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  • Categories: DC Jacks, Connector
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SR2Z9 J3455

SR2Z9 J3455

Part Number SR2Z9 J3455 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000285
€57.44

SR2Z9 J3455

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DC Power Jack Part PJ053

Asus A7 Series DC Power Jack Connector: A7k, A7KC, A7M, A7S, A7SN, A7SV, A7T, A7TB, A7TC, A7U, A7UC

Asus G2 Series DC Power Jack Connector: G2S G2P-7R001M

*Asus F52 Series DC Power Jack Connector: F52, F52A

*Asus F82 Series DC Power Jack Connector: F82, F82Q

*Asus K40 Series DC Power Jack Connector: K40, K40AB, K40AC, K40AD, K40AE, K40AF, K40C, K50I, K40ID, K40IE, K40IJ, K40IL, K40IN, K40IP

*Asus K50 Series DC Power Jack Connector: K50AB, K50AD, K50AF, K50C, K50ID, K50IE, K50IJ-A1, K50IJ-C1, K50IJ-D1, K50IJ-G1B, K50IJ-J1, K50IJ-RX, K50IL, K50IN, K50IP

*Asus K60 Series DC Power Jack Connector: K60IJ, K60IL, K60IN

*Asus K70 Series DC Power Jack Connector: K70AB, K70AC, K70AD, K70AE, K70AF, K70IC, K70ID, K70IJ, K70IL, K70IO

*Asus P50 Series DC Power Jack Connector: P50IJ, P50IJ-X1, P50IJ-X2

Asus U43 Series DC Power Jack Connector: U43F, U43JC, U43SD

*Asus U50 Series DC Power Jack Connector: U50, U50A, U50F

*Asus UL50 Series DC Power Jack Connector: UL50A, UL50AG, UL50AT, UL50AT-X1, UL50V, UL50VT

Asus UL80 Series DC Power Jack Connector: UL80A, UL80AG, UL80AG-A1, UL80AG-A2, UL80V, UL80VT, UL80VT-A1, UL80VT-A1

*Asus X5 Series DC Power Jack Connector: X5, X5C, X5DC

Toshiba Satellite DC Power Jack Connector: L45 Series

IBM Lenovo IdeaPad DC Power Jack Connector: Y510, Y530

Note: This is the Jack only, you will need to reuse your harness.

* Models that do not need the mounting ears, simply remove them by bending them back and forth until they break off or reuse the shield on your original jack and install on the new jack.

CH000695
€14.42

DC Power Jack, Part #PJ053

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N10PGV1 GT120M

N10P-GV1 GT120M

Part Number N10P-GV1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000296
€25.93

N10P-GV1 GT120M

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N10MNSSB1

N10M-NS-S-B1

Part Number N10M-NS-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000298
€15.59

N10M-NS-S-B1

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LE82GM965 SLA5T

LE82GM965 SLA5T

Part Number LE82GM965 SLA5T Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 0846

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000300
€11.49

LE82GM965 SLA5T

SR2Z9 J3455

SR2Z9 J3455

Part Number SR2Z9 J3455 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000285
€57.44

SR2Z9 J3455

wishlist
Compare

DC Power Jack Part PJ053

Asus A7 Series DC Power Jack Connector: A7k, A7KC, A7M, A7S, A7SN, A7SV, A7T, A7TB, A7TC, A7U, A7UC

Asus G2 Series DC Power Jack Connector: G2S G2P-7R001M

*Asus F52 Series DC Power Jack Connector: F52, F52A

*Asus F82 Series DC Power Jack Connector: F82, F82Q

*Asus K40 Series DC Power Jack Connector: K40, K40AB, K40AC, K40AD, K40AE, K40AF, K40C, K50I, K40ID, K40IE, K40IJ, K40IL, K40IN, K40IP

*Asus K50 Series DC Power Jack Connector: K50AB, K50AD, K50AF, K50C, K50ID, K50IE, K50IJ-A1, K50IJ-C1, K50IJ-D1, K50IJ-G1B, K50IJ-J1, K50IJ-RX, K50IL, K50IN, K50IP

*Asus K60 Series DC Power Jack Connector: K60IJ, K60IL, K60IN

*Asus K70 Series DC Power Jack Connector: K70AB, K70AC, K70AD, K70AE, K70AF, K70IC, K70ID, K70IJ, K70IL, K70IO

*Asus P50 Series DC Power Jack Connector: P50IJ, P50IJ-X1, P50IJ-X2

Asus U43 Series DC Power Jack Connector: U43F, U43JC, U43SD

*Asus U50 Series DC Power Jack Connector: U50, U50A, U50F

*Asus UL50 Series DC Power Jack Connector: UL50A, UL50AG, UL50AT, UL50AT-X1, UL50V, UL50VT

Asus UL80 Series DC Power Jack Connector: UL80A, UL80AG, UL80AG-A1, UL80AG-A2, UL80V, UL80VT, UL80VT-A1, UL80VT-A1

*Asus X5 Series DC Power Jack Connector: X5, X5C, X5DC

Toshiba Satellite DC Power Jack Connector: L45 Series

IBM Lenovo IdeaPad DC Power Jack Connector: Y510, Y530

Note: This is the Jack only, you will need to reuse your harness.

* Models that do not need the mounting ears, simply remove them by bending them back and forth until they break off or reuse the shield on your original jack and install on the new jack.

CH000695
€14.42

DC Power Jack, Part #PJ053

wishlist
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N10PGV1 GT120M

N10P-GV1 GT120M

Part Number N10P-GV1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000296
€25.93

N10P-GV1 GT120M

wishlist
Compare

N10MNSSB1

N10M-NS-S-B1

Part Number N10M-NS-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000298
€15.59

N10M-NS-S-B1

wishlist
Compare

LE82GM965 SLA5T

LE82GM965 SLA5T

Part Number LE82GM965 SLA5T Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 0846

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000300
€11.49

LE82GM965 SLA5T

wishlist
Compare
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