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AM3420DDX43GX A63420M

AM3420DDX43GX A6-3420M

Part Number AM3420DDX43GX Manufacturer AMD

socket FS1 772-pin Date Code 12+

Package/Case 1 PCS Description Brand new

AM3420DDX43GX A6-3420M for Notebooks AMD 1.5 GHz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000301
€11.32

AM3420DDX43GX A6-3420M

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USB30 to NGFFM2 SSD hard disk box

Features:

Portable, Lightweight, Ultrathin.

Super cooling capacity.

No additional power required.

LED indicator light hint USB working condition.

Specification:

Color:Black

Transfer Speed: Super Speed 6Gbp/s

Material: Aluminum with oxidation/sand blasting

Dimensions:9.8x 3.9x 0.98 cm

Operating temperature: 5?~40?, storage temperature: -20?~70?

Assembly: By screws, suitable for all SSD Hard Disk

Weight:41g

Compatible with Windows XP / Vista / 7 / 8 / 10 and Mac OS 10.1 and above.

Package content:

1 x Usb 3.0 to NGFF SSD Case

1 x ScrewDriver

1 x USB 3.0 Male to USB 3.0 SuperSpeed Micro-B

1 x Pocket

1 x Manual

CH000570
€17.41

USB3.0 to NGFF(M.2) SSD hard disk box

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SR23L M5Y51

SR23L M-5Y51

Part Number SR23L M-5Y51 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000311
€57.44

SR23L M-5Y51

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N14PGSA2 GT740M

N14P-GS-A2 GT740M

Part Number N14P-GS-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1233

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000323
€54.15

N14P-GS-A2 GT740M

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N16SGTRSA2

N16S-GTR-S-A2

Part Number N16S-GTR-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000327
€24.62

N16S-GTR-S-A2

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2150804119

215-0804119

Part Number 215-0804119 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1442

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000330
€35.35

215-0804119

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Apple BIOS MBP15 2017 A1707 82000928 EMC3162

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000632
€37.05

Apple BIOS MBP15 2017 A1707 820-00928 EMC3162

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Apple BIOS MBP15 2014 A1398 8203662 EMC2876

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000669
€30.71

Apple BIOS MBP15 2014 A1398 820-3662 EMC2876

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SR23V i75600U

i7-5600U SR23V

Part Number SR23V i7-5600U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000333
€237.95

SR23V i7-5600U

AM3420DDX43GX A63420M

AM3420DDX43GX A6-3420M

Part Number AM3420DDX43GX Manufacturer AMD

socket FS1 772-pin Date Code 12+

Package/Case 1 PCS Description Brand new

AM3420DDX43GX A6-3420M for Notebooks AMD 1.5 GHz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000301
€11.32

AM3420DDX43GX A6-3420M

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USB30 to NGFFM2 SSD hard disk box

Features:

Portable, Lightweight, Ultrathin.

Super cooling capacity.

No additional power required.

LED indicator light hint USB working condition.

Specification:

Color:Black

Transfer Speed: Super Speed 6Gbp/s

Material: Aluminum with oxidation/sand blasting

Dimensions:9.8x 3.9x 0.98 cm

Operating temperature: 5?~40?, storage temperature: -20?~70?

Assembly: By screws, suitable for all SSD Hard Disk

Weight:41g

Compatible with Windows XP / Vista / 7 / 8 / 10 and Mac OS 10.1 and above.

Package content:

1 x Usb 3.0 to NGFF SSD Case

1 x ScrewDriver

1 x USB 3.0 Male to USB 3.0 SuperSpeed Micro-B

1 x Pocket

1 x Manual

CH000570
€17.41

USB3.0 to NGFF(M.2) SSD hard disk box

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SR23L M5Y51

SR23L M-5Y51

Part Number SR23L M-5Y51 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000311
€57.44

SR23L M-5Y51

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N14PGSA2 GT740M

N14P-GS-A2 GT740M

Part Number N14P-GS-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1233

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000323
€54.15

N14P-GS-A2 GT740M

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N16SGTRSA2

N16S-GTR-S-A2

Part Number N16S-GTR-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000327
€24.62

N16S-GTR-S-A2

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2150804119

215-0804119

Part Number 215-0804119 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1442

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000330
€35.35

215-0804119

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Compare

Apple BIOS MBP15 2017 A1707 82000928 EMC3162

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000632
€37.05

Apple BIOS MBP15 2017 A1707 820-00928 EMC3162

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Compare

Apple BIOS MBP15 2014 A1398 8203662 EMC2876

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000669
€30.71

Apple BIOS MBP15 2014 A1398 820-3662 EMC2876

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SR23V i75600U

i7-5600U SR23V

Part Number SR23V i7-5600U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000333
€237.95

SR23V i7-5600U

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