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SPI SAM EFI Ribbon Cable ROM Debug Connector Tool for Macbook

In package:

1 pcs   x  EFI Ribbon Cable

Shipping time

 You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide) 

Expedited : 5-10 working days  (Europe and Worldwide) 

 

Product description:

Modify, and upgrade your MacBook effortlessly with our Professional BIOS Flashing Set. Perfect for MacBook, MacBook Air, and MacBook Pro models from 2010 to 2017, this set allows manual in bios bin file settings adjustments for ME region, iCloud, and BIOS passw clearing. No de-soldering required.

 

Compatible Mcbooks with SVOD, RT809H/F:

A1534 emc 2746 820-00045, A1534 emc 2991 820-00244, A1534 emc 3099 820-00687, A1370 emc 2393 820-2796, A1370 EMCXXXX 820-2955, A1370 EMCXXXX 820-2955, A1465 emc 2558 820-3208, A1465 emc 2631 820-3435, A1465 emc 2924 820-00164, A1304 EMCXXXX 820-2375, A1304 EMCXXXX 820-2375, A1369 emc 2469 820-3023, A1466 emc 259 820-32509, A1466 emc 2632 820-3437, A1466 emc 2925 820-00165, A1466 emc 3178 820-00165, A1425 emc 2512 820-3462, A1502 emc 2678 820-3536, A1502 emc 2678 820-3476, A1502 emc 2875 820-3476, A1502 emc 2835 820-4924, A1398 emc 2512 820-3332, A1398 emc 2673 820-3332, A1398 emc 2746 820-3662, A1398 emc 2876 820-3662, A1398 emc 2745 820-3787, A1398 emc 2881 820-3787, A1398 emc 2909 820-00138, A1398 emc 2910 820-00163, A1398 emc 2910 820-00426, A1708 EMCXXXX 820-00361, A1708 emc 2978 820-00875, A1708 emc 3164 820-00840, A1706 emc 3071 820-00239, A1706 emc 3163 820-00923, A1707 emc 3072 820-00281, A1707 emc 3162 820-00928, A1283 emc 2264 820-2366,A1283 emc 2336 820-XXXX, A1347 emc 2364 820-2577, A1347 emc 2442 820-2993, A1347 emc 2442 820-3059, A1347 emc 2442 820-3017, A1347 emc 2570 820-3227, A1347 emc XXXX 820-3228, A1347 emc 2840 820-5509 

CH341 supported:

MBA11 2015 A1465 820-00164

MBA11 2013 A1465 820-3435

MBA13 2011 A1369 820-3023

MBA11 2011 A1370 820-3024

MBA 13 2013 A1466 820-3437

MBA 13 2012 A1466 820-3209

MBA13 2015 A1466 820-00165

MBA13 2017 A1466 820-00165

2016 A1708 820-00875 MBP13

MBP13 2016 A1706 820-00239

MBP15 2017 A1707 820-00928

MBP15 2016 A1707 820-00281

MBP13 2017 A1706 820-00923

MBP13 2017 A1708 820-00840

MBP13 2015 A1502 820-4924

MBP13 2014 A1502 820-3476

MBP13 2014 A1502 820-3536 

MBP13 2013 A1502 820-3476

MBP13 2014 A1502 820-3476

MBP15 2012 A1398 820-3332

MBP15 2013 A1398 820-3332

MBP15 2013 A1398 820-3662

MBP15 2013 A1398 820-3787

MBP15 2014 A1398 820-3662

MBP15 2015 A1398 820-00138 

MBP15 2015 A1398 820-00163

MBP12 2015 A1534 820-00045

MBP12 2016 A1534 820-00244

MacMini 2011 A1347 820-2993

  

Warranty

This product will have a 90-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Colombia, Paraguay, Brazil, Mexico - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país

 

SE000001
€45.00

In package:

1 pcs   x  EFI Ribbon Cable
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SR2Z9 J3455

SR2Z9 J3455

Part Number SR2Z9 J3455 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000285
€57.44

SR2Z9 J3455

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N10PGV1 GT120M

N10P-GV1 GT120M

Part Number N10P-GV1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000296
€25.93

N10P-GV1 GT120M

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RT BGA130 01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA130-01 V1.1

1pcs x Frame 

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000347
€76.00

RT-BGA130-01 POS NAND MCP Adapter For RT809H Programmer

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N10MNSSB1

N10M-NS-S-B1

Part Number N10M-NS-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000298
€15.59

N10M-NS-S-B1

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LE82GM965 SLA5T

LE82GM965 SLA5T

Part Number LE82GM965 SLA5T Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 0846

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000300
€11.49

LE82GM965 SLA5T

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EMMC BGA153BGA169 EMMC BGA162BGA186BGA221 series socket 3in1 data recovery programming and test Chips

EMMC153 169 EMMC162 186 EMMC221 series socket 3 Functions in 1 USB interface PCB board data recovery programming and test Chips

(At the same time compatible with EMMC, EMCP.BGA221 test block bias)

General test seat introduction

Login to Download: Download software Data Recovery Tutorial

Feature:

* Apply to eMCP and eMMC of Sumsung, Sandis k, Toshiba, Hynix, Micron, MTK and Intel.

