINGBOX 936 lead-free soldering iron head thermostatic head

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BROADCOM BCM5482SA2KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004869
€28.59

BROADCOM BCM5482SA2KFBG

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21607290x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004870
€9.96

216-0729042 Stencil Template 90*90

FREESCALE MPC850SRZQ50BU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004860
€19.06

FREESCALE MPC850SRZQ50BU

wishlist
Compare

DC Power Jack Part PJ041

Samsung NP P40 Series DC Power Jack Connector: P40, NP P40, NP-P40

Samsung NP P500 Series DC Power Jack Connector: P500, NP P500, NP-P500

Samsung NP Q10 Series DC Power Jack Connector: Q10, NP Q10, NP-Q10

Samsung NP Q20 Series DC Power Jack Connector: Q20, NP Q20, NP-Q20

Samsung NP Q25 Series DC Power Jack Connector: Q25, NP Q25, NP-Q25

Samsung NP Q30 Series DC Power Jack Connector: Q30, NP Q30, NP-Q30

Samsung NP Q35 Series DC Power Jack Connector: Q35, NP Q35, NP-Q35

Samsung NP Q40 Series DC Power Jack Connector: Q40, NP Q40, NP-Q40

Samsung NP Q45 Series DC Power Jack Connector: Q45, NP Q45, NP-Q45

Samsung NP Q68 Series DC Power Jack Connector: Q68, NP Q68, NP-Q68

Samsung NP R20 Series DC Power Jack Connector: R20, NP R20, NP-R20

Samsung NP R40 Series DC Power Jack Connector: R40, NP R40, NP-R40

Samsung NP R505 Series DC Power Jack Connector: NP R505, NP R505-xxxxxx, NP R505-FAxxxx, NP R505-FA01xx, NP R505-FA02xx, NP R505-FA03xx, NP R505-FA04xx, NP R505-FSxxxx, NP R505-FS01xx, NP R505-FS02xx, NP R505-FS03xx, NP R505-FS04xx, NP R505-FS05xx

Samsung NP R510 Series DC Power Jack Connector: NP R510, NP R510-xxxxxx, NP R510-FAxxxx, NP R510-FAA2xx, NP R510-FAADxx, NP R510-FAADxx, NP R510-FAAGxx, NP R510-FA01xx, NP R510-FA02xx, NP R510-FA03xx, NP R510-FA04xx, NP R510-FA05xx, NP R510-FA06xx, NP R510-FA07xx, NP R510-FA08xx, NP R510-FA09xx, NP R510-FA0Gxx, NP R510-FA0Jxx, NP R510-FA0Mxx, NP R510-FSxxxx, NP R510-FS01xx, NP R510-FS02xx, NP R510-FS03xx, NP R510-FS04xx, NP R510-FS05xx, NP R510-FS06xx, NP R510-FS07xx, NP R510-FS08xx, NP R510-FS09xx, NP R510-FS0Axx, NP R510-FS0Bxx, NP R510-FS0Cxx, NP R510-FS0Exx, NP R510-FS0Gxx, NP R510-FS0Hxx, NP R510-FS0Jxx, NP R510-FS0Kxx, NP R510-FS0Lxx, NP R510-FS0Nxx, NP R510-FS0Pxx

Samsung NP R560 Series DC Power Jack Connector: R560, NP R560, NP-R560

Samsung NP R60 R60+ Series DC Power Jack Connector: R60, NP R60, NP-R60, R60+, NP R60+, NP-R60+

Samsung NP R70 Series DC Power Jack Connector: R70, NP R70, NP-R70

Samsung NP R700 Series DC Power Jack Connector: NP R700, NP R700-xxxxxx, NP R700-A0xxxx, NP R700-A003xx, NP R700-A00Axx

Samsung NP X1 Series DC Power Jack Connector: X1, NP X1, NP-X1

Samsung NP X60 Series DC Power Jack Connector: X60, NP X60, NP-X60

Samsung NP X460 Series DC Power Jack Connector: NP X460, NP X460-xxxxxx, NP X460-42x, NP X460-44x, NP X460-ASxxxx, NP X460-AS01xx, NP X460-AS02xx, NP X460-AS03xx, NP X460-AS04xx, NP X460-AS05xx, NP X460-AS06xx, NP X460-AS07xx

Samsung Sens X22 Series DC Power Jack Connector: X22, X22-xxxx, X22-A0xx, X22-A004, X22-A005, X22-A007, X22-A008

CH004862
€7.21

DC Power Jack, Part #PJ041

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Compare

i53427U SR0N7 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004863
€5.40

i5-3427U SR0N7 Stencil Template

wishlist
Compare

DC Power Jack Part PJ082

Samsung NP 700G7A Series DC Power Jack Connector: NP 700G7A, NP 700G7A-xxxxx, NP 700G7A-S0xxx, NP 700G7A-S01xx, NP 700G7A-S02xx, NP 700G7A-S03xx

Samsung NP 700G7C Series DC Power Jack Connector: NP 700G7C, NP 700G7C-xxxxx, NP 700G7C-C0xxx, NP 700G7C-C01xx, NP 700G7C-S0xxx, NP 700G7C-S01xx, NP 700G7C-S03xx

