Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Product Description

Package includes: 1PCS X SOIC28-DIP28 (300mil) Socket

SOIC28-DIP28 (300mil) adapter will work on all programmers

Stock: in stock

Condition: NEW

216-0846000

Part Number 216-0846000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N17E-G3-A1 GTX1080

Part Number N17E-G3-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

OBDSTAR X300 DP configuration

Login to Download: * User manual Download

Standard package: Immobilizer+ odometer adjustment+ EEPROM/PIC adapter +OBDII

Full package: Immobilizer+ odometer adjustment+ EEPROM/PIC adapter+ OBDII+ ABS+ TPS+ SRS reset+ TPMS(low tire)reset+ Steering angle reset+ CVT learning/Value reset+ EPB+ Oil/service reset+ Battery matching+ Diagnosis(Japanese and Korean serials)

OBDSTAR X300 DP is the first tablet of OBDSTAR, which has reached a higher level in key programming and diagnosis. Inheriting from OBDSTAR professional auto programming and advanced diagnosing technology, X300 DP is characterized by covering wide range of vehicles, featuring powerful function, and providing superior quality. Meanwhile, taking advantage of Android system, X300 DP integrates more application and service, such as Maintenance Database, remote assistant, and One Key Update etc.

All in one, nothing is impossible!

OBDSTAR X300 DP is a convenient device, combining Android system, immobilizer, diagnose and special function, which closely follows the global trend and greatly meets the demand of users. In addition, abundant and powerful maintenance database and car testing video have realized easier operation and real success. Furthermore, Remote guide strengthens the communication between end users and technicians, without worries about after -sell service.

Android system is equipped with clear and user-friendly interface.

Diagnostic function strengthens professionalism in auto key programming.

Large amount of videos help users to operate it easily.

Maintenance database offers more powerful data.

Remote guide achieves zero distance between users and technicians.

Report center helps mutual improvement of terminal experience and technology.

One key upgrade realizes with one click.

Industrial design ensures that the tool works stably under tough environment, such as high or low temperatures.

Multi-language environment can be applied in different countries and areas

OBDSTAR X300 DP Vehicle Coverage:

BAIC, BENZ, BESTURN, BMW, BRILLIANE, BYD, CHANGAN, CHANGHE, CHERY, CHRYSLER(CHRYSLER/DODGE/JEEP), DFFENGSHEN, DFPV, FAW, FIAT, FORD/LINCOLN, GEELY/HUAPU/SQYL, GM(BUICK/CADILLAC/CHEVROLET/GMC/HUMMER), GREATWALL, HAFEI, HAWTAI, HIMIKO, HNMAZDA, HONDA/ACURA, HONGQI, HYUNDAI, ISUZU, JAC, JAGUAR, KIA, LANDROVER, LIEBAO, LIFAN, LUFENG, LUXGEN, MASERATI, MAZDA, MITSUBISHI, NISSAN/INFINITI, OPEL, PEUGEOT/CITROEN, PORSCHE, PROTON, QQROS, RENAULT, ROEWE/MG, SGMW, SMART, SSANGYONG, SUBARU, SUZUKI, TJFAW, TOYOTA/LEXUS, VW/AUDI/SKODA/SEAT, YOUNGLOTUS, ZZMAZDA, ZZNISSAN, ZOTYE;

Note: There would be some difference to software in different countries. If need more specific information, pls feel free to contact us or our distributors in your area.

OBDSTAR X300 DP Function:

Read and clear fault codes;

Clear key memory;

Program keys, proximity keys, smart key, flip keys;

Program after-market and OEM keys;

Display live data;

Component actuation;

Read keys from immobilizer memory

New ECU programming;

New mechanical key number programming;

Vehicle identification key programming;

Reset ECU& Reset immobilizer;

New remote controller programming;

Immo PINCODE reader;

Mileage adjustment via OBD;

With full and strong database for the most important vehicle makes;

VCI diagnose

One key upgrade via wifi

Remote assistance

Built-in repair video

Report center

EEPROM chip read and immobilizer initialization;

EPB(Electric park brake);

Oil/Service reset;

Battery matching;

ABS

TPS

SRS reset

TPMS(low tire)reset

Steering angle reset

CVT learning/Value reset

EEPROM/PIC adapter

OBDII

Diagnosis

OBDSTAR X300 DP Feature:

1. Powerful Samsung Cortex A9 dual-core processor

2. 7-inch capacitive touch screen(1280*800) & backit and multi-point LED

3. 2G RAM and 16G ROM(memory can be extended)

4. 7000MA lithium-ion battery & 10-hour battery life

5. Unique ergonomic design and tri-proof case with high security

6. Cover all functions of X100,X200,X300PRO and VAG-PRO 7. Add diagnostic function of whole-vehicle system

7. One key upgrading, long-distance diagnosis, more convenient after-sales service.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Honton HT-1212 Heating table constant temperature welding stage

HT 1212 item is used to melt the balls on the chip with ease. After putting the balls on the chip simply place the chip carefully on the plate and it will melt them into place. Has many other uses. Can be used for cleaning chips.

Voltage: 220V/110V

Heating Power: 400W

Temperature Range:25~300C

Temperature Fluctuation: 1

Heating Plate Size: 120x120x15mm

Weight:2.6KG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock