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Realtek RTL8166EH

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000950
€3.45

Realtek RTL8166EH

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Wiggler HJTAG Parallel download programming debugger ARM9 ARM7 simulator

ARM and FLASH parallel programming and simulation tools

Login to Download: Download software

items list Download

JTAG interface for ARM standard 20PIN, 2.54mm interface

ARM7/ARM9 can be used for H-JTAG software can support the development board

Other chips are tested at the end

The shell color is all white,

Packing list:

WIGGLER host a, 20P line a (about 20CM long)

CH003461
€8.08

Wiggler H-JTAG Parallel download programming debugger ARM9, ARM7 simulator

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CONEXANT CX2054912Z

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000953
€3.45

CONEXANT CX20549-12Z

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Maxim MAX1711EEG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000959
€3.45

Maxim MAX1711EEG

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AUO123G1

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000966
€3.45

AUO-123G1

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ALTERA USB Blaster Download Cable FPGA CLPD NIOS JTAG RevC

Altera USB Blaster Download Cable FPGA CLPD NIOS JTAG-Original Rev.C Hardware

Login to Download: Download software

* 100% same as Original Altera USB Blaster Hardware Design! * Much faster & reliable than cheap low-end USB Blaster

Q: Why is this Altera programmer more expensive than those cheaper Altera programmers?

A: This Altera USB blaster is designed based on 100% original Altera USB blaster hardware soltion: FTDI's FT245+ Altera's EPM CPLD chip solution. Unlike those cheap CY hardware solution USB Blaster. The original design uses FDTI+CPLD soltuion, which is the most reliable and fast design.

Q: Is the original hardware design solution better?

A: Yes, absolutely. The original Altera USB Blaster's hardware design is much stable and faster when programming the Altera CLPD/FPGA chips. It's designed to last, providing professional download speed and stable performance.

Q: How do I distinguish the original hardare solution USB Blaster from the cheaper ones?

A: Size & price. Orginal hardware platform uses FTDI's FT245+ Altera's EPM CPLD solution, which means definitely PCB bigger size. For those so-called "Mini" type USB Blaster, they're 100% cheap low-end programmer, which can get really hot on its surface when running. For the price, even the single FTDI chip's cost is much higher than the complete low-end altera programmer set.

100% same hardware platform designed from original Altera USB Blaster. Using FTDI's FT245+Altera EPM CPLD chip soltuion, the most reliable & fast solution as Altera USB Blaster download cable.

Directly uses original Altera USB Driver.

Supported OS: Windows 8, Windows 7, Windows Vista, Windows XP & 2000

Provide much more stable & fast programming speed for your Altera system design work.

Support JTAG I/O voltage between 1.5V-5V

Support SignalTapII Embedded Logic Analyzer function

Support ALL Altera series components , including all CPLD and FPGA devices.

Key Features:

Supported target voltage : 1.5V-5V

Support all ALTERA deveice.

CPLD:MAX 3000A?MAX 7000A?MAX 7000B?MAX 7000S?MAX 9000?MAX 9000A and MAX II.

FPGA:Stratix? Stratix II?Stratix GX?Cyclone?Cyclone II?Cyclone III?ACEX 1K?APEX II?APEX 20K?APEX 20KE?APEX 20KC?FLEX 10K?FLEX 10KE?FLEX 10KA?FLEX 6000?FLEX 8000?EPCS1?EPCS4?EPCS16?EPCS64EPC1?EPC4?EPC8?EPC16

Support JTAG,AS, PS mode:

Under JTAG mode:Cyclone?Cyclone II?Cyclone III?Stratix?Stratix II?ACEX 1K?APEX II?APEX 20K?APEX 20KE?APEX 20KC?FLEX 10K?FLEX 10KE?FLEX 10KA?FLEX 6000,FLEX 8000?MAX 3000A?MAX 7000A?MAX 7000B?MAX 7000S?MAX 9000?MAX 9000A and MAX II.

AS mode:EPCS1?EPCS4?EPCS16?EPCS64

PS mode:Stratix?Stratix II?Stratix GX.

Support NiosII embeded core based debug,with this debugger, there will be no warning windows poped up duringthe NiosII debug.

High performance, 10 times faster than ByteBlasterII !!

Driver Install Process:

1> Connect the device, and manually set the driver location to your Quartus install path, for example: C:\altera\quartus\drivers\usb-blaster

2> Run Quartus, and select the USB Blaster at Tools > Programmers, select the USB Blaster from HardwareSetup panel.

