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GF100275A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004921
€5.59

GF100-275-A3 Stencil Template

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N14EGTXA2

N14E-GTX-A2

Part Number N14E-GTX-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004922
€161.04

N14E-GTX-A2

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MCP89MZA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004923
€5.40

MCP89MZ-A2 Stencil Template

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SMSC FDC37N971

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004924
€10.33

SMSC FDC37N971

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N17EG2A1 GTX1070

N17E-G2-A1 GTX1070

Part Number N17E-G2-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004925
€485.76

N17E-G2-A1 GTX1070

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VISHAY SI4800BDY

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004926
€3.45

VISHAY SI4800BDY

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RICHTEK RT9045

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004927
€3.45

RICHTEK RT9045

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10 15mm15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate

100% Brand new and high quality

The copper has high purity coefficient of thermal conductivity as high as 407 w/ (m?K)

With this copper pad to greatly lower GPU temperatures, can be used for graphics, northbridge, CPU chips.

It can be applied to HP, Dell, Acer, Thinkpad and all laptop and computer heatsink solution!

Material: Copper

Color: As the picture

Size: Approx. 1.0T x 15 x 15(T*L*W)

How to use: First daub a little thermal silicone grease (FYI: Do not use the low-end silicone grease), then put the right size copper shims, then daub a little thermal silicone grease again, last install the heatsink and tighten the screws

CH004928
€2.70

1.0 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate

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i54200U SR170 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004929
€9.96

i5-4200U SR170 Stencil Template 90*90

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Multimeter probe with crocodile

1 Pair 1000V 10A Universal Digital Multimeter Meter Probe Test LeadsPin Red + Black

Features :

100% brand new and high quality.

and more accurate.

Up to 10A / 1000V

Material: PVC and Alloy

Color: Black + Red

Size length: 1.2 m

Package includeds :

1 x Pair of Digital Multimeter Meter Probe

CH004930
€4.85

Multimeter probe with crocodile

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AntMiner S9i 145T ASIC Bitcoin Miner Include Bitmain

AntMine S9i specification parameters:

1. Rated power: 14.5TH / S + 5%

2. Wall power consumption: 1365W+10% (wall efficiency, AC / DC 93% efficiency, 25 degree C ambient temperature)

3. Power efficiency: 94.14J/TH+10% (wall, AC / DC 93% efficiency, 25 degree C ambient temperature)

4. Rated voltage: 11.6~13.0V

5. Outer box size: 445 mm (L) *215 mm (W) *255 mm (H)

6. Cooling: 2 * 12038 fans.

7. Working temperature: 0 C to 40 C

8. Working humidity: 5%RH-95%RH, non condensation.

9. Network connection: Ethernet

10. Noise: 76dB

11. Machine weight (including packaging): mine 5.5kg+ power 2.5kg

12. Power connection mode: Each arithmetic board has three PCIE interfaces that need to be connected. It is recommended to use independent power supply to power the whole machine. In the case of independent power supply, three arithmetic boards can be connected to different power supply, but each arithmetic board can not connect multiple power sources, and ensure that the arithmetic board is finally powered on.

Matters needing attention:

1. Chassis deformation or heat sink falling off, please do not power up, contact after-sales treatment.

2. Do not use the two power supply with the same power plate.

3. Suggest using ant pond (www.antpool.com).

Bitmain Power Supply APW3

CH004931
€990.00

AntMiner S9i 14.5T ASIC Bitcoin Miner Include Bitmain

GF100275A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004921
€5.59

GF100-275-A3 Stencil Template

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N14EGTXA2

N14E-GTX-A2

Part Number N14E-GTX-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004922
€161.04

N14E-GTX-A2

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MCP89MZA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004923
€5.40

MCP89MZ-A2 Stencil Template

wishlist
Compare

SMSC FDC37N971

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004924
€10.33

SMSC FDC37N971

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N17EG2A1 GTX1070

N17E-G2-A1 GTX1070

Part Number N17E-G2-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004925
€485.76

N17E-G2-A1 GTX1070

wishlist
Compare

VISHAY SI4800BDY

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004926
€3.45

VISHAY SI4800BDY

wishlist
Compare

RICHTEK RT9045

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004927
€3.45

RICHTEK RT9045

wishlist
Compare

10 15mm15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate

100% Brand new and high quality

The copper has high purity coefficient of thermal conductivity as high as 407 w/ (m?K)

With this copper pad to greatly lower GPU temperatures, can be used for graphics, northbridge, CPU chips.

It can be applied to HP, Dell, Acer, Thinkpad and all laptop and computer heatsink solution!

Material: Copper

Color: As the picture

Size: Approx. 1.0T x 15 x 15(T*L*W)

How to use: First daub a little thermal silicone grease (FYI: Do not use the low-end silicone grease), then put the right size copper shims, then daub a little thermal silicone grease again, last install the heatsink and tighten the screws

CH004928
€2.70

1.0 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate

wishlist
Compare

i54200U SR170 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004929
€9.96

i5-4200U SR170 Stencil Template 90*90

wishlist
Compare

Multimeter probe with crocodile

1 Pair 1000V 10A Universal Digital Multimeter Meter Probe Test LeadsPin Red + Black

Features :

100% brand new and high quality.

and more accurate.

Up to 10A / 1000V

Material: PVC and Alloy

Color: Black + Red

Size length: 1.2 m

Package includeds :

1 x Pair of Digital Multimeter Meter Probe

CH004930
€4.85

Multimeter probe with crocodile

wishlist
Compare

AntMiner S9i 145T ASIC Bitcoin Miner Include Bitmain

AntMine S9i specification parameters:

1. Rated power: 14.5TH / S + 5%

2. Wall power consumption: 1365W+10% (wall efficiency, AC / DC 93% efficiency, 25 degree C ambient temperature)

3. Power efficiency: 94.14J/TH+10% (wall, AC / DC 93% efficiency, 25 degree C ambient temperature)

4. Rated voltage: 11.6~13.0V

5. Outer box size: 445 mm (L) *215 mm (W) *255 mm (H)

6. Cooling: 2 * 12038 fans.

7. Working temperature: 0 C to 40 C

8. Working humidity: 5%RH-95%RH, non condensation.

9. Network connection: Ethernet

10. Noise: 76dB

11. Machine weight (including packaging): mine 5.5kg+ power 2.5kg

12. Power connection mode: Each arithmetic board has three PCIE interfaces that need to be connected. It is recommended to use independent power supply to power the whole machine. In the case of independent power supply, three arithmetic boards can be connected to different power supply, but each arithmetic board can not connect multiple power sources, and ensure that the arithmetic board is finally powered on.

Matters needing attention:

1. Chassis deformation or heat sink falling off, please do not power up, contact after-sales treatment.

2. Do not use the two power supply with the same power plate.

3. Suggest using ant pond (www.antpool.com).

Bitmain Power Supply APW3

CH004931
€990.00

AntMiner S9i 14.5T ASIC Bitcoin Miner Include Bitmain

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Compare
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