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14in1 Open Pry Screwdriver Repair Tool Kit for Apple iPhone iPad

Features

1 14 in 1 professioinal tool kit complete with screwdriver bits and tools necessary for repair of Apple products,latop,mp3 mp4 mp5 and other small electronic equipments.

2 POM opening levers to provide leverage to open the housing easily and access the inside parts safely.

3 Prying paddle for scratch-free opening of cases.

4 Used for repairing or replacing the touch screen, battery.back shell for your phone and computer

Description

5 point star pentalobe 0.8mm (for iphone 4/4s,for iphone 5/5S)

5 point star pentalobe 1.2mm (for bottom cover or case screws of MacBook Air (2010-2012) and Retina MacBook Pro 12&13 2012)

Phillips 1.5mm bit Screwdriver for the phillips screw.

Torx:T6 (for removable Mobile phones, Computers, the size of hard drives,Laptops,macbook,macbook air,macbook pro,Shavers and other appliances)

Flated 2.0mm

126 Nylon Spudger(Special for open cell phone and flex cable)

128 Plastic Pry(special for splitting the film)

Strong sucker(removing touch screens without leaving marks on device.)

Double Headed Crowbar(safely pry open devices without scratching the case, glass, or internal components)

Guitar pick (Screen peeling from the external screen below double-sided adhesive)

Pry pick (Opening the back shell)

Package Include

1 * Torx:T6

1 * 5 point star pentalobe 0.8

1 * 5 point star pentalobe 1.2

1 * Guitar pick

1 * Pry pick

1 * Rubber Pry pick

1 * 126 spudger

1 * 128 Plastic pry

3 * Strong sucker

1 * Blade

2 * Double headed crowbar

CH004958
€8.58

14in1 Open Pry Screwdriver Repair Tool Kit for Apple iPhone iPad

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i55200U SR23Y Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004959
€9.96

i5-5200U SR23Y Stencil Template 90*90

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i73667U SR0N5 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004960
€5.40

i7-3667U SR0N5 Stencil Template

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N15SGTBA2

N15S-GT-B-A2

Part Number N13P-GV2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004961
€27.57

N15S-GT-B-A2

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i57200U SR342 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004962
€9.96

i5-7200U SR342 Stencil Template 90*90

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LGE35230

LGE35230

Part Number LGE35230 Manufacturer LG

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004965
€23.83

LGE35230

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DMD 12806038B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004966
€158.85

DMD 1280-6038B

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QUALCOMM SMB347ET1546Y

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004968
€3.45

QUALCOMM SMB347ET-1546Y

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PMB8763 A V100 INFINEON

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004969
€3.49

PMB8763 A V1.00 INFINEON

14in1 Open Pry Screwdriver Repair Tool Kit for Apple iPhone iPad

Features

1 14 in 1 professioinal tool kit complete with screwdriver bits and tools necessary for repair of Apple products,latop,mp3 mp4 mp5 and other small electronic equipments.

2 POM opening levers to provide leverage to open the housing easily and access the inside parts safely.

3 Prying paddle for scratch-free opening of cases.

4 Used for repairing or replacing the touch screen, battery.back shell for your phone and computer

Description

5 point star pentalobe 0.8mm (for iphone 4/4s,for iphone 5/5S)

5 point star pentalobe 1.2mm (for bottom cover or case screws of MacBook Air (2010-2012) and Retina MacBook Pro 12&13 2012)

Phillips 1.5mm bit Screwdriver for the phillips screw.

Torx:T6 (for removable Mobile phones, Computers, the size of hard drives,Laptops,macbook,macbook air,macbook pro,Shavers and other appliances)

Flated 2.0mm

126 Nylon Spudger(Special for open cell phone and flex cable)

128 Plastic Pry(special for splitting the film)

Strong sucker(removing touch screens without leaving marks on device.)

Double Headed Crowbar(safely pry open devices without scratching the case, glass, or internal components)

Guitar pick (Screen peeling from the external screen below double-sided adhesive)

Pry pick (Opening the back shell)

Package Include

1 * Torx:T6

1 * 5 point star pentalobe 0.8

1 * 5 point star pentalobe 1.2

1 * Guitar pick

1 * Pry pick

1 * Rubber Pry pick

1 * 126 spudger

1 * 128 Plastic pry

3 * Strong sucker

1 * Blade

2 * Double headed crowbar

CH004958
€8.58

14in1 Open Pry Screwdriver Repair Tool Kit for Apple iPhone iPad

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i55200U SR23Y Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004959
€9.96

i5-5200U SR23Y Stencil Template 90*90

wishlist
Compare

i73667U SR0N5 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004960
€5.40

i7-3667U SR0N5 Stencil Template

wishlist
Compare

N15SGTBA2

N15S-GT-B-A2

Part Number N13P-GV2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004961
€27.57

N15S-GT-B-A2

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Compare

i57200U SR342 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004962
€9.96

i5-7200U SR342 Stencil Template 90*90

wishlist
Compare

LGE35230

LGE35230

Part Number LGE35230 Manufacturer LG

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004965
€23.83

LGE35230

wishlist
Compare

DMD 12806038B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004966
€158.85

DMD 1280-6038B

wishlist
Compare

QUALCOMM SMB347ET1546Y

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004968
€3.45

QUALCOMM SMB347ET-1546Y

wishlist
Compare

PMB8763 A V100 INFINEON

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004969
€3.49

PMB8763 A V1.00 INFINEON

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Compare
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