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N2830 SR1W4 Stencil Template

N2830 SR1W4 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005044
€6.22

N2830 SR1W4 Stencil Template

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ITE IT8518E HXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005045
€3.45

ITE IT8518E (HXA)

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G86741A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005046
€5.40

G86-741-A2 Stencil Template

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GTX1050 N17PGOA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005047
€5.40

GTX1050 N17P-GO-A1 Stencil Template

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SMSC LPC47M997NW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005048
€4.45

SMSC LPC47M997-NW

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MCP67DA3

MCP67D-A3

Part Number MCP67D-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0818

Package/Case 240 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005050
€31.15

MCP67D-A3

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RICHTEK RT9205

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005051
€3.45

RICHTEK RT9205

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BaKon 950D Welding Solder Soldering Iron 220V 50W Internal Heating Type

Bakon BK950D Welding Solder Soldering Iron 220V 50W Internal Heating Type Welding Tool

Buy : * BaKon soldering iron core

Description:

Bakon BK950D Soldering Iron features with trinity digital display and T3 heater. It is great for electronics, computer equipment, watch repair and other craft projects!

Main Features:

? Uses Trinity digital display.

? Split design, easy to replace.

? Handle design, lightweight, prolonged use without fatigue.

? Heater-stream design, reasonable structure, easy to replace.

? Metal handle plug allow you to use more conveniently.

? Imported silicone handles, high temperature materials, soft wire, feel good.

? It does not require specialized knowledge; the general staff can replace its heater.

? Creative iron frame, easier to use.

? With additional cleaning sponge.

Brand: Bakon

Type: Soldering Iron

Model: BK950D

Material: Metal / Silicone

Power: 50W

Special function: Soldering Iron

Voltage (V): 220V

Adjustable Temperature Range: 180 - 450Dgree

Heating Type: Internal Heating

Adjustable Temperature Method: Button Rotation

Color: Black

Package weight: 0.510 kg

Product size (L x W x H): 10.00 x 4.00 x 5.00 cm / 3.94 x 1.57 x 1.97 inches

Package size (L x W x H): 15.00 x 9.00 x 10.00 cm / 5.91 x 3.54 x 3.94 inches

Package Contents:

1 x Bakon BK950D Welding Solder Soldering Iron,

1 x Soldering Iron Handle,

1 x Soldering Iron Stand,

1 x Soldering Iron Sponge,

1 x T13 Heater,

1 x Chinese Manual

CH005052
€22.25

BaKon 950D Welding Solder Soldering Iron 220V/ 50W Internal Heating Type

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ON NCP1203P60 PDIP8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005053
€3.45

ON NCP1203P60 (PDIP8)

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N14PLPA2

N14P-LP-A2

Part Number N14P-LP-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1249

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005054
€75.49

N14P-LP-A2

N2830 SR1W4 Stencil Template

N2830 SR1W4 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005044
€6.22

N2830 SR1W4 Stencil Template

wishlist
Compare

ITE IT8518E HXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005045
€3.45

ITE IT8518E (HXA)

wishlist
Compare

G86741A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005046
€5.40

G86-741-A2 Stencil Template

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GTX1050 N17PGOA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005047
€5.40

GTX1050 N17P-GO-A1 Stencil Template

wishlist
Compare

SMSC LPC47M997NW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005048
€4.45

SMSC LPC47M997-NW

wishlist
Compare

MCP67DA3

MCP67D-A3

Part Number MCP67D-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0818

Package/Case 240 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005050
€31.15

MCP67D-A3

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RICHTEK RT9205

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005051
€3.45

RICHTEK RT9205

wishlist
Compare

BaKon 950D Welding Solder Soldering Iron 220V 50W Internal Heating Type

Bakon BK950D Welding Solder Soldering Iron 220V 50W Internal Heating Type Welding Tool

Buy : * BaKon soldering iron core

Description:

Bakon BK950D Soldering Iron features with trinity digital display and T3 heater. It is great for electronics, computer equipment, watch repair and other craft projects!

Main Features:

? Uses Trinity digital display.

? Split design, easy to replace.

? Handle design, lightweight, prolonged use without fatigue.

? Heater-stream design, reasonable structure, easy to replace.

? Metal handle plug allow you to use more conveniently.

? Imported silicone handles, high temperature materials, soft wire, feel good.

? It does not require specialized knowledge; the general staff can replace its heater.

? Creative iron frame, easier to use.

? With additional cleaning sponge.

Brand: Bakon

Type: Soldering Iron

Model: BK950D

Material: Metal / Silicone

Power: 50W

Special function: Soldering Iron

Voltage (V): 220V

Adjustable Temperature Range: 180 - 450Dgree

Heating Type: Internal Heating

Adjustable Temperature Method: Button Rotation

Color: Black

Package weight: 0.510 kg

Product size (L x W x H): 10.00 x 4.00 x 5.00 cm / 3.94 x 1.57 x 1.97 inches

Package size (L x W x H): 15.00 x 9.00 x 10.00 cm / 5.91 x 3.54 x 3.94 inches

Package Contents:

1 x Bakon BK950D Welding Solder Soldering Iron,

1 x Soldering Iron Handle,

1 x Soldering Iron Stand,

1 x Soldering Iron Sponge,

1 x T13 Heater,

1 x Chinese Manual

CH005052
€22.25

BaKon 950D Welding Solder Soldering Iron 220V/ 50W Internal Heating Type

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Compare

ON NCP1203P60 PDIP8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005053
€3.45

ON NCP1203P60 (PDIP8)

wishlist
Compare

N14PLPA2

N14P-LP-A2

Part Number N14P-LP-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1249

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005054
€75.49

N14P-LP-A2

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