Samsung NP 700Z3A Series DC Power Jack Connector: NP 700Z3A, NP 700Z3A-xxxxx, NP 700Z3A-S0xxx, NP 700Z3A-S01xx, NP 700Z3A-S02xx, NP 700Z3A-S03xx, NP 700Z3A-S04xx, NP 700Z3A-S05xx, NP 700Z3A-S06xx, NP 700Z3A-S07xx

Samsung NP 700Z3C Series DC Power Jack Connector: NP 700Z3C, NP 700Z3C-xxxxx, NP 700Z3C-S0xxx, NP 700Z3C-S01xx, NP 700Z3C-S02xx

Samsung NP 700Z4A Series DC Power Jack Connector: NP 700Z4A, NP 700Z4A-xxxxx, NP 700Z4A-S0xxx, NP 700Z4A-S01xx, NP 700Z4A-S02xx, NP 700Z4A-SDxxx, NP 700Z4A-SD1xx

Samsung NP 700Z5A Series DC Power Jack Connector: NP 700Z5A, NP 700Z5A-xxxxx, NP 700Z5A-A01xx, NP 700Z5A-S0xxx, NP 700Z5A-S01xx, NP 700Z5A-S02xx, NP 700Z5A-S03xx, NP 700Z5A-S04xx, NP 700Z5A-S05xx, NP 700Z5A-S06xx, NP 700Z5A-S07xx, NP 700Z5AH, NP 700Z5AI

Samsung NT 700Z5A Series DC Power Jack Connector: NT 700Z5A, NT 700Z5A-xxxx, NT 700Z5A-PS3, NT 700Z5A-S54S, NT 700Z5A-S58, NT 700Z5A-S78

Samsung NP 700Z5B Series DC Power Jack Connector: NP 700Z5B, NP 700Z5B-xxxxx, NP 700Z5B-S01xx, NP 700Z5B-S02xx, NP 700Z5B-W0xxx, NP 700Z5B-W01xx, 700Z5BH

Samsung NP 700Z5C Series DC Power Jack Connector: NP 700Z5C, NP 700Z5C-xxxxx, NP 700Z5C-A03xx, NP 700Z5C-S01xx, NP 700Z5C-S02xx, NP 700Z5C-S03xx, NP 700Z5C-S04xx, NP 700Z5C-S05xx, NP 700Z5C-S06xx, NP 700Z5C-S07xx, NP 700Z5C-SB1xx, NP 700Z5C-SB2xx, NP 700Z5CH, NP 700Z5CI

Samsung NT 700Z5C Series DC Power Jack Connector: NT 700Z5C, NT 700Z5C-xxxx, NT 700Z5C-S54S, NT 700Z5C-S58, NT 700Z5C-S64S, NT 700Z5C-S68, NT 700Z5C-S711Z, NT 700Z5C-S78, NT 700Z5C-S88

Samsung NP 700Z7C Series DC Power Jack Connector: NP 700Z7C, NP 700Z7C-xxxxx, NP 700Z7C-S01xx, NP 700Z7C-S02xx, NP 700Z7C-S03xx, NP 700Z7C-S04xx

CH004864
€7.21

DC Power Jack, Part #PJ082

wishlist
Compare

G73GTHNB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004865
€5.40

G73-GT-H-N-B1 Stencil Template

wishlist
Compare

900MT16D KINGBOX 936 leadfree soldering iron head thermostatic head

Taiwan lead-free high quality 936 iron head

Characteristic:

1. special cast iron process, corrosion resistance, oxidation resistance, especially for long life.

2. strong immersion prolonged, easy to melt, Shangxi, solder joint round.

3. ? uniform inductance, stable quality, lead-free material.

4. lead-free environmental production, has passed the SGS test.

All soldering stations used in the 900M-T series

Such as table machine, 936 series welding platform

900M series lead-free soldering iron

? made of pure copper components, high thermal conductivity, fast heat transfer

? special iron surface plating, high temperature resistance, corrosion resistance

Special process, suitable for lead-free solder welding

? strong tin capacity, no oxidation, no tin, no tin, tin climbing phenomenon

? the outer layer is bright and delicate and very strong in rust resistance

? this product has passed the SGS environmental protection test

Life of soldering iron head

The life of the iron head is determined by the number of welds, and the length of life guaranteed depends on the coating thickness of the head. The thicker the coating, the longer the life of the iron head, but the heat transfer efficiency will be greatly reduced, the life of the iron tip for the same temperature series of iron head, fine iron head, life expectancy than a rough iron head life is shorter. Because the iron head is working, it will inevitably cause wear and tear on the surface of the nozzle life. Therefore, the fine iron head is more prone to wear, so to reduce the life of the soldering iron.

Maintenance of iron head

The use of new electric iron, electric iron can not bring the new use, need to be plated with a layer of solder in the iron head method is: according to the power supply when the temperature gradually increased, the rosin coated iron head; rosin smoke, to melt the solder iron head, with a the solder layer so as to strengthen the tip life.

CH004867
€3.61

900M-T-1.6D KINGBOX 936 lead-free soldering iron head thermostatic head

wishlist
Compare

BROADCOM BCM5482SA2KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004869
€28.59

BROADCOM BCM5482SA2KFBG

wishlist
Compare

21607290x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004870
€9.96

216-0729042 Stencil Template 90*90

wishlist
Compare
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