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  • Categories: Adapter, DC cable
  • Categories: CPU and Graphic Chips
  • Categories: Other BGA Chips & ICs
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SR2Z9 J3455

SR2Z9 J3455

Part Number SR2Z9 J3455 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000285
€57.44

SR2Z9 J3455

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ASMEDIA ASM1042

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000234
€3.45

ASMEDIA ASM1042

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N10PGV1 GT120M

N10P-GV1 GT120M

Part Number N10P-GV1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000296
€25.93

N10P-GV1 GT120M

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RICHTEK RT8209B A0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000238
€3.45

RICHTEK RT8209B (A0=)

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N10MNSSB1

N10M-NS-S-B1

Part Number N10M-NS-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000298
€15.59

N10M-NS-S-B1

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1 set DC Power 5521mm Jack to 28 Plug Adapter Notebook Universal 66 Male Adapter Connector

Features:

100% Brand new and high quality

Used for external power source and on-board transformer

Plug male diameter outside/inside(or pin

1 set Multi-function DC Plugs for AC Power Adapter Notebook Laptop

Universal 5.5 x 2.1mm Jack to 28 Plugs

Plug Name: DC conversion head

Scope: power conversion head

Specification:

1:7.9mmx1.0mm

2: 7.4mmx1.0mm round

3: 7.4mmx1.0mm octahedron

4: 6.0mmx3.0mm

5: 6.0mmx1.0mm

6: 5.5mmx2.5mm

7: 5.5mmx2.5mm

8: 5.5mmx2.5mm

9: 5.5mmx2.1mm

10: 5.5mmx2.1mm

11: 5.5mmx2.1mm

12: 5.5mmx1.7mm

13: 5.0mmx2.5mm

14: 5.0mmx2.1mm

15: 5.0mmx1.0mm

16: 5.0mmx1.0mm

17: 4.8mmx1.7mm

18: 4.8mmx1.7mm

19: 4.0mmx1.7mm

20: 3.5mmx1.35mm

21: 3.0mmx1.0mm

22: 2.5mmx0.7mmx10mm

23: 2.5mmx0.7mmx8mm

24 :for apple

25: 4pin female

26: 3pin female

27: 3.5mm mono plug

28: 2.5mm mono plug

Package Included:

28pcs x Adapters

CH001136
€11.81

1 set DC Power 5.5*2.1mm Jack to 28 Plug Adapter Notebook Universal 66 Male Adapter Connector

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ENE KB3926QF D2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000243
€3.45

ENE KB3926QF D2

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LE82GM965 SLA5T

LE82GM965 SLA5T

Part Number LE82GM965 SLA5T Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 0846

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000300
€11.49

LE82GM965 SLA5T

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AM3420DDX43GX A63420M

AM3420DDX43GX A6-3420M

Part Number AM3420DDX43GX Manufacturer AMD

socket FS1 772-pin Date Code 12+

Package/Case 1 PCS Description Brand new

AM3420DDX43GX A6-3420M for Notebooks AMD 1.5 GHz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000301
€11.32

AM3420DDX43GX A6-3420M

SR2Z9 J3455

SR2Z9 J3455

Part Number SR2Z9 J3455 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000285
€57.44

SR2Z9 J3455

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ASMEDIA ASM1042

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000234
€3.45

ASMEDIA ASM1042

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N10PGV1 GT120M

N10P-GV1 GT120M

Part Number N10P-GV1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000296
€25.93

N10P-GV1 GT120M

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RICHTEK RT8209B A0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000238
€3.45

RICHTEK RT8209B (A0=)

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N10MNSSB1

N10M-NS-S-B1

Part Number N10M-NS-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000298
€15.59

N10M-NS-S-B1

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1 set DC Power 5521mm Jack to 28 Plug Adapter Notebook Universal 66 Male Adapter Connector

Features:

100% Brand new and high quality

Used for external power source and on-board transformer

Plug male diameter outside/inside(or pin

1 set Multi-function DC Plugs for AC Power Adapter Notebook Laptop

Universal 5.5 x 2.1mm Jack to 28 Plugs

Plug Name: DC conversion head

Scope: power conversion head

Specification:

1:7.9mmx1.0mm

2: 7.4mmx1.0mm round

3: 7.4mmx1.0mm octahedron

4: 6.0mmx3.0mm

5: 6.0mmx1.0mm

6: 5.5mmx2.5mm

7: 5.5mmx2.5mm

8: 5.5mmx2.5mm

9: 5.5mmx2.1mm

10: 5.5mmx2.1mm

11: 5.5mmx2.1mm

12: 5.5mmx1.7mm

13: 5.0mmx2.5mm

14: 5.0mmx2.1mm

15: 5.0mmx1.0mm

16: 5.0mmx1.0mm

17: 4.8mmx1.7mm

18: 4.8mmx1.7mm

19: 4.0mmx1.7mm

20: 3.5mmx1.35mm

21: 3.0mmx1.0mm

22: 2.5mmx0.7mmx10mm

23: 2.5mmx0.7mmx8mm

24 :for apple

25: 4pin female

26: 3pin female

27: 3.5mm mono plug

28: 2.5mm mono plug

Package Included:

28pcs x Adapters

CH001136
€11.81

1 set DC Power 5.5*2.1mm Jack to 28 Plug Adapter Notebook Universal 66 Male Adapter Connector

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ENE KB3926QF D2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000243
€3.45

ENE KB3926QF D2

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LE82GM965 SLA5T

LE82GM965 SLA5T

Part Number LE82GM965 SLA5T Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 0846

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000300
€11.49

LE82GM965 SLA5T

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AM3420DDX43GX A63420M

AM3420DDX43GX A6-3420M

Part Number AM3420DDX43GX Manufacturer AMD

socket FS1 772-pin Date Code 12+

Package/Case 1 PCS Description Brand new

AM3420DDX43GX A6-3420M for Notebooks AMD 1.5 GHz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000301
€11.32

AM3420DDX43GX A6-3420M

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