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AMD S1 Socket Intel CPU Base BGA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004912
€6.22

AMD S1 Socket Intel CPU Base BGA

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2150910018 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004914
€9.81

215-0910018 Stencil Template 90*90

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XELTEK SuperPro 6104N Universal IC Chip Device Programmer

XELTEK SuperPro 6104N (so not 6100)Universal Programmer 100,000+ devices supported

Login to Download: Download software

Features:

? Until now,Support 402 IC manufacturer, 103391 pcs devices and keeps growing.

? DIP48 adaptor are no longer standard with SP6104N, From 1 June 2020.

? Support devices with Vcc from 1.2V to 5V.

? The programming speed up further increase 30% compared to SUPERPRO 5000.

? The programmer support files up to 256 GBytes

? Extremely fast speed. P+V 64 Mb NOR FLASH memory in 11.3 seconds and 1Gb NAND in 108 seconds.

? 4 isolated programmer modules based on SUPERPRO 5000 working asynchronously. Each module is built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. New device support will be easier.

? Controlled by a PC via USB2.0 (high speed) .

? Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (+10%~-10%) Vcc verification enhances programming reliability.

? Advanced and powerful functions.

Production mode start chip operation at the moment the chip is inserted in the socket properly.

Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.

Password can be set for project files and production volume control

Batch command combines device operations like program, verify, security into a single command at any sequence.

Serial numbers generators are available as standard or customer-specific functions.

Log file is useful for quality tracking.

? Over-current and over-voltage protection for safety of the chip and programmer hardware.

? WINDOWS XP/VISTA/Win7/Win10 compatibility

Hardware & Electrical Specifications:

? Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory(NOR & NAND)n, BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU.

? Packages supported: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP,TSOPII, PSOP,TSSOP,SON,EBGA, FBGA, VFBGA,uBGA,CSP,SCSP , ...

? PC interface: USB2.0

? Stand-alone Feature: None

? Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output 12V/6A; power:15W

Accessories:

? Main unit, AC adaptor, USB2.0 cable, software CD (include: install software, user manual),register card.

? Optional accessories: adaptor in varies packages.

? DIP48 adaptor are no longer standard with SP6104N, From 1 June 2020.

CH004915
€3,790.91

XELTEK SuperPro 6104N Universal IC Chip Device Programmer

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N11MPT1SB1

N11M-PT1-S-B1

Part Number N11M-PT1-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1332

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004916
€14.93

N11M-PT1-S-B1

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2180755111

218-0755111

Part Number 218-0755111 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004918
€22.29

218-0755111

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2160769010 HD5850

216-0769010 HD5850

Part Number 216-0769010 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004919
€55.72

216-0769010 HD5850

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GP104-400-A1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004920
€9.96

GP104-400-A1 Stencil Template 90*90

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GF100275A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004921
€5.59

GF100-275-A3 Stencil Template

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N14EGTXA2

N14E-GTX-A2

Part Number N14E-GTX-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004922
€161.04

N14E-GTX-A2

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MCP89MZA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004923
€5.40

MCP89MZ-A2 Stencil Template

AMD S1 Socket Intel CPU Base BGA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004912
€6.22

AMD S1 Socket Intel CPU Base BGA

wishlist
Compare

2150910018 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004914
€9.81

215-0910018 Stencil Template 90*90

wishlist
Compare

XELTEK SuperPro 6104N Universal IC Chip Device Programmer

XELTEK SuperPro 6104N (so not 6100)Universal Programmer 100,000+ devices supported

Login to Download: Download software

Features:

? Until now,Support 402 IC manufacturer, 103391 pcs devices and keeps growing.

? DIP48 adaptor are no longer standard with SP6104N, From 1 June 2020.

? Support devices with Vcc from 1.2V to 5V.

? The programming speed up further increase 30% compared to SUPERPRO 5000.

? The programmer support files up to 256 GBytes

? Extremely fast speed. P+V 64 Mb NOR FLASH memory in 11.3 seconds and 1Gb NAND in 108 seconds.

? 4 isolated programmer modules based on SUPERPRO 5000 working asynchronously. Each module is built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. New device support will be easier.

? Controlled by a PC via USB2.0 (high speed) .

? Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (+10%~-10%) Vcc verification enhances programming reliability.

? Advanced and powerful functions.

Production mode start chip operation at the moment the chip is inserted in the socket properly.

Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.

Password can be set for project files and production volume control

Batch command combines device operations like program, verify, security into a single command at any sequence.

Serial numbers generators are available as standard or customer-specific functions.

Log file is useful for quality tracking.

? Over-current and over-voltage protection for safety of the chip and programmer hardware.

? WINDOWS XP/VISTA/Win7/Win10 compatibility

Hardware & Electrical Specifications:

? Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory(NOR & NAND)n, BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU.

? Packages supported: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP,TSOPII, PSOP,TSSOP,SON,EBGA, FBGA, VFBGA,uBGA,CSP,SCSP , ...

? PC interface: USB2.0

? Stand-alone Feature: None

? Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output 12V/6A; power:15W

Accessories:

? Main unit, AC adaptor, USB2.0 cable, software CD (include: install software, user manual),register card.

? Optional accessories: adaptor in varies packages.

? DIP48 adaptor are no longer standard with SP6104N, From 1 June 2020.

CH004915
€3,790.91

XELTEK SuperPro 6104N Universal IC Chip Device Programmer

wishlist
Compare

N11MPT1SB1

N11M-PT1-S-B1

Part Number N11M-PT1-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1332

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004916
€14.93

N11M-PT1-S-B1

wishlist
Compare

2180755111

218-0755111

Part Number 218-0755111 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004918
€22.29

218-0755111

wishlist
Compare

2160769010 HD5850

216-0769010 HD5850

Part Number 216-0769010 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004919
€55.72

216-0769010 HD5850

wishlist
Compare

GP104-400-A1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004920
€9.96

GP104-400-A1 Stencil Template 90*90

wishlist
Compare

GF100275A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004921
€5.59

GF100-275-A3 Stencil Template

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Compare

N14EGTXA2

N14E-GTX-A2

Part Number N14E-GTX-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004922
€161.04

N14E-GTX-A2

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Compare

MCP89MZA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004923
€5.40

MCP89MZ-A2 Stencil Template

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