Package Included:

1 x Altera USB Blaster programmer (original hardware design solution)

1 x 10-Pin Flex cable

1 x USB Cable

CH003474
€17.28

ALTERA USB Blaster Download Cable FPGA CLPD NIOS JTAG Rev.C

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MARVELL 88W8686

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000968
€3.97

MARVELL 88W8686

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Intersil ISL6256AHRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000969
€3.45

Intersil ISL6256AHRZ

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ATMEL AT24C64

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000970
€3.45

ATMEL AT24C64

Realtek RTL8166EH

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000950
€3.45

Realtek RTL8166EH

wishlist
Compare

Wiggler HJTAG Parallel download programming debugger ARM9 ARM7 simulator

ARM and FLASH parallel programming and simulation tools

Login to Download: Download software

items list Download

JTAG interface for ARM standard 20PIN, 2.54mm interface

ARM7/ARM9 can be used for H-JTAG software can support the development board

Other chips are tested at the end

The shell color is all white,

Packing list:

WIGGLER host a, 20P line a (about 20CM long)

CH003461
€8.08

Wiggler H-JTAG Parallel download programming debugger ARM9, ARM7 simulator

wishlist
Compare

CONEXANT CX2054912Z

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000953
€3.45

CONEXANT CX20549-12Z

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Maxim MAX1711EEG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000959
€3.45

Maxim MAX1711EEG

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AUO123G1

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000966
€3.45

AUO-123G1

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Compare

ALTERA USB Blaster Download Cable FPGA CLPD NIOS JTAG RevC

Altera USB Blaster Download Cable FPGA CLPD NIOS JTAG-Original Rev.C Hardware

Login to Download: Download software

* 100% same as Original Altera USB Blaster Hardware Design! * Much faster & reliable than cheap low-end USB Blaster

Q: Why is this Altera programmer more expensive than those cheaper Altera programmers?

A: This Altera USB blaster is designed based on 100% original Altera USB blaster hardware soltion: FTDI's FT245+ Altera's EPM CPLD chip solution. Unlike those cheap CY hardware solution USB Blaster. The original design uses FDTI+CPLD soltuion, which is the most reliable and fast design.

Q: Is the original hardware design solution better?

A: Yes, absolutely. The original Altera USB Blaster's hardware design is much stable and faster when programming the Altera CLPD/FPGA chips. It's designed to last, providing professional download speed and stable performance.

Q: How do I distinguish the original hardare solution USB Blaster from the cheaper ones?

A: Size & price. Orginal hardware platform uses FTDI's FT245+ Altera's EPM CPLD solution, which means definitely PCB bigger size. For those so-called "Mini" type USB Blaster, they're 100% cheap low-end programmer, which can get really hot on its surface when running. For the price, even the single FTDI chip's cost is much higher than the complete low-end altera programmer set.

100% same hardware platform designed from original Altera USB Blaster. Using FTDI's FT245+Altera EPM CPLD chip soltuion, the most reliable & fast solution as Altera USB Blaster download cable.

Directly uses original Altera USB Driver.

Supported OS: Windows 8, Windows 7, Windows Vista, Windows XP & 2000

Provide much more stable & fast programming speed for your Altera system design work.

Support JTAG I/O voltage between 1.5V-5V

Support SignalTapII Embedded Logic Analyzer function

Support ALL Altera series components , including all CPLD and FPGA devices.

Key Features:

Supported target voltage : 1.5V-5V

Support all ALTERA deveice.

CPLD:MAX 3000A?MAX 7000A?MAX 7000B?MAX 7000S?MAX 9000?MAX 9000A and MAX II.

FPGA:Stratix? Stratix II?Stratix GX?Cyclone?Cyclone II?Cyclone III?ACEX 1K?APEX II?APEX 20K?APEX 20KE?APEX 20KC?FLEX 10K?FLEX 10KE?FLEX 10KA?FLEX 6000?FLEX 8000?EPCS1?EPCS4?EPCS16?EPCS64EPC1?EPC4?EPC8?EPC16

Support JTAG,AS, PS mode:

Under JTAG mode:Cyclone?Cyclone II?Cyclone III?Stratix?Stratix II?ACEX 1K?APEX II?APEX 20K?APEX 20KE?APEX 20KC?FLEX 10K?FLEX 10KE?FLEX 10KA?FLEX 6000,FLEX 8000?MAX 3000A?MAX 7000A?MAX 7000B?MAX 7000S?MAX 9000?MAX 9000A and MAX II.

AS mode:EPCS1?EPCS4?EPCS16?EPCS64

PS mode:Stratix?Stratix II?Stratix GX.

Support NiosII embeded core based debug,with this debugger, there will be no warning windows poped up duringthe NiosII debug.

High performance, 10 times faster than ByteBlasterII !!

Driver Install Process:

1> Connect the device, and manually set the driver location to your Quartus install path, for example: C:\altera\quartus\drivers\usb-blaster

2> Run Quartus, and select the USB Blaster at Tools > Programmers, select the USB Blaster from HardwareSetup panel.

Package Included:

1 x Altera USB Blaster programmer (original hardware design solution)

1 x 10-Pin Flex cable

1 x USB Cable

CH003474
€17.28

ALTERA USB Blaster Download Cable FPGA CLPD NIOS JTAG Rev.C

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MARVELL 88W8686

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000968
€3.97

MARVELL 88W8686

wishlist
Compare

Intersil ISL6256AHRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000969
€3.45

Intersil ISL6256AHRZ

wishlist
Compare

ATMEL AT24C64

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000970
€3.45

ATMEL AT24C64

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