* Apply to BGA153 BGA169 BGA162 BGA186 BGA221.(just need to change the corresponding socket)

* Easy operation by just inserting the USB into PC.

* It provides a compact test solution for eMMC eMCP used in applications such as mobile, data recorder, the Internet of things, etc.

1) Test, debug, validation, and programming of eMMC eMCP device

2) Failure analysis / System and wafer test.

3) Package and Chip qualification.

4) Production prototype / Data recovery.

We provide a simple software which can chekc the capacity , read , write and verify , please send us an email if you need it.

Specification:

* Type : BGA153/169 BGA162/186 BGA221 test socket ( USB interface )

* Pin Count :

BGA153/169 test socket:30 pins

BGA162/186 test socket : 17 pins

BGA221 test socket : 36 pins

* Pin Pitch : 0.5mm

* Applicable IC Size : 11.5x13mm , 12x16mm , 12x18mm , 14x18mm

* Life Span : 25,000 times

Package Including:

1 * BGA153/169 socket

1 * BGA162/186 socket

1 * BGA221 socket

1 * PCB test board with USB

4 * border limiters ( 11.5x13mm , 12x16mm , 12x18mm , 14x18mm )

CH000368
€196.43

EMMC BGA153/BGA169 EMMC BGA162/BGA186/BGA221 series socket 3in1 data recovery programming and test Chips

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AM3420DDX43GX A63420M

AM3420DDX43GX A6-3420M

Part Number AM3420DDX43GX Manufacturer AMD

socket FS1 772-pin Date Code 12+

Package/Case 1 PCS Description Brand new

AM3420DDX43GX A6-3420M for Notebooks AMD 1.5 GHz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000301
€11.32

AM3420DDX43GX A6-3420M

  • New

SPI SAM EFI Ribbon Cable ROM Debug Connector Tool for Macbook

In package:

1 pcs   x  EFI Ribbon Cable

Shipping time

 You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide) 

Expedited : 5-10 working days  (Europe and Worldwide) 

 

Product description:

Modify, and upgrade your MacBook effortlessly with our Professional BIOS Flashing Set. Perfect for MacBook, MacBook Air, and MacBook Pro models from 2010 to 2017, this set allows manual in bios bin file settings adjustments for ME region, iCloud, and BIOS passw clearing. No de-soldering required.

 

Compatible Mcbooks with SVOD, RT809H/F:

A1534 emc 2746 820-00045, A1534 emc 2991 820-00244, A1534 emc 3099 820-00687, A1370 emc 2393 820-2796, A1370 EMCXXXX 820-2955, A1370 EMCXXXX 820-2955, A1465 emc 2558 820-3208, A1465 emc 2631 820-3435, A1465 emc 2924 820-00164, A1304 EMCXXXX 820-2375, A1304 EMCXXXX 820-2375, A1369 emc 2469 820-3023, A1466 emc 259 820-32509, A1466 emc 2632 820-3437, A1466 emc 2925 820-00165, A1466 emc 3178 820-00165, A1425 emc 2512 820-3462, A1502 emc 2678 820-3536, A1502 emc 2678 820-3476, A1502 emc 2875 820-3476, A1502 emc 2835 820-4924, A1398 emc 2512 820-3332, A1398 emc 2673 820-3332, A1398 emc 2746 820-3662, A1398 emc 2876 820-3662, A1398 emc 2745 820-3787, A1398 emc 2881 820-3787, A1398 emc 2909 820-00138, A1398 emc 2910 820-00163, A1398 emc 2910 820-00426, A1708 EMCXXXX 820-00361, A1708 emc 2978 820-00875, A1708 emc 3164 820-00840, A1706 emc 3071 820-00239, A1706 emc 3163 820-00923, A1707 emc 3072 820-00281, A1707 emc 3162 820-00928, A1283 emc 2264 820-2366,A1283 emc 2336 820-XXXX, A1347 emc 2364 820-2577, A1347 emc 2442 820-2993, A1347 emc 2442 820-3059, A1347 emc 2442 820-3017, A1347 emc 2570 820-3227, A1347 emc XXXX 820-3228, A1347 emc 2840 820-5509 

CH341 supported:

