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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: Other BGA Chips & ICs
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USB30 to NGFFM2 SSD hard disk box

Features:

Portable, Lightweight, Ultrathin.

Super cooling capacity.

No additional power required.

LED indicator light hint USB working condition.

Specification:

Color:Black

Transfer Speed: Super Speed 6Gbp/s

Material: Aluminum with oxidation/sand blasting

Dimensions:9.8x 3.9x 0.98 cm

Operating temperature: 5?~40?, storage temperature: -20?~70?

Assembly: By screws, suitable for all SSD Hard Disk

Weight:41g

Compatible with Windows XP / Vista / 7 / 8 / 10 and Mac OS 10.1 and above.

Package content:

1 x Usb 3.0 to NGFF SSD Case

1 x ScrewDriver

1 x USB 3.0 Male to USB 3.0 SuperSpeed Micro-B

1 x Pocket

1 x Manual

CH000570
€17.41

USB3.0 to NGFF(M.2) SSD hard disk box

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TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

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IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

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Intersil ISL95833HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000263
€3.45

Intersil ISL95833HRTZ

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Apple BIOS MBP15 2017 A1707 82000928 EMC3162

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000632
€37.05

Apple BIOS MBP15 2017 A1707 820-00928 EMC3162

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Intersil ISL95870A UTQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000272
€3.45

Intersil ISL95870A UTQFN

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Apple BIOS MBP15 2014 A1398 8203662 EMC2876

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000669
€30.71

Apple BIOS MBP15 2014 A1398 820-3662 EMC2876

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NUVOTON NPCE794LAODX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000273
€3.97

NUVOTON NPCE794LAODX

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Apple BIOS MBP13 2017 A1706 82000923 EMC3163

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000723
€37.05

Apple BIOS MBP13 2017 A1706 820-00923 EMC3163

USB30 to NGFFM2 SSD hard disk box

Features:

Portable, Lightweight, Ultrathin.

Super cooling capacity.

No additional power required.

LED indicator light hint USB working condition.

Specification:

Color:Black

Transfer Speed: Super Speed 6Gbp/s

Material: Aluminum with oxidation/sand blasting

Dimensions:9.8x 3.9x 0.98 cm

Operating temperature: 5?~40?, storage temperature: -20?~70?

Assembly: By screws, suitable for all SSD Hard Disk

Weight:41g

Compatible with Windows XP / Vista / 7 / 8 / 10 and Mac OS 10.1 and above.

Package content:

1 x Usb 3.0 to NGFF SSD Case

1 x ScrewDriver

1 x USB 3.0 Male to USB 3.0 SuperSpeed Micro-B

1 x Pocket

1 x Manual

CH000570
€17.41

USB3.0 to NGFF(M.2) SSD hard disk box

wishlist
Compare

TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

wishlist
Compare

IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

wishlist
Compare

Intersil ISL95833HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000263
€3.45

Intersil ISL95833HRTZ

wishlist
Compare

Apple BIOS MBP15 2017 A1707 82000928 EMC3162

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000632
€37.05

Apple BIOS MBP15 2017 A1707 820-00928 EMC3162

wishlist
Compare

Intersil ISL95870A UTQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000272
€3.45

Intersil ISL95870A UTQFN

wishlist
Compare

Apple BIOS MBP15 2014 A1398 8203662 EMC2876

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000669
€30.71

Apple BIOS MBP15 2014 A1398 820-3662 EMC2876

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Bottom Case Cover Screw Screws Set For Apple White MacBook Unibody 13

Product Name

Bottom Case Cover Screw Set for MacBook Unibody 13" A1342

Product Condition

NEW

Compatible Model

MacBook 13" A1342 2009 2010

Compatible Subfamily

MacBook "Core 2 Duo" 2.26 13" (Uni/Late 09)

MacBook "Core 2 Duo" 2.4 13" (Mid-2010)

Compatible Model No

MC207LL/A, MC516LL/A

CH000713
€3.73

Bottom Case Cover Screw Screws Set For Apple White MacBook Unibody 13

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NUVOTON NPCE794LAODX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000273
€3.97

NUVOTON NPCE794LAODX

wishlist
Compare

Apple BIOS MBP13 2017 A1706 82000923 EMC3163

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000723
€37.05

Apple BIOS MBP13 2017 A1706 820-00923 EMC3163

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