GF-9300-730I-B2

Part Number GF-9300-730I-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0839

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

HP/Compaq Business Notebook DC Power Jack Connector: NC6220, NC6230, NC8000, NW8000, NX5000

Compaq Presario V1000 Series DC Power Jack Connector: V1000 CTO, V1001AD, V1001AP, V1002AD, V1002AP, V1003AD, V1003AP, V1004, V1004AD, V1004AP, V1005AD, V1005AP, V1006AD, V1006AP, V1007AD, V1007AP, V1008AD, V1008AP, V1009AD, V1009AP, V1010AP, V1011AP, V1012AP, V1013AP, V1014AP, V1015AP, V1016AP, V1017AP, V1018AP, V1019AP, V1020AP, V1021AP, V1022AP, V1023AP, V1024AP, V1025AP, V1026AP, V1027AP, V1028AP, V1029AP, V1030AP, V1031AP, V1032AP, V1033AP, V1034AP, V1035AP, V1036AP, V1037AP, V1038AP, V1039AP, V1040AP, V1041AP, V1042AP, V1043xx, V1044AP, V1045AP, V1046AP, V1047AP, V1048AP, V1049AP, V1050AP, V1051AP, V1052AP, V1053AP, V1054AP, V1055AP, V1056AP, V1057AP, V1058AP, V1059AP, V1060AP, V1061AP, V1062AP, V1065AP, V1066AP, V1067AP, V1068AP, V1069AP, V1070AP, V1071AP, V1072AP, V1073AP, V1074AP, V1075AP, V1100 CTO, V1101AP, V1102AP, V1103AP, V1104AP, V1105AP, V1106AP, V1107AP, V1108AP, V1109AP, V1110AP, V1111AP, V1112AP, V1113AP, V1114AP, V1115AP, V1116AP, V1117AP, V1118AP, V1119AP, V1120AP, V1121AP, V1122AP, V1123AP, V1124AP, V1125AP, V1126AP, V1127AP, V1128AP, V1129AP, V1130AP, V1131AP, V1132AP, V1133AP, V1134AP

DH82QM87 QE98ES

Part Number DH82QM87 QE98ES Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Compatible Models: FOR LENOVO G50-70 G50-80 G50-85 G50-90, #VJ-20

Package included

1 x DC Power Jack

N11M-OP1-S-A3 G210M

Part Number N11M-OP1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Dell Latitude DC Power Jack Connector: C-Series, CP, CPi, CPiA, CPiD, CPiR, CPm, CPt, CPtC, CPtS, CPtV, CPx, CPxH, CPxJ, CS, CSR, CSX, C400, C500, C510, C540, C600, C610, C640, C800, C805, C810, C840, C-Dock, C-Port, V700, V710, V740, Xpi 133ST, Xpi 75, Xpi CD, Xpi P100SD, XPi P133

Dell Inspiron DC Power Jack Connector: 1100, 2500, 2600, 2650, 3650, 3700, 3800, 4000, 4100, 4150, 5000, 5000E, 5100, 7500, 8000, 8100, 8200

Dell Precision Workstation DC Power Jack Connector: M40, M50

i5-2467M SR0D6

Part Number SR0D6 i5-2467M Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR2F1 i7-6600U

Part Number SR2F1 i7-6600U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 18+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0774007

Part Number 216-0774007 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GL82B150 SR2C7

Part Number GL82B150 SR2C7 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0772000 HD5650

Part Number 216-0772000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N12M-GS2-S-A1 GT520M

Part Number N12M-GS2-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1510

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock