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  • Categories: BGA Reballing Kits, Stencils
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  • Categories: PCI, CPU Socket Tester

980 YFC Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000204
€5.40

980 YFC Stencil Template

N15EGXA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000205
€7.46

N15E-GX-A2 Stencil Template

i52520M SR04A Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000209
€5.40

i5-2520M SR04A Stencil Template

PTi8 Laptop PC Computer PCI Motherboard Diagnostic Tester Analyzer Post

Features:

PC LCD post test card Professional Version PTI8 is the 2011 latest computer repair tool, this professional version has all the advantages of Accurate PTI6, while it has upgraded the chip solution, adapting three-level menu operation, adding hundreds of diagnostic codes (from authoritative institution).

PTI8 could offer real-time monitoring on the voltage, and the professional function like key signal monitoring.

With unique Muti Post technology, PTI8 is able to monitor most POST interface of most motherboard, and it is compatible with most of the popular motherboards

Pti8 has MINIPCIE, MINIPCI, LPC these three interfaces of notebook PC, which makes it new generation motherboards LCD Post Card that is compatible with both desktop and notebook PC.

PTi has two screens design, as we had feedbacks from customers that one screen is not convenient enough.

PTI8 is a indispensable tool for computer repair personals.

It supports Desktop PCI interface and laptop Mini PCI-E interface,

Comprehensively compatible all motherboards' PCI socket.

Passed the strict test for 9 kinds of Asus mainstream motherboards, cover INTEL and AMD mainstream products.

The compatibility also passed the test for a series of motherboards of INTEL 815, INTEL 845, INTEL 865, INTEL 915, INTEL 945 INTEL 965 ATI SB600, ATI Xpress 200, ATI Xpress 1100, AMD 480X chipset .

Package Includes:

1 x Diagnostic Debug Card support Desktop PCI with extention LCD Display

1 x Diagnostic Card support Laptop Mini PCI / Mini PCI-E / LPC

1 x Cable for Laptop diagnostic card

CH004553
€19.77

PTi8 Laptop PC Computer PCI Motherboard Diagnostic Tester Analyzer Post

216MSA4ALA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000212
€5.40

216MSA4ALA12FG Stencil Template

BD82B75 SLJ85 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000216
€5.40

BD82B75 SLJ85 Stencil Template

i77700HQ SR32Q Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000225
€13.23

i7-7700HQ SR32Q Stencil Template 90*90

N10MGLMSA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000228
€5.40

N10M-GLM-S-A2 Stencil Template

980 YFC Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000204
€5.40

980 YFC Stencil Template

Laptop Notebook 1155 Dummy Loading Board Test Card CPU Socket Tester

Description

Condition: new and original

Note : Due to post air mail can not send button battery (CR2032 ,3.2V) , so we will not send button battery , please you buy from your hometown. thank you so much !

Package includes:

1 * Tester (No English Manual)

CH004523
€10.57

Laptop Notebook 1155 Dummy Loading Board Test Card CPU Socket Tester

N15EGXA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000205
€7.46

N15E-GX-A2 Stencil Template

i52520M SR04A Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000209
€5.40

i5-2520M SR04A Stencil Template

PTi8 Laptop PC Computer PCI Motherboard Diagnostic Tester Analyzer Post

Features:

PC LCD post test card Professional Version PTI8 is the 2011 latest computer repair tool, this professional version has all the advantages of Accurate PTI6, while it has upgraded the chip solution, adapting three-level menu operation, adding hundreds of diagnostic codes (from authoritative institution).

PTI8 could offer real-time monitoring on the voltage, and the professional function like key signal monitoring.

With unique Muti Post technology, PTI8 is able to monitor most POST interface of most motherboard, and it is compatible with most of the popular motherboards

Pti8 has MINIPCIE, MINIPCI, LPC these three interfaces of notebook PC, which makes it new generation motherboards LCD Post Card that is compatible with both desktop and notebook PC.

PTi has two screens design, as we had feedbacks from customers that one screen is not convenient enough.

PTI8 is a indispensable tool for computer repair personals.

It supports Desktop PCI interface and laptop Mini PCI-E interface,

Comprehensively compatible all motherboards' PCI socket.

Passed the strict test for 9 kinds of Asus mainstream motherboards, cover INTEL and AMD mainstream products.

The compatibility also passed the test for a series of motherboards of INTEL 815, INTEL 845, INTEL 865, INTEL 915, INTEL 945 INTEL 965 ATI SB600, ATI Xpress 200, ATI Xpress 1100, AMD 480X chipset .

Package Includes:

1 x Diagnostic Debug Card support Desktop PCI with extention LCD Display

1 x Diagnostic Card support Laptop Mini PCI / Mini PCI-E / LPC

1 x Cable for Laptop diagnostic card

CH004553
€19.77

PTi8 Laptop PC Computer PCI Motherboard Diagnostic Tester Analyzer Post

216MSA4ALA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000212
€5.40

216MSA4ALA12FG Stencil Template

BD82B75 SLJ85 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000216
€5.40

BD82B75 SLJ85 Stencil Template

Laptop Notebook 1150 Dummy Loading Board Test Card CPU Socket Tester

Description

Condition: new and original

Note : Due to post air mail can not send button battery (CR2032 ,3.2V) , so we will not send button battery , please you buy from your hometown. thank you so much !

Package includes:

1 * Tester (No English Manual)

CH004973
€10.57

Laptop Notebook 1150 Dummy Loading Board Test Card CPU Socket Tester

i77700HQ SR32Q Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000225
€13.23

i7-7700HQ SR32Q Stencil Template 90*90

N10MGLMSA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000228
€5.40

N10M-GLM-S-A2 Stencil Template