MBA11 2015 A1465 820-00164

MBA11 2013 A1465 820-3435

MBA13 2011 A1369 820-3023

MBA11 2011 A1370 820-3024

MBA 13 2013 A1466 820-3437

MBA 13 2012 A1466 820-3209

MBA13 2015 A1466 820-00165

MBA13 2017 A1466 820-00165

2016 A1708 820-00875 MBP13

MBP13 2016 A1706 820-00239

MBP15 2017 A1707 820-00928

MBP15 2016 A1707 820-00281

MBP13 2017 A1706 820-00923

MBP13 2017 A1708 820-00840

MBP13 2015 A1502 820-4924

MBP13 2014 A1502 820-3476

MBP13 2014 A1502 820-3536 

MBP13 2013 A1502 820-3476

MBP13 2014 A1502 820-3476

MBP15 2012 A1398 820-3332

MBP15 2013 A1398 820-3332

MBP15 2013 A1398 820-3662

MBP15 2013 A1398 820-3787

MBP15 2014 A1398 820-3662

MBP15 2015 A1398 820-00138 

MBP15 2015 A1398 820-00163

MBP12 2015 A1534 820-00045

MBP12 2016 A1534 820-00244

MacMini 2011 A1347 820-2993

  

Warranty

This product will have a 90-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Colombia, Paraguay, Brazil, Mexico - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país

 

SE000001
€45.00

In package:

1 pcs   x  EFI Ribbon Cable
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BGA64 01 frame 11x13mm special EMMC Adapter For RT809H Programmer

RT809H special seat RT-BGA64-01 V2.0 EMMC Adapter

Product Description:

RT-BGA64-01 1.0mm spacing frame 11*13mm Adapt to S29GL512 S29GL256 S29GL128 S29GL064 S29GL032

RT-BGA64-02 1.0mm spacing frame 10*13mm Adapt to 28F640,28F128

RT-BGA64-02 1.0mm spacing frame 10*15mm Adapt to 28F256

CH000343
€58.00

RT-BGA64-01 frame 11*13mm special EMMC Adapter For RT809H Programmer

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SR2Z9 J3455

SR2Z9 J3455

Part Number SR2Z9 J3455 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000285
€57.44

SR2Z9 J3455

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Compare

N10PGV1 GT120M

N10P-GV1 GT120M

Part Number N10P-GV1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000296
€25.93

N10P-GV1 GT120M

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RT BGA130 01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA130-01 V1.1

1pcs x Frame 

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000347
€76.00

RT-BGA130-01 POS NAND MCP Adapter For RT809H Programmer

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Compare

N10MNSSB1

N10M-NS-S-B1

Part Number N10M-NS-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000298
€15.59

N10M-NS-S-B1

wishlist
Compare

LE82GM965 SLA5T

LE82GM965 SLA5T

Part Number LE82GM965 SLA5T Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 0846

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000300
€11.49

LE82GM965 SLA5T

wishlist
Compare

EMMC BGA153BGA169 EMMC BGA162BGA186BGA221 series socket 3in1 data recovery programming and test Chips

EMMC153 169 EMMC162 186 EMMC221 series socket 3 Functions in 1 USB interface PCB board data recovery programming and test Chips

(At the same time compatible with EMMC, EMCP.BGA221 test block bias)

General test seat introduction

Login to Download: Download software Data Recovery Tutorial

Feature:

* Apply to eMCP and eMMC of Sumsung, Sandis k, Toshiba, Hynix, Micron, MTK and Intel.

* Apply to BGA153 BGA169 BGA162 BGA186 BGA221.(just need to change the corresponding socket)

* Easy operation by just inserting the USB into PC.

* It provides a compact test solution for eMMC eMCP used in applications such as mobile, data recorder, the Internet of things, etc.

1) Test, debug, validation, and programming of eMMC eMCP device

2) Failure analysis / System and wafer test.

3) Package and Chip qualification.

4) Production prototype / Data recovery.

We provide a simple software which can chekc the capacity , read , write and verify , please send us an email if you need it.

Specification:

* Type : BGA153/169 BGA162/186 BGA221 test socket ( USB interface )

* Pin Count :

BGA153/169 test socket:30 pins

BGA162/186 test socket : 17 pins

BGA221 test socket : 36 pins

* Pin Pitch : 0.5mm

* Applicable IC Size : 11.5x13mm , 12x16mm , 12x18mm , 14x18mm

* Life Span : 25,000 times

Package Including:

1 * BGA153/169 socket

1 * BGA162/186 socket

1 * BGA221 socket

1 * PCB test board with USB

4 * border limiters ( 11.5x13mm , 12x16mm , 12x18mm , 14x18mm )

CH000368
€196.43

EMMC BGA153/BGA169 EMMC BGA162/BGA186/BGA221 series socket 3in1 data recovery programming and test Chips

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Compare

AM3420DDX43GX A63420M

AM3420DDX43GX A6-3420M

Part Number AM3420DDX43GX Manufacturer AMD

socket FS1 772-pin Date Code 12+

Package/Case 1 PCS Description Brand new

AM3420DDX43GX A6-3420M for Notebooks AMD 1.5 GHz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000301
€11.32

AM3420DDX43GX A6-3420M

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