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Realtek RTL8100BL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004884
€3.45

Realtek RTL8100BL

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PANASONIC AN12948

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004887
€3.45

PANASONIC AN12948

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i36167U SR2JF Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004888
€9.96

i3-6167U SR2JF Stencil Template 90*90

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DC Power Jack Part PJ068

Alienware M17x Series DC Power Jack Connector: M17x R1, M17x R2

Dell XPS M1730 Series DC Power Jack Connector: M1730

Note: This jack is for use with the PA19, PA-19 230/240watt AC adapter only, it is larger than the standard AC adapter.

CH004889
€7.21

DC Power Jack, Part #PJ068

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BROADCOM BCM5752KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004890
€3.45

BROADCOM BCM5752KFBG

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C8051F120GQ SILTCON

C8051F120-GQ SILTCON

Part Number C8051F120-GQ Manufacturer SILTCON

Type TQFP100 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004893
€9.21

C8051F120-GQ SILTCON

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AOYUE 968A 3in1 rework station hot air gun soldering iron smoke absorber

Buy Tweezers Set: * IC Chip Extractor Rework Tweezer Tool

AOYUE 968A+ 220v 3 in 1 multifunction soldering station SMD rework station soldering iron welding iron BGA rework station

Voltage: 220V or 110V , pls let us know your voltage choice when order , thanks

Size: 188 (W) x 246 (depth) x 126 (H) mm

Weight: 5.25Kg

Iron

Temperature range: 200?~480?

Power: 70W

Heating elements: ceramic heating element

Tip grounding resistance: 2 ohms

Tip ground voltage: less than 2mV

Output voltage: 24V

Heat Gun

Power: 550W

Temperature range: 100?~480?

Heating elements: ceramic metal hot cores

Vacuum launched Type: Special diaphragm pump

Vacuum pressure / volume (maximum): 23L / min

Packing Checklist

AOYUE 968A +

Wind Tsui AT-5 include: (1124,1130,1197,1196,1313)

Activated carbon sponge

Suction nozzle cover

Wind firearms rack

Fork

Power cord (1.5m)

Iron pen

Iron frame

AOYUE iron frame assembly instructions

AOYUE 968A + manual

CH004894
€172.81

AOYUE 968A+ 3in1 rework station hot air gun + soldering iron + smoke absorber

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Maxim MAX1544ETL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004895
€3.45

Maxim MAX1544ETL

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Realtek ALC5631

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004896
€3.45

Realtek ALC5631

Realtek RTL8100BL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004884
€3.45

Realtek RTL8100BL

wishlist
Compare

PANASONIC AN12948

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004887
€3.45

PANASONIC AN12948

wishlist
Compare

i36167U SR2JF Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004888
€9.96

i3-6167U SR2JF Stencil Template 90*90

wishlist
Compare

DC Power Jack Part PJ068

Alienware M17x Series DC Power Jack Connector: M17x R1, M17x R2

Dell XPS M1730 Series DC Power Jack Connector: M1730

Note: This jack is for use with the PA19, PA-19 230/240watt AC adapter only, it is larger than the standard AC adapter.

CH004889
€7.21

DC Power Jack, Part #PJ068

wishlist
Compare

BROADCOM BCM5752KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004890
€3.45

BROADCOM BCM5752KFBG

wishlist
Compare

C8051F120GQ SILTCON

C8051F120-GQ SILTCON

Part Number C8051F120-GQ Manufacturer SILTCON

Type TQFP100 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004893
€9.21

C8051F120-GQ SILTCON

wishlist
Compare

AOYUE 968A 3in1 rework station hot air gun soldering iron smoke absorber

Buy Tweezers Set: * IC Chip Extractor Rework Tweezer Tool

AOYUE 968A+ 220v 3 in 1 multifunction soldering station SMD rework station soldering iron welding iron BGA rework station

Voltage: 220V or 110V , pls let us know your voltage choice when order , thanks

Size: 188 (W) x 246 (depth) x 126 (H) mm

Weight: 5.25Kg

Iron

Temperature range: 200?~480?

Power: 70W

Heating elements: ceramic heating element

Tip grounding resistance: 2 ohms

Tip ground voltage: less than 2mV

Output voltage: 24V

Heat Gun

Power: 550W

Temperature range: 100?~480?

Heating elements: ceramic metal hot cores

Vacuum launched Type: Special diaphragm pump

Vacuum pressure / volume (maximum): 23L / min

Packing Checklist

AOYUE 968A +

Wind Tsui AT-5 include: (1124,1130,1197,1196,1313)

Activated carbon sponge

Suction nozzle cover

Wind firearms rack

Fork

Power cord (1.5m)

Iron pen

Iron frame

AOYUE iron frame assembly instructions

AOYUE 968A + manual

CH004894
€172.81

AOYUE 968A+ 3in1 rework station hot air gun + soldering iron + smoke absorber

wishlist
Compare

Maxim MAX1544ETL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004895
€3.45

Maxim MAX1544ETL

wishlist
Compare

Realtek ALC5631

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004896
€3.45

Realtek ALC5631

wishlist
Compare
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