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ITE IT8570E AXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004949
€3.45

ITE IT8570E (AXA)

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N2805 SR1LY Stencil Template

N2805 SR1LY Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004950
€6.22

N2805 SR1LY Stencil Template

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2160772034

216-0772034

Part Number 216-0772034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1031

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004951
€52.76

216-0772034

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SONY PS4 CXD90025G Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004954
€5.59

SONY PS4 CXD90025G Stencil Template

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i76820HK SR2FL Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004955
€6.84

i7-6820HK SR2FL Stencil Template

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2160732019 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004956
€5.40

216-0732019 Stencil Template

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NFG6100NA2

NF-G6100-N-A2

Part Number NF-G6100-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1026

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004957
€19.66

NF-G6100-N-A2

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14in1 Open Pry Screwdriver Repair Tool Kit for Apple iPhone iPad

Features

1 14 in 1 professioinal tool kit complete with screwdriver bits and tools necessary for repair of Apple products,latop,mp3 mp4 mp5 and other small electronic equipments.

2 POM opening levers to provide leverage to open the housing easily and access the inside parts safely.

3 Prying paddle for scratch-free opening of cases.

4 Used for repairing or replacing the touch screen, battery.back shell for your phone and computer

Description

5 point star pentalobe 0.8mm (for iphone 4/4s,for iphone 5/5S)

5 point star pentalobe 1.2mm (for bottom cover or case screws of MacBook Air (2010-2012) and Retina MacBook Pro 12&13 2012)

Phillips 1.5mm bit Screwdriver for the phillips screw.

Torx:T6 (for removable Mobile phones, Computers, the size of hard drives,Laptops,macbook,macbook air,macbook pro,Shavers and other appliances)

Flated 2.0mm

126 Nylon Spudger(Special for open cell phone and flex cable)

128 Plastic Pry(special for splitting the film)

Strong sucker(removing touch screens without leaving marks on device.)

Double Headed Crowbar(safely pry open devices without scratching the case, glass, or internal components)

Guitar pick (Screen peeling from the external screen below double-sided adhesive)

Pry pick (Opening the back shell)

Package Include

1 * Torx:T6

1 * 5 point star pentalobe 0.8

1 * 5 point star pentalobe 1.2

1 * Guitar pick

1 * Pry pick

1 * Rubber Pry pick

1 * 126 spudger

1 * 128 Plastic pry

3 * Strong sucker

1 * Blade

2 * Double headed crowbar

CH004958
€8.58

14in1 Open Pry Screwdriver Repair Tool Kit for Apple iPhone iPad

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i55200U SR23Y Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004959
€9.96

i5-5200U SR23Y Stencil Template 90*90

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i73667U SR0N5 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004960
€5.40

i7-3667U SR0N5 Stencil Template

ITE IT8570E AXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004949
€3.45

ITE IT8570E (AXA)

wishlist
Compare

N2805 SR1LY Stencil Template

N2805 SR1LY Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004950
€6.22

N2805 SR1LY Stencil Template

wishlist
Compare

2160772034

216-0772034

Part Number 216-0772034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1031

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004951
€52.76

216-0772034

wishlist
Compare

SONY PS4 CXD90025G Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004954
€5.59

SONY PS4 CXD90025G Stencil Template

wishlist
Compare

i76820HK SR2FL Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004955
€6.84

i7-6820HK SR2FL Stencil Template

wishlist
Compare

2160732019 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004956
€5.40

216-0732019 Stencil Template

wishlist
Compare

NFG6100NA2

NF-G6100-N-A2

Part Number NF-G6100-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1026

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004957
€19.66

NF-G6100-N-A2

wishlist
Compare

14in1 Open Pry Screwdriver Repair Tool Kit for Apple iPhone iPad

Features

1 14 in 1 professioinal tool kit complete with screwdriver bits and tools necessary for repair of Apple products,latop,mp3 mp4 mp5 and other small electronic equipments.

2 POM opening levers to provide leverage to open the housing easily and access the inside parts safely.

3 Prying paddle for scratch-free opening of cases.

4 Used for repairing or replacing the touch screen, battery.back shell for your phone and computer

Description

5 point star pentalobe 0.8mm (for iphone 4/4s,for iphone 5/5S)

5 point star pentalobe 1.2mm (for bottom cover or case screws of MacBook Air (2010-2012) and Retina MacBook Pro 12&13 2012)

Phillips 1.5mm bit Screwdriver for the phillips screw.

Torx:T6 (for removable Mobile phones, Computers, the size of hard drives,Laptops,macbook,macbook air,macbook pro,Shavers and other appliances)

Flated 2.0mm

126 Nylon Spudger(Special for open cell phone and flex cable)

128 Plastic Pry(special for splitting the film)

Strong sucker(removing touch screens without leaving marks on device.)

Double Headed Crowbar(safely pry open devices without scratching the case, glass, or internal components)

Guitar pick (Screen peeling from the external screen below double-sided adhesive)

Pry pick (Opening the back shell)

Package Include

1 * Torx:T6

1 * 5 point star pentalobe 0.8

1 * 5 point star pentalobe 1.2

1 * Guitar pick

1 * Pry pick

1 * Rubber Pry pick

1 * 126 spudger

1 * 128 Plastic pry

3 * Strong sucker

1 * Blade

2 * Double headed crowbar

CH004958
€8.58

14in1 Open Pry Screwdriver Repair Tool Kit for Apple iPhone iPad

wishlist
Compare

i55200U SR23Y Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004959
€9.96

i5-5200U SR23Y Stencil Template 90*90

wishlist
Compare

i73667U SR0N5 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004960
€5.40

i7-3667U SR0N5 Stencil Template

wishlist
Compare
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